ATE547743T1 - Lichtempfindliche zusammensetzung und herstellungsverfahren für ein gehärtetes reliefmuster - Google Patents

Lichtempfindliche zusammensetzung und herstellungsverfahren für ein gehärtetes reliefmuster

Info

Publication number
ATE547743T1
ATE547743T1 AT08004849T AT08004849T ATE547743T1 AT E547743 T1 ATE547743 T1 AT E547743T1 AT 08004849 T AT08004849 T AT 08004849T AT 08004849 T AT08004849 T AT 08004849T AT E547743 T1 ATE547743 T1 AT E547743T1
Authority
AT
Austria
Prior art keywords
producing
carbon atoms
photosensitive composition
relief pattern
group containing
Prior art date
Application number
AT08004849T
Other languages
English (en)
Inventor
Kenichiro Sato
Naoya Sugimoto
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Application granted granted Critical
Publication of ATE547743T1 publication Critical patent/ATE547743T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists
    • H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Polyamides (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
AT08004849T 2007-03-14 2008-03-14 Lichtempfindliche zusammensetzung und herstellungsverfahren für ein gehärtetes reliefmuster ATE547743T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007065325 2007-03-14
JP2007178473 2007-07-06

Publications (1)

Publication Number Publication Date
ATE547743T1 true ATE547743T1 (de) 2012-03-15

Family

ID=39577289

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08004849T ATE547743T1 (de) 2007-03-14 2008-03-14 Lichtempfindliche zusammensetzung und herstellungsverfahren für ein gehärtetes reliefmuster

Country Status (4)

Country Link
US (1) US7615324B2 (de)
EP (1) EP1970761B1 (de)
JP (1) JP2009037201A (de)
AT (1) ATE547743T1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4911454B2 (ja) * 2006-09-19 2012-04-04 富士フイルム株式会社 ポリベンゾオキサゾール前駆体、それを用いた感光性樹脂組成物及び半導体装置の製造方法
US8617785B2 (en) * 2009-01-16 2013-12-31 Fujifilm Corporation Actinic ray-sensitive or radiation-sensitive resin composition and pattern forming method using the same
JP5751025B2 (ja) * 2011-05-31 2015-07-22 住友ベークライト株式会社 ポジ型感光性樹脂組成物、硬化膜、保護膜、絶縁膜、半導体装置、および表示体装置
JP5887172B2 (ja) * 2011-07-29 2016-03-16 富士フイルム株式会社 感光性樹脂組成物、レリーフパターン形成材料、感光性膜、ポリイミド膜、硬化レリーフパターンの製造方法、及び半導体装置
WO2015087830A1 (ja) * 2013-12-11 2015-06-18 富士フイルム株式会社 感光性樹脂組成物、硬化膜の製造方法、硬化膜、液晶表示装置および有機ｅｌ表示装置
JP6286227B2 (ja) 2014-02-21 2018-02-28 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、感活性光線性又は感放射線性膜、感活性光線性又は感放射線性膜を備えたマスクブランクス、パターン形成方法、及び電子デバイスの製造方法
JP6209103B2 (ja) * 2014-02-25 2017-10-04 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、それを用いたレジスト膜、レジスト塗布マスクブランクス、レジストパターン形成方法、及び、フォトマスク
CN107430334B (zh) * 2015-01-23 2021-07-30 艾曲迪微系统股份有限公司 正型感光性树脂组合物、图案固化膜的制造方法、图案固化膜和电子部件
CN107407879B (zh) * 2015-03-27 2020-10-16 东丽株式会社 感光性树脂组合物、感光性片材、半导体器件及半导体器件的制造方法
KR101921918B1 (ko) * 2015-03-27 2018-11-26 도레이 카부시키가이샤 디아민 화합물에 유래하는 구조를 갖는 내열성 수지 또는 내열성 수지 전구체
US12529958B2 (en) * 2018-07-25 2026-01-20 Jsr Corporation Photosensitive resin composition, method for producing resin film having pattern, resin film having pattern, and semiconductor circuit substrate
KR102782505B1 (ko) * 2020-12-07 2025-03-14 주식회사 엘지화학 폴리이미드 수지, 포지티브형 감광성 수지 조성물, 절연막 및 반도체 장치
EP4043963B1 (de) * 2021-02-11 2023-07-05 Xetos AG Verbessertes ausbleichen

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1206954B (it) * 1979-02-12 1989-05-17 Sigma Tau Ind Farmaceuti Agenti terapeutici a base di un acil derivato della carnitina per la cura di vasculopatie periferiche
DE2931297A1 (de) 1979-08-01 1981-02-19 Siemens Ag Waermebestaendige positivresists und verfahren zur herstellung waermebestaendiger reliefstrukturen
CH655005A5 (it) * 1983-02-16 1986-03-27 Sigma Tau Ind Farmaceuti Composizione farmaceutica ad azione metabolica ed energetica utilizzabile in terapia cardiaca e vascolare.
US4687782A (en) * 1984-12-10 1987-08-18 Nutri-Fuels Systems, Inc. Nutritional composition for enhancing skeletal muscle adaptation to exercise training
US5030458A (en) * 1989-11-27 1991-07-09 Shug Austin L Method for preventing diet-induced carnitine deficiency in domesticated dogs and cats
US4871718A (en) * 1987-12-29 1989-10-03 Raymond A. Roncari Composition of matter for increasing intracellular ATP levels and physical performance levels and for increasing the rate of wound repair
US5030657A (en) * 1989-10-23 1991-07-09 University Of Georgia Research Foundation, Inc. L-carnitine supplemented catfish diet
US5240961A (en) * 1992-07-02 1993-08-31 Shug Austin L Method of treating reduced insulin-like growth factor and bone loss associated with aging
US5362753A (en) * 1993-04-19 1994-11-08 Lonza Ltd. Method of increasing the hatchability of eggs by feeding hens carnitine
US5438042B1 (en) * 1993-10-08 1997-08-26 Sandoz Nutrition Ltd Enteral nutritional composition having amino acid profile
US5560928A (en) * 1995-06-23 1996-10-01 Defelice; Stephen L. Nutritional and/or dietary composition and method of using the same
US6143467A (en) 1998-10-01 2000-11-07 Arch Specialty Chemicals, Inc. Photosensitive polybenzoxazole precursor compositions
US6616942B1 (en) * 1999-03-29 2003-09-09 Soft Gel Technologies, Inc. Coenzyme Q10 formulation and process methodology for soft gel capsules manufacturing
US6740338B1 (en) * 2000-01-20 2004-05-25 Raj K. Chopra Reduced form of Cenzyme Q in high bioavailability stable oral dosage form
JP3799957B2 (ja) * 2000-04-28 2006-07-19 日立化成デュポンマイクロシステムズ株式会社 感光性重合体組成物、パターンの製造法及び電子部品
US6623734B2 (en) * 2000-06-22 2003-09-23 Soft Gel Technologies, Inc. Super absorption coenzyme Q10
JP2002169283A (ja) * 2000-11-30 2002-06-14 Hitachi Chemical Dupont Microsystems Ltd 感光性重合体組成物、パターンの製造法及び電子部品
JP3773845B2 (ja) 2000-12-29 2006-05-10 三星電子株式会社 ポジティブ型感光性ポリイミド前駆体およびこれを含む組成物
TW574620B (en) * 2001-02-26 2004-02-01 Toray Industries Precursor composition of positive photosensitive resin and display device using it
WO2004081664A2 (en) * 2003-03-11 2004-09-23 Arch Specialty Chemicals, Inc. Novel photosensitive resin compositions
US6939659B2 (en) * 2003-03-11 2005-09-06 Arch Specialty Chemicals, Inc. Photosensitive resin compositions
EP1636648B1 (de) * 2003-06-05 2015-08-12 FujiFilm Electronic Materials USA, Inc. Neuartige positiv-lichtempfindliche harzzusammensetzungen
JP4464396B2 (ja) * 2003-06-06 2010-05-19 フジフィルム・エレクトロニック・マテリアルズ・ユーエスエイ・インコーポレイテッド 新規な感光性樹脂組成物
JP4595412B2 (ja) 2003-07-09 2010-12-08 東レ株式会社 感光性樹脂前駆体組成物
CN102854745B (zh) * 2004-01-14 2015-05-27 日立化成杜邦微系统股份有限公司 感光性树脂组合物、图案制造方法及电子部件
WO2005109099A1 (ja) * 2004-05-07 2005-11-17 Hitachi Chemical Dupont Microsystems Ltd. ポジ型感光性樹脂組成物、パターンの製造方法及び電子部品
JP4525202B2 (ja) 2004-06-22 2010-08-18 住友ベークライト株式会社 ポジ型感光性樹脂組成物並びに半導体装置及び表示素子並びに半導体装置、表示素子の製造方法
JP4677887B2 (ja) 2004-11-24 2011-04-27 東レ株式会社 感光性樹脂組成物
EP1662319A3 (de) * 2004-11-24 2009-05-27 Toray Industries, Inc. Lichtempfindliche Harzzusammensetzung
JP4682764B2 (ja) * 2005-09-15 2011-05-11 日立化成デュポンマイクロシステムズ株式会社 ポジ型感光性樹脂組成物、パターン形成方法及び電子部品
KR101438857B1 (ko) * 2007-03-12 2014-09-05 히다치 가세이듀퐁 마이쿠로시스데무즈 가부시키가이샤 감광성 수지 조성물, 그 수지 조성물을 이용한 패턴 경화막의 제조방법 및 전자부품

Also Published As

Publication number Publication date
US7615324B2 (en) 2009-11-10
US20080227024A1 (en) 2008-09-18
JP2009037201A (ja) 2009-02-19
EP1970761A1 (de) 2008-09-17
EP1970761B1 (de) 2012-02-29

Similar Documents

Publication Publication Date Title
ATE547743T1 (de) Lichtempfindliche zusammensetzung und herstellungsverfahren für ein gehärtetes reliefmuster
WO2008105138A1 (ja) ポリチオウレタン系光学材料用重合触媒、それを含む重合性組成物、それより得られる光学材料、およびその製造方法
MX2010001605A (es) Metodo para producir olefinas fluoradas.
EP2037323A3 (de) Lichtempfindliche Zusammensetzungen, härtbare Zusammensetzungen, neuartige Verbindungen, photopolymerisierbare Zusammensetzungen, Farbfilter und planographische Druckplattenvorläufer
TW200741348A (en) Positive resist composition and pattern forming method using the same
DE602007010194D1 (de) Neue Sulfoniumverbindung, diese enthaltende lichtempfindliche Zusammensetzung und Strukturbildungsverfahren unter Verwendung der lichtempfindlichen Zusammensetzung
EP2239263A4 (de) Cyclische verbindung, deren metallkomplex und modifizierter metallkomplex
ATE434776T1 (de) Positive resistzusammensetzung und verfahren zur strukturformung damit
ATE521728T1 (de) Ausgangsverbindungen zur abscheidung von schichten, die gruppe-4-metalle enthalten
ATE550334T1 (de) N-pyridylpiperidinverbindung, verfahren zu ihrer herstellung und schädlingsbekämpfungsmittel
ATE509936T1 (de) Olefinisch ungesättigte phosphonatverbindungen, daraus hergestellte polymere und ihre verwendung
MY160942A (en) Melanin production inhibitor
TW200643053A (en) Organoaluminum precursor compounds
TW200611886A (en) New compound, polymer compound, resist composition and method for forming resist pattern
PL2447294T3 (pl) Mieszane aminy policykloalifatyczne (MPCA) i alkilaty MPCA
WO2008126902A1 (ja) 組成物、保護被膜形成方法及び積層体とその製法
TW200801072A (en) Ultraviolet curable resin composition having a polyfunctional oxetanyl group
ATE509681T1 (de) Kationenaustausch- verdrängungschromatographieverfahren und kationische organische verbindungen zur verwendung als verdrängerverbindungen bei einem kationenaustausch- verdrängungschromatographieverfahren
EP1708026A4 (de) Lichtempfindliche polymerzusammensetzung, prozess zur erzeugung einer struktur und elektronisches teil
TW200708591A (en) Aromatic graft polymer
TW200504113A (en) Curable polycyclic compounds and process for the production thereof
TW200606588A (en) Resist composition and process for forming resist pattern
WO2009078394A1 (ja) ４-ヒドロキシフェニルアルキルアミン誘導体
ATE444323T1 (de) Neuartige epoxidverbindungen und verfahren zu ihrer herstellung
ATE525495T1 (de) Behandlungslösung zur erzeugung chrom- und cobalt-freier schwarzer konversionsschichten