ATE549748T1 - Verfahren zur herstellung eines dual-gate fet - Google Patents

Verfahren zur herstellung eines dual-gate fet

Info

Publication number
ATE549748T1
ATE549748T1 AT06710721T AT06710721T ATE549748T1 AT E549748 T1 ATE549748 T1 AT E549748T1 AT 06710721 T AT06710721 T AT 06710721T AT 06710721 T AT06710721 T AT 06710721T AT E549748 T1 ATE549748 T1 AT E549748T1
Authority
AT
Austria
Prior art keywords
dual
layer
gate fet
protrusion
gate
Prior art date
Application number
AT06710721T
Other languages
English (en)
Inventor
Noort Wibo Van
Franciscus Widdershoven
Radu Surdeanu
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of ATE549748T1 publication Critical patent/ATE549748T1/de

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P10/00Bonding of wafers, substrates or parts of devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/024Manufacture or treatment of FETs having insulated gates [IGFET] of fin field-effect transistors [FinFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/62Fin field-effect transistors [FinFET]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/62Fin field-effect transistors [FinFET]
    • H10D30/6212Fin field-effect transistors [FinFET] having fin-shaped semiconductor bodies having non-rectangular cross-sections
    • H10D30/6213Fin field-effect transistors [FinFET] having fin-shaped semiconductor bodies having non-rectangular cross-sections having rounded corners

Landscapes

  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Thin Film Transistor (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
AT06710721T 2005-01-28 2006-01-23 Verfahren zur herstellung eines dual-gate fet ATE549748T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05100571 2005-01-28
PCT/IB2006/050238 WO2006079964A2 (en) 2005-01-28 2006-01-23 Method of fabricating a dual-gate fet

Publications (1)

Publication Number Publication Date
ATE549748T1 true ATE549748T1 (de) 2012-03-15

Family

ID=36570476

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06710721T ATE549748T1 (de) 2005-01-28 2006-01-23 Verfahren zur herstellung eines dual-gate fet

Country Status (8)

Country Link
US (1) US7741182B2 (de)
EP (1) EP1844498B1 (de)
JP (1) JP2008529295A (de)
KR (1) KR20070099671A (de)
CN (1) CN100583452C (de)
AT (1) ATE549748T1 (de)
TW (1) TW200711000A (de)
WO (1) WO2006079964A2 (de)

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FR2910999B1 (fr) * 2006-12-28 2009-04-03 Commissariat Energie Atomique Cellule memoire dotee de transistors double-grille, a grilles independantes et asymetriques
US8288756B2 (en) * 2007-11-30 2012-10-16 Advanced Micro Devices, Inc. Hetero-structured, inverted-T field effect transistor
WO2010003928A2 (en) 2008-07-06 2010-01-14 Interuniversitair Microelektronica Centrum Vzw (Imec) Method for doping semiconductor structures and the semiconductor device thereof
CN103107088B (zh) * 2011-11-11 2016-06-01 中芯国际集成电路制造(上海)有限公司 具有周围栅极结构的鳍型场效应晶体管及其制造方法
CN103295900B (zh) * 2012-03-02 2016-08-10 中芯国际集成电路制造(上海)有限公司 形成鳍部及鳍式场效应晶体管的方法
US8987790B2 (en) 2012-11-26 2015-03-24 International Business Machines Corporation Fin isolation in multi-gate field effect transistors
US9318606B2 (en) * 2013-01-14 2016-04-19 Taiwan Semiconductor Manufacturing Company, Ltd. FinFET device and method of fabricating same
US9147682B2 (en) 2013-01-14 2015-09-29 Taiwan Semiconductor Manufacturing Company, Ltd. Fin spacer protected source and drain regions in FinFETs
CN109950318B (zh) * 2013-06-20 2022-06-10 英特尔公司 具有掺杂的子鳍片区域的非平面半导体器件及其制造方法
US10468528B2 (en) 2014-04-16 2019-11-05 Taiwan Semiconductor Manufacturing Company, Ltd. FinFET device with high-k metal gate stack
US9721955B2 (en) 2014-04-25 2017-08-01 Taiwan Semiconductor Manufacturing Company, Ltd. Structure and method for SRAM FinFET device having an oxide feature
US9178067B1 (en) 2014-04-25 2015-11-03 Taiwan Semiconductor Manufacturing Company, Ltd. Structure and method for FinFET device
US9224736B1 (en) 2014-06-27 2015-12-29 Taiwan Semicondcutor Manufacturing Company, Ltd. Structure and method for SRAM FinFET device
US9263555B2 (en) * 2014-07-03 2016-02-16 Globalfoundries Inc. Methods of forming a channel region for a semiconductor device by performing a triple cladding process
CN105514163B (zh) * 2014-09-26 2018-09-07 中芯国际集成电路制造(上海)有限公司 鳍式场效应晶体管及其形成方法
CN105870014B (zh) * 2015-01-19 2019-06-14 中国科学院微电子研究所 一种鳍的形成方法
CN105990172B (zh) * 2015-01-30 2018-07-31 上海华力微电子有限公司 嵌入式SiGe外延测试块的设计
TWI595650B (zh) * 2015-05-21 2017-08-11 蘇烱光 適應性雙閘極金氧半場效電晶體
CN104934480B (zh) * 2015-06-30 2017-11-24 上海华力微电子有限公司 鳍式场效应晶体管结构及其制作方法
CN105047717A (zh) * 2015-06-30 2015-11-11 上海华力微电子有限公司 鳍式场效应晶体管结构及其制作方法
EP3329598A4 (de) 2015-07-29 2019-07-31 Circuit Seed, LLC Komplementäre stromfeldeffekttransistorvorrichtungen und verstärker
CN108141180A (zh) 2015-07-30 2018-06-08 电路种子有限责任公司 基于互补电流场效应晶体管装置的低噪声跨阻抗放大器
US10491177B2 (en) 2015-07-30 2019-11-26 Circuit Seed, Llc Multi-stage and feed forward compensated complementary current field effect transistor amplifiers
WO2017019981A1 (en) 2015-07-30 2017-02-02 Circuit Seed, Llc Reference generator and current source transistor based on complementary current field-effect transistor devices
US9818873B2 (en) * 2015-10-09 2017-11-14 Globalfoundries Inc. Forming stressed epitaxial layers between gates separated by different pitches
US10283506B2 (en) 2015-12-14 2019-05-07 Circuit Seed, Llc Super-saturation current field effect transistor and trans-impedance MOS device
CN106057678B (zh) * 2016-06-17 2019-07-30 中国科学院微电子研究所 基于外延层的半导体器件及其制造方法及包括其的电子设备
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FR3114686B1 (fr) * 2020-09-30 2023-03-31 St Microelectronics Rousset Transistor MOS à triple grille et procédé de fabrication d’un tel transistor

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US7078299B2 (en) * 2003-09-03 2006-07-18 Advanced Micro Devices, Inc. Formation of finFET using a sidewall epitaxial layer
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Also Published As

Publication number Publication date
TW200711000A (en) 2007-03-16
US20080318375A1 (en) 2008-12-25
EP1844498B1 (de) 2012-03-14
WO2006079964A3 (en) 2006-11-02
US7741182B2 (en) 2010-06-22
CN100583452C (zh) 2010-01-20
WO2006079964A2 (en) 2006-08-03
CN101142686A (zh) 2008-03-12
JP2008529295A (ja) 2008-07-31
KR20070099671A (ko) 2007-10-09
EP1844498A2 (de) 2007-10-17

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