ATE546489T1 - Aromatisches polyamid enthaltende zusammensetzung und daraus hergestellter gegenstand - Google Patents

Aromatisches polyamid enthaltende zusammensetzung und daraus hergestellter gegenstand

Info

Publication number
ATE546489T1
ATE546489T1 AT05768174T AT05768174T ATE546489T1 AT E546489 T1 ATE546489 T1 AT E546489T1 AT 05768174 T AT05768174 T AT 05768174T AT 05768174 T AT05768174 T AT 05768174T AT E546489 T1 ATE546489 T1 AT E546489T1
Authority
AT
Austria
Prior art keywords
composition
aromatic polyamide
composition containing
containing aromatic
total weight
Prior art date
Application number
AT05768174T
Other languages
English (en)
Inventor
Christie Crowe
Masahiko Saito
Original Assignee
Solvay Specialty Polymers Usa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34973062&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE546489(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Solvay Specialty Polymers Usa filed Critical Solvay Specialty Polymers Usa
Application granted granted Critical
Publication of ATE546489T1 publication Critical patent/ATE546489T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
AT05768174T 2004-07-01 2005-06-29 Aromatisches polyamid enthaltende zusammensetzung und daraus hergestellter gegenstand ATE546489T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US58413404P 2004-07-01 2004-07-01
PCT/US2005/023645 WO2006007580A1 (en) 2004-07-01 2005-06-29 Aromatic polyamide composition and article manufactured therefrom

Publications (1)

Publication Number Publication Date
ATE546489T1 true ATE546489T1 (de) 2012-03-15

Family

ID=34973062

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05768174T ATE546489T1 (de) 2004-07-01 2005-06-29 Aromatisches polyamid enthaltende zusammensetzung und daraus hergestellter gegenstand

Country Status (9)

Country Link
US (3) US20080167404A1 (de)
EP (1) EP1791910B1 (de)
JP (2) JP5128942B2 (de)
KR (1) KR20070046797A (de)
CN (1) CN101006136B (de)
AT (1) ATE546489T1 (de)
MY (1) MY150093A (de)
TW (1) TWI428391B (de)
WO (1) WO2006007580A1 (de)

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US6252583B1 (en) 1997-11-14 2001-06-26 Immersion Corporation Memory and force output management for a force feedback system
US20110103021A1 (en) * 2008-03-20 2011-05-05 Robert Hendrik Catharina Janssen Heatsinks of thermally conductive plastic materials
KR20110075703A (ko) * 2009-12-28 2011-07-06 제일모직주식회사 반사성, 내충격성, 내열성 및 내습성이 우수한 폴리아마이드 수지 조성물 및 그 제조방법
KR101231020B1 (ko) * 2009-12-28 2013-02-07 제일모직주식회사 반사성, 내충격성, 내열성 및 내습성이 우수한 폴리아마이드 수지 조성물 및 그 제조방법
CN102782048B (zh) * 2010-08-27 2013-10-09 东洋纺织株式会社 用于表面安装型led用反射板的聚酰胺树脂组合物
EP2619358B1 (de) * 2010-09-23 2018-02-21 INVISTA Textiles (U.K.) Limited Flammhemmende garne und damit hergestellte stoffe
KR20180028531A (ko) * 2010-10-13 2018-03-16 솔베이 스페셜티 폴리머즈 유에스에이, 엘.엘.씨. 내오염성 물품
CN102372921B (zh) 2011-10-10 2013-05-08 金发科技股份有限公司 一种耐热聚酰胺组合物及其应用
DE102012104308A1 (de) * 2012-05-18 2013-11-21 Ensinger Gmbh Polymerwerkstoff, insbesondere für tribologische Anwendungen
TWI541278B (zh) * 2012-12-18 2016-07-11 夸茲沃克公司 導熱性塑膠材料
CN103509339B (zh) * 2013-09-24 2017-01-04 惠州市集和光电科技有限公司 一种高性能高遮光ppa聚合物及其制备方法和应用
ES2662019T3 (es) * 2013-10-15 2018-04-05 Lanxess Deutschland Gmbh Masas de moldeo termoplásticas
CN103804792A (zh) * 2014-01-17 2014-05-21 东莞市基一光电科技有限公司 一种导热反光型热塑性模塑材料及其应用
HUE043312T2 (hu) * 2014-03-27 2019-08-28 Lanxess Deutschland Gmbh Égésgátló poliamid kompozíciók
KR20190014537A (ko) * 2016-06-21 2019-02-12 사빅 글로벌 테크놀러지스 비.브이. 반사율 및 열전도도를 나타내는 폴리머 조성물
JP2020152762A (ja) * 2019-03-18 2020-09-24 三井化学株式会社 半芳香族ポリアミド樹脂組成物およびその成形体
CA3171137A1 (en) 2019-03-28 2020-10-01 Southern Mills, Inc. Flame resistant fabrics
KR20240037351A (ko) 2021-08-10 2024-03-21 써던 밀즈, 인코포레이티드 방염성 직물

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JPH0372565A (ja) * 1989-05-01 1991-03-27 Mitsui Petrochem Ind Ltd 赤外線リフロー用組成物および電子部品
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JP4892140B2 (ja) * 2001-03-30 2012-03-07 大塚化学株式会社 Ｌｅｄ反射板用樹脂組成物
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Also Published As

Publication number Publication date
JP2008505223A (ja) 2008-02-21
CN101006136A (zh) 2007-07-25
EP1791910A1 (de) 2007-06-06
US20150197635A1 (en) 2015-07-16
WO2006007580A1 (en) 2006-01-19
KR20070046797A (ko) 2007-05-03
TWI428391B (zh) 2014-03-01
CN101006136B (zh) 2011-08-31
US20080167404A1 (en) 2008-07-10
JP5128942B2 (ja) 2013-01-23
MY150093A (en) 2013-11-29
TW200613448A (en) 2006-05-01
JP2012229439A (ja) 2012-11-22
JP5650694B2 (ja) 2015-01-07
EP1791910B1 (de) 2012-02-22
US20160046808A1 (en) 2016-02-18

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