ATE547810T1 - Thermisches phasenveränderliches verbindungsmaterial unter verwendung von polyesterharz und eines tonfüllers - Google Patents

Thermisches phasenveränderliches verbindungsmaterial unter verwendung von polyesterharz und eines tonfüllers

Info

Publication number
ATE547810T1
ATE547810T1 AT04757338T AT04757338T ATE547810T1 AT E547810 T1 ATE547810 T1 AT E547810T1 AT 04757338 T AT04757338 T AT 04757338T AT 04757338 T AT04757338 T AT 04757338T AT E547810 T1 ATE547810 T1 AT E547810T1
Authority
AT
Austria
Prior art keywords
phase change
polyester resin
joint material
thermal phase
clay filler
Prior art date
Application number
AT04757338T
Other languages
English (en)
Inventor
James Matayabas
Paul Koning
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Application granted granted Critical
Publication of ATE547810T1 publication Critical patent/ATE547810T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/17—Containers or parts thereof characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02—Materials undergoing a change of physical state when used
    • C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
    • C09K5/063—Materials absorbing or liberating heat during crystallisation; Heat storage materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H10W40/735—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state by melting or evaporation of solids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AT04757338T 2003-07-30 2004-07-28 Thermisches phasenveränderliches verbindungsmaterial unter verwendung von polyesterharz und eines tonfüllers ATE547810T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/631,912 US7408787B2 (en) 2003-07-30 2003-07-30 Phase change thermal interface materials including polyester resin
PCT/US2004/024269 WO2005013362A1 (en) 2003-07-30 2004-07-28 Phase change thermal interface materials using polyester resin and clay filled

Publications (1)

Publication Number Publication Date
ATE547810T1 true ATE547810T1 (de) 2012-03-15

Family

ID=34115777

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04757338T ATE547810T1 (de) 2003-07-30 2004-07-28 Thermisches phasenveränderliches verbindungsmaterial unter verwendung von polyesterharz und eines tonfüllers

Country Status (7)

Country Link
US (1) US7408787B2 (de)
EP (1) EP1654759B1 (de)
KR (1) KR101181102B1 (de)
CN (1) CN100477182C (de)
AT (1) ATE547810T1 (de)
TW (1) TWI244880B (de)
WO (1) WO2005013362A1 (de)

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US7132746B2 (en) * 2003-08-18 2006-11-07 Delphi Technologies, Inc. Electronic assembly with solder-bonded heat sink
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US20070031684A1 (en) * 2005-08-03 2007-02-08 Anderson Jeffrey T Thermally conductive grease
US20070051773A1 (en) * 2005-09-02 2007-03-08 Ruchert Brian D Thermal interface materials, methods of preparation thereof and their applications
KR100962100B1 (ko) * 2005-12-08 2010-06-09 후지쯔 가부시끼가이샤 전자부품의 제조방법 및 열전도부재의 제조방법 및전자부품용 열전도부재의 실장방법
TWI291480B (en) * 2005-12-20 2007-12-21 Ind Tech Res Inst Composition for thermal interface materials
US7534649B2 (en) * 2006-05-12 2009-05-19 Intel Corporation Thermoset polyimides for microelectronic applications
WO2009000105A1 (fr) * 2007-06-25 2008-12-31 Jenshyan Chen Dispositif d'éclairage électroluminescent
US7808099B2 (en) 2008-05-06 2010-10-05 International Business Machines Corporation Liquid thermal interface having mixture of linearly structured polymer doped crosslinked networks and related method
TWI383006B (zh) * 2008-11-26 2013-01-21 Univ Nat Cheng Kung 導熱性複合材料
CN101906288B (zh) * 2009-06-02 2013-08-21 清华大学 热界面材料,具该热界面材料的电子装置及制备方法
TWI475103B (zh) * 2009-12-15 2015-03-01 財團法人工業技術研究院 散熱結構
CN102893391B (zh) 2010-04-30 2017-08-29 铟泰公司 具有良好可靠性的热界面材料
US8582297B2 (en) * 2011-02-03 2013-11-12 International Business Machines Corporation Customized thermal interface to optimize mechanical loading and thermal conductivity characteristics
WO2013095457A1 (en) * 2011-12-21 2013-06-27 Intel Corporation Ridged integrated heat spreader
US8587945B1 (en) * 2012-07-27 2013-11-19 Outlast Technologies Llc Systems structures and materials for electronic device cooling
US8920919B2 (en) 2012-09-24 2014-12-30 Intel Corporation Thermal interface material composition including polymeric matrix and carbon filler
WO2014071528A1 (en) 2012-11-09 2014-05-15 Bioastra Technologies Inc. Nanostructured phase change materials for solid state thermal management
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US10373891B2 (en) 2013-06-14 2019-08-06 Laird Technologies, Inc. Methods for establishing thermal joints between heat spreaders or lids and heat sources
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KR20160012703A (ko) * 2014-07-25 2016-02-03 삼성전자주식회사 발열 부품을 포함하는 전자 장치
US9353245B2 (en) 2014-08-18 2016-05-31 3M Innovative Properties Company Thermally conductive clay
US9318450B1 (en) * 2014-11-24 2016-04-19 Raytheon Company Patterned conductive epoxy heat-sink attachment in a monolithic microwave integrated circuit (MMIC)
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US10269682B2 (en) * 2015-10-09 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices
US9856404B2 (en) 2015-11-11 2018-01-02 International Business Machines Corporation Self-heating sealant or adhesive employing multi-compartment microcapsules
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US9596788B1 (en) * 2015-11-26 2017-03-14 Chung-Ping Lai Hexagonal boron nitride heat dissipation structure
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Also Published As

Publication number Publication date
WO2005013362A1 (en) 2005-02-10
CN1830082A (zh) 2006-09-06
KR20060059989A (ko) 2006-06-02
US7408787B2 (en) 2008-08-05
TWI244880B (en) 2005-12-01
US20050041406A1 (en) 2005-02-24
KR101181102B1 (ko) 2012-09-07
EP1654759A1 (de) 2006-05-10
EP1654759B1 (de) 2012-02-29
TW200524487A (en) 2005-07-16
CN100477182C (zh) 2009-04-08

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