ATE552919T1 - Megaschallsonde für schallenergieführung - Google Patents

Megaschallsonde für schallenergieführung

Info

Publication number
ATE552919T1
ATE552919T1 AT03703722T AT03703722T ATE552919T1 AT E552919 T1 ATE552919 T1 AT E552919T1 AT 03703722 T AT03703722 T AT 03703722T AT 03703722 T AT03703722 T AT 03703722T AT E552919 T1 ATE552919 T1 AT E552919T1
Authority
AT
Austria
Prior art keywords
substrate
transmitter
megasonic
liquid
vibration
Prior art date
Application number
AT03703722T
Other languages
English (en)
Inventor
Mario Bran
Original Assignee
Akrion Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akrion Technologies Inc filed Critical Akrion Technologies Inc
Application granted granted Critical
Publication of ATE552919T1 publication Critical patent/ATE552919T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B3/00—Methods or apparatus specially adapted for transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
AT03703722T 2002-01-29 2003-01-07 Megaschallsonde für schallenergieführung ATE552919T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/059,682 US7287537B2 (en) 2002-01-29 2002-01-29 Megasonic probe energy director
PCT/US2003/000439 WO2003064064A1 (en) 2002-01-29 2003-01-07 Megasonic probe energy director

Publications (1)

Publication Number Publication Date
ATE552919T1 true ATE552919T1 (de) 2012-04-15

Family

ID=27609868

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03703722T ATE552919T1 (de) 2002-01-29 2003-01-07 Megaschallsonde für schallenergieführung

Country Status (7)

Country Link
US (2) US7287537B2 (de)
EP (1) EP1469953B1 (de)
JP (1) JP2005515890A (de)
KR (1) KR20040098634A (de)
CN (1) CN100344385C (de)
AT (1) ATE552919T1 (de)
WO (1) WO2003064064A1 (de)

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EP1635960A2 (de) * 2003-06-06 2006-03-22 P.C.T. Systems, Inc. Verfahren und vorrichtung zur bearbeitung von substraten mit megaschallenergie
DE10361075A1 (de) * 2003-12-22 2005-07-28 Pac Tech - Packaging Technologies Gmbh Verfahren und Vorichtung zur Trocknung von Schaltungssubstraten
DE102005007056A1 (de) * 2005-02-15 2006-08-24 Dieter Weber Ultraschall-Stabschwinger
US9228785B2 (en) 2010-05-04 2016-01-05 Alexander Poltorak Fractal heat transfer device
US10852069B2 (en) 2010-05-04 2020-12-01 Fractal Heatsink Technologies, LLC System and method for maintaining efficiency of a fractal heat sink
US8957564B1 (en) 2010-06-29 2015-02-17 Silicon Light Machines Corporation Microelectromechanical system megasonic transducer
JP5758111B2 (ja) * 2010-12-02 2015-08-05 株式会社ディスコ 切削装置
US20150107619A1 (en) * 2013-10-22 2015-04-23 Taiwan Semiconductor Manufacturing Company Limited Wafer particle removal
DE102015106343A1 (de) * 2015-04-24 2016-10-27 Weber Ultrasonics Gmbh Vorrichtung und Verfahren zum Entgraten von Bauteilen mittels Ultraschall
WO2018013668A1 (en) 2016-07-12 2018-01-18 Alexander Poltorak System and method for maintaining efficiency of a heat sink
CN106040647A (zh) * 2016-08-02 2016-10-26 孔兵 一种中药材清洗分筛装置
US20180147611A1 (en) * 2016-11-29 2018-05-31 1863815 Ontario Limited Apparatus, System and Method for Cleaning Inner Surfaces of Tubing
WO2019018446A1 (en) 2017-07-17 2019-01-24 Fractal Heatsink Technologies, LLC SYSTEM AND METHOD FOR MULTI-FRACTAL THERMAL DISSIPATOR
CN108783503A (zh) * 2018-07-03 2018-11-13 洛阳河洛人家农业发展有限公司 一种无花果的分拣运输车

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US3883163A (en) * 1972-09-25 1975-05-13 Nils Olof Nestenius Machines for stitching cushions, mattresses and the like
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US4016436A (en) * 1975-12-10 1977-04-05 Branson Ultrasonics Corporation Sonic or ultrasonic processing apparatus
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Also Published As

Publication number Publication date
EP1469953A1 (de) 2004-10-27
KR20040098634A (ko) 2004-11-20
US20030141784A1 (en) 2003-07-31
US7287537B2 (en) 2007-10-30
CN100344385C (zh) 2007-10-24
WO2003064064A1 (en) 2003-08-07
US20080264442A1 (en) 2008-10-30
US7614406B2 (en) 2009-11-10
EP1469953B1 (de) 2012-04-11
JP2005515890A (ja) 2005-06-02
CN1638880A (zh) 2005-07-13

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