ATE546730T1 - Verfahren zur kontrolle von stabilisatoradditiven in elektrolyten zur chemischen metall- und metalllegierungsabscheidung - Google Patents

Verfahren zur kontrolle von stabilisatoradditiven in elektrolyten zur chemischen metall- und metalllegierungsabscheidung

Info

Publication number
ATE546730T1
ATE546730T1 AT08075906T AT08075906T ATE546730T1 AT E546730 T1 ATE546730 T1 AT E546730T1 AT 08075906 T AT08075906 T AT 08075906T AT 08075906 T AT08075906 T AT 08075906T AT E546730 T1 ATE546730 T1 AT E546730T1
Authority
AT
Austria
Prior art keywords
metal
electrolytes
metal alloy
alloy deposition
stabilizer additives
Prior art date
Application number
AT08075906T
Other languages
English (en)
Inventor
Constanze Donner
Guenther Bauer
Therese Stern
Kay Wurdinger
Lutz Brand
Frank Bruening
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Application granted granted Critical
Publication of ATE546730T1 publication Critical patent/ATE546730T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/416—Systems
    • G01N27/48—Systems using polarography, i.e. measuring changes in current under a slowly-varying voltage
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Electrochemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Molecular Biology (AREA)
  • Chemically Coating (AREA)
  • Control Of Non-Electrical Variables (AREA)
AT08075906T 2008-11-26 2008-11-26 Verfahren zur kontrolle von stabilisatoradditiven in elektrolyten zur chemischen metall- und metalllegierungsabscheidung ATE546730T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP08075906A EP2192405B1 (de) 2008-11-26 2008-11-26 Verfahren zur Kontrolle von Stabilisatoradditiven in Elektrolyten zur chemischen Metall- und Metalllegierungsabscheidung

Publications (1)

Publication Number Publication Date
ATE546730T1 true ATE546730T1 (de) 2012-03-15

Family

ID=40414573

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08075906T ATE546730T1 (de) 2008-11-26 2008-11-26 Verfahren zur kontrolle von stabilisatoradditiven in elektrolyten zur chemischen metall- und metalllegierungsabscheidung

Country Status (8)

Country Link
US (1) US8648601B2 (de)
EP (1) EP2192405B1 (de)
JP (1) JP5335096B2 (de)
KR (1) KR101511408B1 (de)
CN (1) CN102227628B (de)
AT (1) ATE546730T1 (de)
TW (1) TWI441953B (de)
WO (1) WO2010060906A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5443409B2 (ja) * 2011-02-28 2014-03-19 トヨタ自動車株式会社 硫黄系化合物の管理方法及びその管理システム
TWI717427B (zh) * 2015-12-03 2021-02-01 德商德國艾托特克公司 用於監測金屬鍍浴中含硫化合物之總量的方法
CN108760821B (zh) * 2018-06-04 2020-09-25 电子科技大学 一种电镀添加剂的定性和定量分析方法
CN108754467B (zh) * 2018-06-27 2021-01-12 深圳市贝加电子材料有限公司 钌钯合金化学镀液及其施镀方法和应用
CN113143262B (zh) * 2021-03-26 2023-09-22 中国刑事警察学院 一种潜手印的显现和固定方法
KR102574198B1 (ko) * 2021-08-23 2023-09-07 한국생산기술연구원 무전해 도금법을 이용한 혈액 전처리 분리막 일체형 표면증강 라만산란 기판 상 금 박막 도금방법
CN114892235A (zh) * 2022-04-06 2022-08-12 北京石油化工学院 一种使用电化学手段筛选微弧氧化工艺电解液的方法

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
JPS5345592A (en) * 1976-10-06 1978-04-24 Toshiba Corp Concentration measuring method, of non-electrolysis plating liquid
US4814197A (en) * 1986-10-31 1989-03-21 Kollmorgen Corporation Control of electroless plating baths
US5320724A (en) * 1992-11-17 1994-06-14 Hughes Aircraft Company Method of monitoring constituents in plating baths
JPH0798296A (ja) * 1993-09-30 1995-04-11 Hitachi Chem Co Ltd 無電解銅めっき液中の添加剤の濃度測定法
US5755954A (en) * 1996-01-17 1998-05-26 Technic, Inc. Method of monitoring constituents in electroless plating baths
JP2002506531A (ja) * 1998-05-01 2002-02-26 セミトウール・インコーポレーテツド 電気メッキ浴中の添加物の測定法
US20030201191A1 (en) * 2002-04-29 2003-10-30 Applied Materials, Inc. Electrochemical method for direct organic additives analysis in copper baths
EP1540046A4 (de) * 2002-07-19 2007-04-04 Technic Verfahren und vorrichtung zur echtzeit berwachung von technischen elektrolyten
DE60216315T2 (de) * 2002-08-23 2007-03-08 Kabushiki Kaisha Toshiba Basensequenzierungselektroden, Basensequenzierungsvorrichtung und Basensequenzierungsverfahren
US7140229B2 (en) * 2004-06-29 2006-11-28 Mst Technology Gmbh Gas-monitoring assembly comprising one or more gas sensors and one or more getters, and method of using same
WO2006110437A1 (en) * 2005-04-08 2006-10-19 The Trustees Of Columbia University In The City Of New York Systems and methods for monitoring plating and etching baths
US8747960B2 (en) * 2005-08-31 2014-06-10 Lam Research Corporation Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicide
JP4325684B2 (ja) * 2007-02-20 2009-09-02 株式会社デンソー センサ制御装置、及び印加電圧特性の調整方法
ATE523777T1 (de) * 2007-07-26 2011-09-15 Nipro Diagnostics Inc System und verfahren zur bestimmung der analytkonzentration mittels zeitaufgelöster amperometrie

Also Published As

Publication number Publication date
JP5335096B2 (ja) 2013-11-06
KR20110088531A (ko) 2011-08-03
CN102227628B (zh) 2015-01-28
EP2192405B1 (de) 2012-02-22
US20110221445A1 (en) 2011-09-15
EP2192405A1 (de) 2010-06-02
KR101511408B1 (ko) 2015-04-15
US8648601B2 (en) 2014-02-11
TWI441953B (zh) 2014-06-21
JP2012510068A (ja) 2012-04-26
TW201026905A (en) 2010-07-16
CN102227628A (zh) 2011-10-26
WO2010060906A1 (en) 2010-06-03

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