ATE546489T1 - Aromatisches polyamid enthaltende zusammensetzung und daraus hergestellter gegenstand - Google Patents
Aromatisches polyamid enthaltende zusammensetzung und daraus hergestellter gegenstandInfo
- Publication number
- ATE546489T1 ATE546489T1 AT05768174T AT05768174T ATE546489T1 AT E546489 T1 ATE546489 T1 AT E546489T1 AT 05768174 T AT05768174 T AT 05768174T AT 05768174 T AT05768174 T AT 05768174T AT E546489 T1 ATE546489 T1 AT E546489T1
- Authority
- AT
- Austria
- Prior art keywords
- composition
- aromatic polyamide
- composition containing
- containing aromatic
- total weight
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/01—Hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US58413404P | 2004-07-01 | 2004-07-01 | |
| PCT/US2005/023645 WO2006007580A1 (en) | 2004-07-01 | 2005-06-29 | Aromatic polyamide composition and article manufactured therefrom |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE546489T1 true ATE546489T1 (de) | 2012-03-15 |
Family
ID=34973062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT05768174T ATE546489T1 (de) | 2004-07-01 | 2005-06-29 | Aromatisches polyamid enthaltende zusammensetzung und daraus hergestellter gegenstand |
Country Status (9)
| Country | Link |
|---|---|
| US (3) | US20080167404A1 (de) |
| EP (1) | EP1791910B1 (de) |
| JP (2) | JP5128942B2 (de) |
| KR (1) | KR20070046797A (de) |
| CN (1) | CN101006136B (de) |
| AT (1) | ATE546489T1 (de) |
| MY (1) | MY150093A (de) |
| TW (1) | TWI428391B (de) |
| WO (1) | WO2006007580A1 (de) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6252583B1 (en) | 1997-11-14 | 2001-06-26 | Immersion Corporation | Memory and force output management for a force feedback system |
| PL2254940T3 (pl) * | 2008-03-20 | 2014-11-28 | Dsm Ip Assets Bv | Radiator z przewodzących materiałów z tworzyw sztucznych |
| KR20110075703A (ko) * | 2009-12-28 | 2011-07-06 | 제일모직주식회사 | 반사성, 내충격성, 내열성 및 내습성이 우수한 폴리아마이드 수지 조성물 및 그 제조방법 |
| KR101231020B1 (ko) * | 2009-12-28 | 2013-02-07 | 제일모직주식회사 | 반사성, 내충격성, 내열성 및 내습성이 우수한 폴리아마이드 수지 조성물 및 그 제조방법 |
| JP4998841B2 (ja) * | 2010-08-27 | 2012-08-15 | 東洋紡績株式会社 | 表面実装型led用反射板に使用するポリアミド樹脂組成物 |
| BR112013006887B1 (pt) * | 2010-09-23 | 2020-12-08 | Invista Textiles (U.K.) Limited | fio fiado de fibra curta, fio de filamento contínuo e panos retardantes de chamas |
| US9321918B2 (en) * | 2010-10-13 | 2016-04-26 | Solvay Specialty Polymers Usa, Llc | Stain-resistant articles |
| CN102372921B (zh) | 2011-10-10 | 2013-05-08 | 金发科技股份有限公司 | 一种耐热聚酰胺组合物及其应用 |
| DE102012104308A1 (de) * | 2012-05-18 | 2013-11-21 | Ensinger Gmbh | Polymerwerkstoff, insbesondere für tribologische Anwendungen |
| TWI541278B (zh) * | 2012-12-18 | 2016-07-11 | 夸茲沃克公司 | 導熱性塑膠材料 |
| CN103509339B (zh) * | 2013-09-24 | 2017-01-04 | 惠州市集和光电科技有限公司 | 一种高性能高遮光ppa聚合物及其制备方法和应用 |
| ES2662019T3 (es) * | 2013-10-15 | 2018-04-05 | Lanxess Deutschland Gmbh | Masas de moldeo termoplásticas |
| CN103804792A (zh) * | 2014-01-17 | 2014-05-21 | 东莞市基一光电科技有限公司 | 一种导热反光型热塑性模塑材料及其应用 |
| EP2924062B1 (de) * | 2014-03-27 | 2019-02-13 | LANXESS Deutschland GmbH | Flammwidrige Polyamidzusammensetzungen |
| US20200308465A1 (en) * | 2016-06-21 | 2020-10-01 | Sabic Global Technologies B.V. | Polymer compositions exhibiting reflectivity and thermal conductivity |
| JP2020152762A (ja) * | 2019-03-18 | 2020-09-24 | 三井化学株式会社 | 半芳香族ポリアミド樹脂組成物およびその成形体 |
| JP7128365B2 (ja) | 2019-03-28 | 2022-08-30 | サザンミルズ インコーポレイテッド | 難燃性布地 |
| EP4384658A1 (de) | 2021-08-10 | 2024-06-19 | Southern Mills, Inc. | Flammfeste stoffe |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4594386A (en) * | 1983-08-15 | 1986-06-10 | Copolymer Rubber & Chemical Corporation | Polyamide grafted EPM blend |
| JPH0372565A (ja) * | 1989-05-01 | 1991-03-27 | Mitsui Petrochem Ind Ltd | 赤外線リフロー用組成物および電子部品 |
| DE3924869A1 (de) * | 1989-07-27 | 1991-01-31 | Basf Ag | Flammgeschuetzte thermoplastische formmassen |
| JP2859314B2 (ja) * | 1989-08-26 | 1999-02-17 | ユニチカ株式会社 | 樹脂組成物 |
| DE3929687A1 (de) * | 1989-09-07 | 1991-03-14 | Basf Ag | Fuellstoffhaltige thermoplastische formmassen |
| US5387645A (en) * | 1990-09-20 | 1995-02-07 | Amoco Corporation | Polyphthalamide composition |
| JP2793458B2 (ja) * | 1992-03-19 | 1998-09-03 | 三井化学株式会社 | コネクター用ポリアミド系樹脂組成物およびコネクター |
| JPH0665500A (ja) * | 1992-08-21 | 1994-03-08 | Mitsubishi Gas Chem Co Inc | ポリアミド樹脂組成物 |
| US5500473A (en) * | 1993-04-30 | 1996-03-19 | E. I. Du Pont De Nemours And Company | Mineral filled copolyamide compositions |
| JP3417600B2 (ja) * | 1993-06-11 | 2003-06-16 | 東洋紡績株式会社 | ポリアミド樹脂組成物 |
| JPH0782415A (ja) * | 1993-07-23 | 1995-03-28 | Otsuka Chem Co Ltd | 電子部品用樹脂組成物 |
| US20020018344A1 (en) * | 1996-03-08 | 2002-02-14 | Thomas & Betts International | Overhead luminaire |
| DE19615484A1 (de) * | 1996-04-19 | 1997-10-23 | Basf Ag | Oxidationsstabilisierte Polyamidformmassen |
| ES2211563T3 (es) * | 1999-06-18 | 2004-07-16 | Solvay Advanced Polymers, Llc | Metodo para reducir la formacion de depositos de moldeo durante el moldeo de poliamidas y composiciones para dicho procedimiento. |
| ES2215058T3 (es) * | 1999-08-02 | 2004-10-01 | E.I. Du Pont De Nemours And Company | Composiciones de poliamida aromatica para moldeo. |
| JP2001106908A (ja) * | 1999-08-02 | 2001-04-17 | E I Du Pont De Nemours & Co | 成形用芳香族ポリアミド組成物 |
| FR2807050B1 (fr) * | 2000-04-04 | 2005-03-25 | Atofina | Compositions thermoplastiques de polyamide a proprietes choc ameliorees |
| JP4605861B2 (ja) * | 2000-07-06 | 2011-01-05 | コニンクリーケ デーエスエム ナムローゼ フェンノートシャップ | 熱可塑性樹脂組成物 |
| CN1200044C (zh) * | 2000-08-09 | 2005-05-04 | 三井化学株式会社 | 阻燃性聚酰胺组合物、颗粒和成形体及其用途 |
| DE50113321D1 (de) * | 2001-03-15 | 2008-01-10 | Ems Chemie Ag | Gefüllte, thermoplastische Polyamidformmassen mit verbesserten Eigenschaften |
| JP4892140B2 (ja) * | 2001-03-30 | 2012-03-07 | 大塚化学株式会社 | Led反射板用樹脂組成物 |
| CN1206278C (zh) * | 2001-07-23 | 2005-06-15 | 帝人化成株式会社 | 热塑性树脂组合物、成形品及其制造方法 |
| JP4117130B2 (ja) * | 2001-12-26 | 2008-07-16 | 大塚化学ホールディングス株式会社 | 紫外線発生源用反射板材料 |
| JP2004075994A (ja) * | 2002-06-21 | 2004-03-11 | Kuraray Co Ltd | ポリアミド組成物 |
| CA2432522C (en) * | 2002-06-21 | 2010-09-21 | Kuraray Co., Ltd. | Polyamide composition |
| JP4229679B2 (ja) * | 2002-11-08 | 2009-02-25 | 帝人化成株式会社 | 光高反射性樹脂組成物 |
| WO2004050766A1 (en) * | 2002-12-04 | 2004-06-17 | Dsm Ip Assets B.V. | Laser light absorbing additive |
| US6822032B2 (en) * | 2003-02-06 | 2004-11-23 | General Electric Company | Impact modified compositions of polyimide and polyamide resins |
| JP4469149B2 (ja) * | 2003-08-07 | 2010-05-26 | ダイセルポリマー株式会社 | 熱可塑性樹脂組成物及び成形品 |
| US7109520B2 (en) * | 2003-10-10 | 2006-09-19 | E. I. Du Pont De Nemours And Company | Heat sinks |
| KR20060135649A (ko) * | 2003-12-09 | 2006-12-29 | 미쓰이 가가쿠 가부시키가이샤 | 반사판용 수지 조성물 및 반사판 |
| US20060230553A1 (en) * | 2005-04-14 | 2006-10-19 | Helmut Thullen | Process for tinting, dyeing or doping of moulded components made of transparent (co)polyamides in aqueous dye bath |
| DE502007000618D1 (de) * | 2007-02-07 | 2009-05-28 | Ems Chemie Ag | Gefüllte Polyamidformmassen mit reduzierter Wasseraufnahme |
-
2005
- 2005-06-29 CN CN200580021760XA patent/CN101006136B/zh not_active Expired - Fee Related
- 2005-06-29 WO PCT/US2005/023645 patent/WO2006007580A1/en not_active Ceased
- 2005-06-29 JP JP2007519504A patent/JP5128942B2/ja not_active Expired - Fee Related
- 2005-06-29 KR KR1020067027918A patent/KR20070046797A/ko not_active Ceased
- 2005-06-29 TW TW094121927A patent/TWI428391B/zh not_active IP Right Cessation
- 2005-06-29 AT AT05768174T patent/ATE546489T1/de active
- 2005-06-29 US US11/630,793 patent/US20080167404A1/en not_active Abandoned
- 2005-06-29 EP EP05768174A patent/EP1791910B1/de not_active Expired - Lifetime
- 2005-06-30 MY MYPI20052999A patent/MY150093A/en unknown
-
2012
- 2012-08-02 JP JP2012171937A patent/JP5650694B2/ja not_active Expired - Fee Related
-
2014
- 2014-01-03 US US14/147,119 patent/US20150197635A1/en not_active Abandoned
-
2015
- 2015-10-29 US US14/926,415 patent/US20160046808A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| EP1791910A1 (de) | 2007-06-06 |
| EP1791910B1 (de) | 2012-02-22 |
| KR20070046797A (ko) | 2007-05-03 |
| US20160046808A1 (en) | 2016-02-18 |
| CN101006136B (zh) | 2011-08-31 |
| JP2012229439A (ja) | 2012-11-22 |
| CN101006136A (zh) | 2007-07-25 |
| WO2006007580A1 (en) | 2006-01-19 |
| TWI428391B (zh) | 2014-03-01 |
| US20080167404A1 (en) | 2008-07-10 |
| JP5650694B2 (ja) | 2015-01-07 |
| JP2008505223A (ja) | 2008-02-21 |
| MY150093A (en) | 2013-11-29 |
| TW200613448A (en) | 2006-05-01 |
| US20150197635A1 (en) | 2015-07-16 |
| JP5128942B2 (ja) | 2013-01-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ATE546489T1 (de) | Aromatisches polyamid enthaltende zusammensetzung und daraus hergestellter gegenstand | |
| BRPI0813916A2 (pt) | Copolímeros de 1-buteno etileno | |
| DE602006007572D1 (de) | Propylen-ethylen-copolymere und herstellungsverfahren dafür | |
| DE602006009897D1 (de) | Heterophasische polymerzusammensetzung und herstellungsverfahren dafür | |
| EP2077283A4 (de) | Ethylencopolymer, zusammensetzung mit dem copolymer und herstellungsverfahren | |
| DE502004009702D1 (de) | Konjugierte polymere, deren darstellung und verwendung | |
| DE602004011823D1 (de) | Polymer-nanoverbundwerkstoffe und herstellungsverfahren dafür | |
| ATE408646T1 (de) | Fluorhaltige polymerzusammensetzung und hartkörper | |
| DE602005023025D1 (de) | Thermoplastische zusammensetzungen | |
| TW200801113A (en) | The polylactic acid composition and the deep dyeing fiber manufactured from the same | |
| WO2007126775A3 (en) | Compositions and methods for making and using acyclic n-halamine-based biocidal polymeric materials and articles | |
| WO2007143209A3 (en) | Luminescent diketonate polymers | |
| CR11390A (es) | Tuberia cpvc con base de diseno hidrostatico 25% mayor del requerido bajo astm d2846 | |
| DK1809694T3 (da) | Polymersammensætning baseret på en PVDF homopolymer og en termoplastisk fluorpolymer | |
| BRPI0811098A2 (pt) | Composições poliméricas de propileno macio | |
| TW200628534A (en) | Retention and drainage aids | |
| MX2009006811A (es) | Materiales polimericos. | |
| DE60305508D1 (de) | Verstärkte, glasgefüllte polyamidzusammensetzungen und misschungen mit verbesserter steifigkeit | |
| EP2114822A4 (de) | Herstellung einer hochfesten salzarmen natriumhypochloritbleiche | |
| ATE377051T1 (de) | Aromatisches polykondensat enthaltende zusammensetzungen mit verbesserten festigkeitseigenschaften | |
| EA200701226A1 (ru) | Полиэтилен для экструзионного покрытия | |
| ATE441691T1 (de) | Verbundstoff aus hochschmelzendem polymer und nanoton mit verbesserten eigenschaften | |
| ATE388175T1 (de) | Polyethylenfilm mit verbesserter verarbeitbarkeit und verbesserten mechanischen eigenschaften | |
| WO2007079101A3 (en) | Compositions comprising novel compounds and electronic devices made with such compositions | |
| DE602007011772D1 (de) | Poly(arylenether)zusammensetzung, verfahren und gegenstand |