ATE556441T1 - Verfahren zur herstellung eines glasgefässes - Google Patents

Verfahren zur herstellung eines glasgefässes

Info

Publication number
ATE556441T1
ATE556441T1 AT06838743T AT06838743T ATE556441T1 AT E556441 T1 ATE556441 T1 AT E556441T1 AT 06838743 T AT06838743 T AT 06838743T AT 06838743 T AT06838743 T AT 06838743T AT E556441 T1 ATE556441 T1 AT E556441T1
Authority
AT
Austria
Prior art keywords
intensity distribution
frit
elongated
decreases
distance
Prior art date
Application number
AT06838743T
Other languages
English (en)
Inventor
Keith J Becken
Stephan L Logunov
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Application granted granted Critical
Publication of ATE556441T1 publication Critical patent/ATE556441T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Glass Compositions (AREA)
AT06838743T 2005-12-06 2006-12-01 Verfahren zur herstellung eines glasgefässes ATE556441T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US74829705P 2005-12-06 2005-12-06
US11/599,738 US7537504B2 (en) 2005-12-06 2006-11-15 Method of encapsulating a display element with frit wall and laser beam
PCT/US2006/045936 WO2007067420A2 (en) 2005-12-06 2006-12-01 Method of making a glass envelope

Publications (1)

Publication Number Publication Date
ATE556441T1 true ATE556441T1 (de) 2012-05-15

Family

ID=38119403

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06838743T ATE556441T1 (de) 2005-12-06 2006-12-01 Verfahren zur herstellung eines glasgefässes

Country Status (8)

Country Link
US (1) US7537504B2 (de)
EP (1) EP1958228B1 (de)
JP (1) JP4601673B2 (de)
KR (1) KR100881795B1 (de)
CN (1) CN101536133B (de)
AT (1) ATE556441T1 (de)
TW (1) TWI344315B (de)
WO (1) WO2007067420A2 (de)

Families Citing this family (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE506686T1 (de) * 2005-12-06 2011-05-15 Corning Inc Herstellungsverfahren für eine luftdicht versiegelte glasverpackung
US8038495B2 (en) * 2006-01-20 2011-10-18 Samsung Mobile Display Co., Ltd. Organic light-emitting display device and manufacturing method of the same
KR100673765B1 (ko) * 2006-01-20 2007-01-24 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
KR100635514B1 (ko) * 2006-01-23 2006-10-18 삼성에스디아이 주식회사 유기전계발광표시장치 및 그 제조방법
JP4456092B2 (ja) * 2006-01-24 2010-04-28 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
JP4624309B2 (ja) * 2006-01-24 2011-02-02 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
KR100688795B1 (ko) * 2006-01-25 2007-03-02 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
KR100685853B1 (ko) * 2006-01-25 2007-02-22 삼성에스디아이 주식회사 유기전계발광표시장치 및 그 제조방법
US8164257B2 (en) * 2006-01-25 2012-04-24 Samsung Mobile Display Co., Ltd. Organic light emitting display and method of fabricating the same
KR100671641B1 (ko) * 2006-01-25 2007-01-19 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
KR100688796B1 (ko) * 2006-01-25 2007-03-02 삼성에스디아이 주식회사 유기전계발광 표시 장치 및 그의 제작 방법
KR100732808B1 (ko) * 2006-01-26 2007-06-27 삼성에스디아이 주식회사 유기전계발광 표시장치의 제조방법
JP4633674B2 (ja) 2006-01-26 2011-02-16 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
KR100671647B1 (ko) * 2006-01-26 2007-01-19 삼성에스디아이 주식회사 유기전계발광 표시 장치
KR100703472B1 (ko) * 2006-01-26 2007-04-03 삼성에스디아이 주식회사 프릿 경화 장치 및 이를 이용한 경화 방법
KR100688790B1 (ko) * 2006-01-27 2007-03-02 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
KR100671639B1 (ko) * 2006-01-27 2007-01-19 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
KR100732817B1 (ko) 2006-03-29 2007-06-27 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
US20080213482A1 (en) * 2007-03-01 2008-09-04 Stephan Lvovich Logunov Method of making a mask for sealing a glass package
KR100883072B1 (ko) * 2007-07-12 2009-02-10 엘지전자 주식회사 표시장치
US20090023235A1 (en) * 2007-07-19 2009-01-22 Mackenzie John D Method and Apparatus for Improved Printed Cathodes for Light-Emitting Devices
US20090246896A1 (en) * 2007-07-19 2009-10-01 Melissa Kreger Method and apparatus for improved printed cathodes for organic electronic devices
US8247730B2 (en) * 2007-09-28 2012-08-21 Corning Incorporated Method and apparatus for frit sealing with a variable laser beam
KR101374015B1 (ko) * 2007-11-06 2014-03-14 엘지디스플레이 주식회사 합착 장치 및 이를 사용한 유기발광표시장치의 제조 방법
US8025975B2 (en) * 2007-11-20 2011-09-27 Corning Incorporated Frit-containing pastes for producing sintered frit patterns on glass sheets
US7815480B2 (en) * 2007-11-30 2010-10-19 Corning Incorporated Methods and apparatus for packaging electronic components
US8198807B2 (en) * 2008-02-28 2012-06-12 Corning Incorporated Hermetically-sealed packages for electronic components having reduced unused areas
TWI394732B (zh) * 2008-02-28 2013-05-01 康寧公司 密封玻璃包封之方法
JP5224102B2 (ja) * 2008-03-26 2013-07-03 日本電気硝子株式会社 有機elディスプレイ用封着材料
JP5308718B2 (ja) * 2008-05-26 2013-10-09 浜松ホトニクス株式会社 ガラス溶着方法
JP5308717B2 (ja) * 2008-05-26 2013-10-09 浜松ホトニクス株式会社 ガラス溶着方法
US20090295277A1 (en) * 2008-05-28 2009-12-03 Stephan Lvovich Logunov Glass packages and methods of controlling laser beam characteristics for sealing them
JP5535654B2 (ja) * 2008-06-11 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法
US8448468B2 (en) 2008-06-11 2013-05-28 Corning Incorporated Mask and method for sealing a glass envelope
US10322469B2 (en) * 2008-06-11 2019-06-18 Hamamatsu Photonics K.K. Fusion bonding process for glass
WO2009157282A1 (ja) * 2008-06-23 2009-12-30 浜松ホトニクス株式会社 ガラス溶着方法
KR101453878B1 (ko) * 2008-08-07 2014-10-23 삼성디스플레이 주식회사 평판 표시장치의 제조방법
US8245536B2 (en) * 2008-11-24 2012-08-21 Corning Incorporated Laser assisted frit sealing of high CTE glasses and the resulting sealed glass package
EP2351717A4 (de) * 2008-11-26 2012-04-25 Asahi Glass Co Ltd Glaselement mit einer schicht aus einem abdichtungs-/bindungsmaterial, elektronische vorrichtung damit sowie verfahren zu seiner herstellung
KR101117715B1 (ko) * 2009-04-30 2012-02-24 삼성모바일디스플레이주식회사 레이저 조사 장치 및 상기 레이저 조사 장치를 이용한 평판 디스플레이 장치의 제조 방법
KR101065417B1 (ko) * 2009-05-20 2011-09-16 삼성모바일디스플레이주식회사 광 조사 장치 및 이를 이용한 유기 전계 발광 표시장치의 제조 방법
US8440479B2 (en) * 2009-05-28 2013-05-14 Corning Incorporated Method for forming an organic light emitting diode device
JP5481167B2 (ja) * 2009-11-12 2014-04-23 浜松ホトニクス株式会社 ガラス溶着方法
KR101094281B1 (ko) 2009-11-24 2011-12-19 삼성모바일디스플레이주식회사 표시 장치 및 표시 장치의 제조 방법
JP5481172B2 (ja) 2009-11-25 2014-04-23 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5567319B2 (ja) 2009-11-25 2014-08-06 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5481173B2 (ja) * 2009-11-25 2014-04-23 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5535590B2 (ja) 2009-11-25 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5466929B2 (ja) * 2009-11-25 2014-04-09 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5535588B2 (ja) 2009-11-25 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5525246B2 (ja) 2009-11-25 2014-06-18 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
JP5535589B2 (ja) * 2009-11-25 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法及びガラス層定着方法
WO2011067700A1 (en) * 2009-12-02 2011-06-09 Koninklijke Philips Electronics N.V. Substrate connection by heat activated binder
KR101243920B1 (ko) * 2010-01-07 2013-03-14 삼성디스플레이 주식회사 기판 밀봉에 사용되는 레이저 빔 조사 장치, 기판 밀봉 방법, 및 유기 발광 디스플레이 장치의 제조 방법
KR101097327B1 (ko) * 2010-01-07 2011-12-23 삼성모바일디스플레이주식회사 기판 밀봉에 사용되는 레이저 빔 조사 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101097328B1 (ko) * 2010-01-07 2011-12-23 삼성모바일디스플레이주식회사 기판 밀봉에 사용되는 레이저 빔 조사 장치, 기판 밀봉 방법, 및 유기 발광 디스플레이 장치의 제조 방법
KR101117732B1 (ko) * 2010-01-19 2012-02-24 삼성모바일디스플레이주식회사 기판 밀봉에 사용되는 레이저 빔 조사 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR101097340B1 (ko) * 2010-03-08 2011-12-23 삼성모바일디스플레이주식회사 표시 장치
JP5659511B2 (ja) 2010-03-11 2015-01-28 住友化学株式会社 電気装置
JP5535767B2 (ja) * 2010-05-28 2014-07-02 浜松ホトニクス株式会社 ガラス溶着方法
KR101798487B1 (ko) 2010-06-01 2017-11-17 삼성디스플레이 주식회사 표시 장치
KR101137394B1 (ko) 2010-07-05 2012-04-20 삼성모바일디스플레이주식회사 레이저 빔 조사 장치 및 상기 레이저 빔 조사 장치를 포함하는 기판 밀봉 장치
KR101201720B1 (ko) 2010-07-29 2012-11-15 삼성디스플레이 주식회사 표시 장치 및 유기 발광 표시 장치
KR20120028418A (ko) 2010-09-14 2012-03-23 삼성모바일디스플레이주식회사 유기 발광 표시 장치용 밀봉기판의 제조 방법 및 유기 발광 표시 장치용 밀봉기판
KR101797715B1 (ko) 2010-10-19 2017-11-16 삼성디스플레이 주식회사 표시 장치 및 유기 발광 표시 장치
KR20120044020A (ko) 2010-10-27 2012-05-07 삼성모바일디스플레이주식회사 유기 발광 표시 장치 및 그 제조 방법
KR20120044654A (ko) 2010-10-28 2012-05-08 삼성모바일디스플레이주식회사 표시 장치, 표시 장치의 제조 방법, 및 유기 발광 표시 장치
KR101804554B1 (ko) 2010-11-01 2017-12-05 삼성디스플레이 주식회사 표시 장치 및 유기 발광 표시 장치
KR101757810B1 (ko) 2010-11-19 2017-07-17 삼성디스플레이 주식회사 표시 장치, 유기 발광 표시 장치, 및 밀봉 기판의 제조 방법
WO2012077718A1 (ja) * 2010-12-08 2012-06-14 浜松ホトニクス株式会社 ガラス溶着装置及びガラス溶着方法
KR20120066352A (ko) 2010-12-14 2012-06-22 삼성모바일디스플레이주식회사 유기 발광 표시 장치 및 이의 제조 방법
DE102010063511A1 (de) * 2010-12-20 2012-06-21 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines optoelektrischen Bauelements und optoelektronisches Bauelement
KR101830300B1 (ko) 2010-12-30 2018-03-30 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
TW201238387A (en) * 2011-01-06 2012-09-16 Asahi Glass Co Ltd Method and device for manufacturing glass members with sealing material layer, and method for manufacturing electronic devices
KR101813906B1 (ko) 2011-03-15 2018-01-03 삼성디스플레이 주식회사 디스플레이 패널
US8917459B2 (en) 2011-05-23 2014-12-23 Eric A. Klein Ergonomic vertical vision redirection
JP2013101923A (ja) * 2011-10-21 2013-05-23 Semiconductor Energy Lab Co Ltd 分散組成物の加熱方法、及びガラスパターンの形成方法
JP5895689B2 (ja) * 2012-04-27 2016-03-30 コニカミノルタ株式会社 電子デバイスおよびその製造方法
KR102015401B1 (ko) * 2012-12-21 2019-08-29 삼성디스플레이 주식회사 광학계 및 기판 밀봉 방법
KR20140118554A (ko) * 2013-03-29 2014-10-08 삼성디스플레이 주식회사 광학계 및 기판 밀봉 방법
TWI479464B (zh) * 2013-05-09 2015-04-01 Au Optronics Corp 顯示面板及其封裝方法
CN103464900B (zh) * 2013-08-09 2015-12-23 上海大学 激光密封方法和系统
KR102283856B1 (ko) 2013-11-22 2021-08-03 삼성디스플레이 주식회사 유기 발광 표시장치 및 그의 제조방법
TWI561904B (en) 2014-01-17 2016-12-11 Au Optronics Corp Substrate packaging structure and packaging method thereof
CN104795511A (zh) * 2014-01-20 2015-07-22 上海微电子装备有限公司 一种激光封装设备及其封装方法
TWI574442B (zh) * 2014-04-10 2017-03-11 友達光電股份有限公司 顯示面板
CN105336877B (zh) * 2014-07-29 2018-01-26 上海微电子装备(集团)股份有限公司 激光扫描密封玻璃封装体的系统和方法
CN104157792A (zh) * 2014-08-08 2014-11-19 上海和辉光电有限公司 Oled封装结构及封装方法
CN104716275A (zh) * 2015-03-20 2015-06-17 京东方科技集团股份有限公司 电子器件的封装方法和封装系统
CN104846331B (zh) * 2015-05-28 2018-03-23 京东方科技集团股份有限公司 一种应用于激光照射的掩膜板及激光封装方法
CN105739154B (zh) * 2016-04-29 2019-09-27 上海天马有机发光显示技术有限公司 一种显示面板以及电子设备
DE102016110868A1 (de) * 2016-06-14 2017-12-14 Leander Kilian Gross Verfahren und Vorrichtung zur Verkapselung von Bauteilen
PL3475240T3 (pl) * 2016-06-25 2021-06-14 Efacec Engenharia E Sistemas, S.A. Sposób hermetyzacji wspomaganej laserem oraz jej produkt
KR102627073B1 (ko) * 2016-11-30 2024-01-19 삼성디스플레이 주식회사 백라이트 유닛, 표시 장치 및 표시 장치의 제조 방법
CN106935731B (zh) * 2017-05-15 2020-03-06 京东方科技集团股份有限公司 有机电致发光显示器件和显示装置
CN107742675B (zh) * 2017-09-11 2019-05-24 上海天马有机发光显示技术有限公司 显示面板及其封装方法
GB201806411D0 (en) 2018-04-19 2018-06-06 Johnson Matthey Plc Kit, particle mixture, paste and methods
CN109671865B (zh) * 2018-12-21 2022-02-01 厦门天马微电子有限公司 显示面板及显示装置
CN111627800B (zh) * 2020-05-11 2023-10-24 天津大学 一种原子级表面及结构超短脉冲光高效加工方法

Family Cites Families (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3414465A (en) * 1965-06-21 1968-12-03 Owens Illinois Inc Sealed glass article of manufacture
US3778126A (en) * 1971-12-30 1973-12-11 Ibm Gas display panel without exhaust tube structure
JPS526097B2 (de) * 1972-03-14 1977-02-18
US4400870A (en) * 1980-10-06 1983-08-30 Texas Instruments Incorporated Method of hermetically encapsulating a semiconductor device by laser irradiation
JPS58211743A (ja) 1982-06-03 1983-12-09 Sanyo Electric Co Ltd エレクトロクロミツク表示装置の製造方法
GB9126370D0 (en) 1991-12-12 1992-02-12 Shanning Laser Systems Ltd Securing of bodies
US5500917A (en) * 1994-04-18 1996-03-19 Gould Electronics Inc. Optical assembly/housing for securing optical fiber components, devices and fibers to the same or to mounting fixtures
SI9400276A (en) * 1994-07-06 1996-02-29 Emil Mlakar Method for constructing, manufacturing and remaking of widened vehicles
JP2754461B2 (ja) * 1994-07-08 1998-05-20 双葉電子工業株式会社 容器の封着方法および封着装置
US5489321A (en) * 1994-07-14 1996-02-06 Midwest Research Institute Welding/sealing glass-enclosed space in a vacuum
JPH1074583A (ja) 1996-08-30 1998-03-17 Sanyo Electric Co Ltd 有機elディスプレイ及び有機elディスプレイの 製造方法
US5821692A (en) * 1996-11-26 1998-10-13 Motorola, Inc. Organic electroluminescent device hermetic encapsulation package
US6109994A (en) * 1996-12-12 2000-08-29 Candescent Technologies Corporation Gap jumping to seal structure, typically using combination of vacuum and non-vacuum environments
US5874804A (en) * 1997-03-03 1999-02-23 Motorola, Inc. Organic electroluminescent device hermetic encapsulation package and method of fabrication
US6356376B1 (en) * 1997-04-02 2002-03-12 Gentex Corporation Electrochromic rearview mirror incorporating a third surface metal reflector and a display/signal light
US5872355A (en) * 1997-04-09 1999-02-16 Hewlett-Packard Company Electroluminescent device and fabrication method for a light detection system
US6069443A (en) * 1997-06-23 2000-05-30 Fed Corporation Passive matrix OLED display
US6129603A (en) * 1997-06-24 2000-10-10 Candescent Technologies Corporation Low temperature glass frit sealing for thin computer displays
CA2304699A1 (en) * 1997-10-01 1999-04-08 Anthony John Cooper Visual display
US5998805A (en) * 1997-12-11 1999-12-07 Motorola, Inc. Active matrix OED array with improved OED cathode
US6370019B1 (en) * 1998-02-17 2002-04-09 Sarnoff Corporation Sealing of large area display structures
US6137221A (en) * 1998-07-08 2000-10-24 Agilent Technologies, Inc. Organic electroluminescent device with full color characteristics
US6146225A (en) * 1998-07-30 2000-11-14 Agilent Technologies, Inc. Transparent, flexible permeability barrier for organic electroluminescent devices
EP1145338B1 (de) * 1998-12-16 2012-12-05 Samsung Display Co., Ltd. Umwelt-sperrmaterial für organische elektrolumineszente vorrichtung und herstellungsverfahren
US6268695B1 (en) * 1998-12-16 2001-07-31 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
DE19918672A1 (de) * 1999-04-23 2000-10-26 Inst Angewandte Photovoltaik G Verfahren zum Verschweißen von Oberflächen von Materialien
WO2001028952A1 (en) * 1999-10-22 2001-04-26 Nippon Sheet Glass Co., Ltd. Glass panel and production method therefor
JP2001155855A (ja) * 1999-11-24 2001-06-08 Toyota Motor Corp 有機el素子の封止方法
WO2002021557A1 (en) 2000-09-06 2002-03-14 Osram Opto Semiconductors Gmbh Encapsulation for oled devices
EP1242849B1 (de) 1999-12-17 2007-02-21 Osram Opto Semiconductors GmbH Verbesserte kapselung organischer led-vorrichtungen
US6608283B2 (en) * 2000-02-08 2003-08-19 Emagin Corporation Apparatus and method for solder-sealing an active matrix organic light emitting diode
US6226890B1 (en) * 2000-04-07 2001-05-08 Eastman Kodak Company Desiccation of moisture-sensitive electronic devices
US6465953B1 (en) * 2000-06-12 2002-10-15 General Electric Company Plastic substrates with improved barrier properties for devices sensitive to water and/or oxygen, such as organic electroluminescent devices
US6867539B1 (en) 2000-07-12 2005-03-15 3M Innovative Properties Company Encapsulated organic electronic devices and method for making same
US6639360B2 (en) * 2001-01-31 2003-10-28 Gentex Corporation High power radiation emitter device and heat dissipating package for electronic components
KR20040002956A (ko) 2001-05-24 2004-01-07 오리온전기 주식회사 유기전계발광소자의 인캡슐레이션 용기 및 그 제조방법
US6565400B1 (en) * 2001-06-26 2003-05-20 Candescent Technologies Corporation Frit protection in sealing process for flat panel displays
US6470594B1 (en) 2001-09-21 2002-10-29 Eastman Kodak Company Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps
TW517356B (en) * 2001-10-09 2003-01-11 Delta Optoelectronics Inc Package structure of display device and its packaging method
JP2003229548A (ja) * 2001-11-30 2003-08-15 Semiconductor Energy Lab Co Ltd 乗物、表示装置、および半導体装置の作製方法
JP3975739B2 (ja) 2001-12-14 2007-09-12 旭硝子株式会社 有機elディスプレイ用対向基板の製造方法および有機elディスプレイの製造方法
DE10219951A1 (de) * 2002-05-03 2003-11-13 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Verfahren zur Verkapselung eines Bauelements auf Basis organischer Halbleiter
JP2004182567A (ja) * 2002-12-05 2004-07-02 Nippon Sheet Glass Co Ltd 真空ガラスパネルの製造方法、及び該製造方法により製造された真空ガラスパネル
US6998776B2 (en) * 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
US20040206953A1 (en) 2003-04-16 2004-10-21 Robert Morena Hermetically sealed glass package and method of fabrication
US7344901B2 (en) 2003-04-16 2008-03-18 Corning Incorporated Hermetically sealed package and method of fabricating of a hermetically sealed package
JP2005251407A (ja) * 2004-03-01 2005-09-15 Sanyo Electric Co Ltd 表示パネルの製造方法および表示パネル
DE102004044196B4 (de) * 2004-09-14 2019-03-07 Bruker Daltonik Gmbh Massenspektrometer mit einem Lasersystem für die Ionisation einer Probe durch matrixunterstützte Laserdesorption in der massenspektrometrischen Analyse
US7371143B2 (en) * 2004-10-20 2008-05-13 Corning Incorporated Optimization of parameters for sealing organic emitting light diode (OLED) displays
KR100685845B1 (ko) * 2005-10-21 2007-02-22 삼성에스디아이 주식회사 유기전계 발광표시장치 및 그 제조방법
US20070096631A1 (en) * 2005-11-01 2007-05-03 Un-Cheol Sung Flat panel display and fabricating method thereof
US7431628B2 (en) * 2005-11-18 2008-10-07 Samsung Sdi Co., Ltd. Method of manufacturing flat panel display device, flat panel display device, and panel of flat panel display device
US8038495B2 (en) * 2006-01-20 2011-10-18 Samsung Mobile Display Co., Ltd. Organic light-emitting display device and manufacturing method of the same
KR100673765B1 (ko) * 2006-01-20 2007-01-24 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
KR100635514B1 (ko) * 2006-01-23 2006-10-18 삼성에스디아이 주식회사 유기전계발광표시장치 및 그 제조방법
US20070170846A1 (en) * 2006-01-23 2007-07-26 Choi Dong-Soo Organic light emitting display and method of fabricating the same
JP4456092B2 (ja) * 2006-01-24 2010-04-28 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
JP4624309B2 (ja) * 2006-01-24 2011-02-02 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
KR100688795B1 (ko) * 2006-01-25 2007-03-02 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
KR100671641B1 (ko) * 2006-01-25 2007-01-19 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
KR100685853B1 (ko) * 2006-01-25 2007-02-22 삼성에스디아이 주식회사 유기전계발광표시장치 및 그 제조방법
US8164257B2 (en) * 2006-01-25 2012-04-24 Samsung Mobile Display Co., Ltd. Organic light emitting display and method of fabricating the same
KR100685854B1 (ko) * 2006-01-25 2007-02-22 삼성에스디아이 주식회사 유기전계발광표시장치 및 그 제조방법
US7999372B2 (en) * 2006-01-25 2011-08-16 Samsung Mobile Display Co., Ltd. Organic light emitting display device and method of fabricating the same
KR100671647B1 (ko) * 2006-01-26 2007-01-19 삼성에스디아이 주식회사 유기전계발광 표시 장치
KR100671638B1 (ko) * 2006-01-26 2007-01-19 삼성에스디아이 주식회사 유기 전계 발광 표시장치
KR100703472B1 (ko) * 2006-01-26 2007-04-03 삼성에스디아이 주식회사 프릿 경화 장치 및 이를 이용한 경화 방법
JP4633674B2 (ja) * 2006-01-26 2011-02-16 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
KR100732808B1 (ko) * 2006-01-26 2007-06-27 삼성에스디아이 주식회사 유기전계발광 표시장치의 제조방법

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US7537504B2 (en) 2009-05-26
CN101536133A (zh) 2009-09-16
EP1958228B1 (de) 2012-05-02
WO2007067420A3 (en) 2009-04-23
CN101536133B (zh) 2010-12-08
JP2008532207A (ja) 2008-08-14
WO2007067420A2 (en) 2007-06-14
KR100881795B1 (ko) 2009-02-03
TWI344315B (en) 2011-06-21
EP1958228A2 (de) 2008-08-20
KR20070088671A (ko) 2007-08-29
JP4601673B2 (ja) 2010-12-22
TW200733785A (en) 2007-09-01
US20070128967A1 (en) 2007-06-07
EP1958228A4 (de) 2010-07-07

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