ATE543602T1 - Verfahren zur herstellung eines halbleiter-wafers - Google Patents

Verfahren zur herstellung eines halbleiter-wafers

Info

Publication number
ATE543602T1
ATE543602T1 AT09159575T AT09159575T ATE543602T1 AT E543602 T1 ATE543602 T1 AT E543602T1 AT 09159575 T AT09159575 T AT 09159575T AT 09159575 T AT09159575 T AT 09159575T AT E543602 T1 ATE543602 T1 AT E543602T1
Authority
AT
Austria
Prior art keywords
semiconductor wafer
producing
given depth
depth position
irradiating
Prior art date
Application number
AT09159575T
Other languages
English (en)
Inventor
Kazunari Kurita
Original Assignee
Sumco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumco Corp filed Critical Sumco Corp
Application granted granted Critical
Publication of ATE543602T1 publication Critical patent/ATE543602T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
    • H10P34/42—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P36/00—Gettering within semiconductor bodies
    • H10P36/20—Intrinsic gettering, i.e. thermally inducing defects by using oxygen present in the silicon body
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AT09159575T 2008-05-07 2009-05-06 Verfahren zur herstellung eines halbleiter-wafers ATE543602T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008121602A JP5365063B2 (ja) 2008-05-07 2008-05-07 シリコンウェーハの製造方法

Publications (1)

Publication Number Publication Date
ATE543602T1 true ATE543602T1 (de) 2012-02-15

Family

ID=40954662

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09159575T ATE543602T1 (de) 2008-05-07 2009-05-06 Verfahren zur herstellung eines halbleiter-wafers

Country Status (6)

Country Link
US (1) US8124501B2 (de)
EP (1) EP2116323B1 (de)
JP (1) JP5365063B2 (de)
KR (1) KR101210980B1 (de)
AT (1) ATE543602T1 (de)
TW (1) TWI398911B (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101244352B1 (ko) * 2010-01-29 2013-03-18 가부시키가이샤 사무코 실리콘 웨이퍼, 에피택셜 웨이퍼 및 고체촬상소자의 제조방법, 그리고 실리콘 웨이퍼의 제조장치
JP5600948B2 (ja) * 2010-01-29 2014-10-08 株式会社Ｓｕｍｃｏ シリコンウェーハ及びエピタキシャルウェーハの製造方法
KR100984723B1 (ko) * 2010-04-16 2010-10-01 유병소 레이저 가공방법
JP5510256B2 (ja) * 2010-10-06 2014-06-04 株式会社Ｓｕｍｃｏ シリコンウェーハの製造方法
WO2012063342A1 (ja) * 2010-11-10 2012-05-18 トヨタ自動車株式会社 半導体装置の製造方法
WO2012070490A1 (ja) * 2010-11-24 2012-05-31 株式会社フジクラ 微細孔の製造方法および微細孔を有する基体
DE102011100175B4 (de) * 2011-05-02 2021-12-23 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Laserlichtquelle mit einer Stegwellenleiterstruktur und einer Modenfilterstruktur
JP2014053351A (ja) * 2012-09-05 2014-03-20 Disco Abrasive Syst Ltd ウエーハの加工方法
WO2015023984A1 (en) * 2013-08-16 2015-02-19 Electro Scientific Industries, Inc. Laser systems and methods for internally marking thin layers, and articles produced thereby
JP6925902B2 (ja) 2017-07-28 2021-08-25 浜松ホトニクス株式会社 積層型素子の製造方法
DE102021203609A1 (de) * 2021-04-13 2022-10-13 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Behandlung wenigstens einer Schicht oder eines Bereichs eines Bauteils und Vorrichtung zum Durchführen des Verfahrens
US12564068B2 (en) * 2022-10-06 2026-02-24 Thinsic Inc. Carbon assisted semiconductor dicing and method

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5844726A (ja) * 1981-09-11 1983-03-15 Nippon Telegr & Teleph Corp <Ntt> ゲッタリング方法
JPS5950531A (ja) * 1982-09-16 1984-03-23 Toshiba Corp 半導体装置及びその製造方法
JP2575545B2 (ja) * 1990-07-05 1997-01-29 株式会社東芝 半導体装置の製造方法
US6639177B2 (en) * 2001-03-29 2003-10-28 Gsi Lumonics Corporation Method and system for processing one or more microstructures of a multi-material device
JP4298953B2 (ja) * 2002-03-11 2009-07-22 浜松ホトニクス株式会社 レーザゲッタリング方法
JP3761566B2 (ja) * 2002-03-12 2006-03-29 浜松ホトニクス株式会社 半導体チップの製造方法
EP1537938A3 (de) 2003-12-02 2009-02-18 Semiconductor Energy Laboratory Co., Ltd. Laserbestrahlungsvorrichtung, Laserbestrahlungsverfahren und Verfahren zur Herstellung eines Halbleiterbauelements
US20050237895A1 (en) 2004-04-23 2005-10-27 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus and method for manufacturing semiconductor device
US7550367B2 (en) * 2004-08-17 2009-06-23 Denso Corporation Method for separating semiconductor substrate
US7732349B2 (en) * 2004-11-30 2010-06-08 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of insulating film and semiconductor device
KR100858983B1 (ko) * 2005-11-16 2008-09-17 가부시키가이샤 덴소 반도체 장치 및 반도체 기판 다이싱 방법
JP4816390B2 (ja) * 2005-11-16 2011-11-16 株式会社デンソー 半導体チップの製造方法および半導体チップ
JP2007220825A (ja) * 2006-02-15 2007-08-30 Sumco Corp シリコンウェーハの製造方法
JP4322881B2 (ja) 2006-03-14 2009-09-02 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP2008108792A (ja) * 2006-10-23 2008-05-08 Disco Abrasive Syst Ltd ウエーハの加工方法

Also Published As

Publication number Publication date
TWI398911B (zh) 2013-06-11
KR20090116647A (ko) 2009-11-11
EP2116323A1 (de) 2009-11-11
KR101210980B1 (ko) 2012-12-11
US8124501B2 (en) 2012-02-28
JP5365063B2 (ja) 2013-12-11
TW201007822A (en) 2010-02-16
JP2009272440A (ja) 2009-11-19
US20090280623A1 (en) 2009-11-12
EP2116323B1 (de) 2012-02-01

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