ATE553495T1 - Verbesserte sputter-target-nutzung - Google Patents

Verbesserte sputter-target-nutzung

Info

Publication number
ATE553495T1
ATE553495T1 AT06817742T AT06817742T ATE553495T1 AT E553495 T1 ATE553495 T1 AT E553495T1 AT 06817742 T AT06817742 T AT 06817742T AT 06817742 T AT06817742 T AT 06817742T AT E553495 T1 ATE553495 T1 AT E553495T1
Authority
AT
Austria
Prior art keywords
target
sputter target
target usage
end regions
improved sputter
Prior art date
Application number
AT06817742T
Other languages
English (en)
Inventor
Stefan Schneider
Marcel Mueller
Jiri Vyskocil
Israel Wagner
Original Assignee
Oerlikon Solar Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Solar Ag filed Critical Oerlikon Solar Ag
Application granted granted Critical
Publication of ATE553495T1 publication Critical patent/ATE553495T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3455—Movable magnets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3458—Electromagnets in particular for cathodic sputtering apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3464—Operating strategies
    • H01J37/347—Thickness uniformity of coated layers or desired profile of target erosion

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
AT06817742T 2005-12-13 2006-12-12 Verbesserte sputter-target-nutzung ATE553495T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US74978905P 2005-12-13 2005-12-13
PCT/CH2006/000690 WO2007068133A1 (en) 2005-12-13 2006-12-12 Improved sputter target utilization

Publications (1)

Publication Number Publication Date
ATE553495T1 true ATE553495T1 (de) 2012-04-15

Family

ID=37814182

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06817742T ATE553495T1 (de) 2005-12-13 2006-12-12 Verbesserte sputter-target-nutzung

Country Status (7)

Country Link
US (1) US8273221B2 (de)
EP (1) EP1964150B1 (de)
JP (1) JP5171636B2 (de)
KR (1) KR20080080365A (de)
CN (1) CN101375366B (de)
AT (1) ATE553495T1 (de)
WO (1) WO2007068133A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9812302B2 (en) * 2007-03-16 2017-11-07 National University Corporation Tohoku University Magnetron sputtering apparatus
JP5283084B2 (ja) * 2007-04-06 2013-09-04 国立大学法人東北大学 マグネトロンスパッタ装置
WO2011068263A1 (ko) * 2009-12-03 2011-06-09 (주)에스엔텍 원통형 스퍼터링 캐소드
KR101187977B1 (ko) 2009-12-08 2012-10-05 삼성전기주식회사 패키지 기판 및 그의 제조방법
CN103459658B (zh) * 2011-01-13 2015-09-23 明尼苏达大学董事会 纳米颗粒沉积系统
US20160133445A9 (en) * 2011-11-04 2016-05-12 Intevac, Inc. Sputtering system and method for highly magnetic materials
CN102595764A (zh) * 2012-03-13 2012-07-18 苏州爱因智能设备有限公司 用于电子直线加速器的自动频率控制驱动装置
US9249987B2 (en) 2013-01-30 2016-02-02 Honeywell International Inc. Mounting bracket for use with a water heater
JP2016518240A (ja) 2013-02-15 2016-06-23 リージェンツ オブ ザ ユニバーシティ オブ ミネソタ 粒子の官能化
JP6403269B2 (ja) * 2014-07-30 2018-10-10 株式会社神戸製鋼所 アーク蒸発源
EP3091101B1 (de) 2015-05-06 2018-10-17 safematic GmbH Beschichtungseinheit
EP3091561B1 (de) 2015-05-06 2019-09-04 safematic GmbH Sputtereinheit
US10151023B2 (en) 2016-06-27 2018-12-11 Cardinal Cg Company Laterally adjustable return path magnet assembly and methods
US10056238B2 (en) 2016-06-27 2018-08-21 Cardinal Cg Company Adjustable return path magnet assembly and methods
EP3619735B1 (de) 2017-05-04 2021-07-07 Cardinal CG Company Sputtering-beschichtungssystem mit einer anpassbaren und flexiblen rückwegmagnetanordnung
TWI740098B (zh) * 2019-01-29 2021-09-21 友威科技股份有限公司 具異磁性强度分布的磁性靶材
CN110592542A (zh) * 2019-08-03 2019-12-20 山东司莱美克新材料科技有限公司 一种磁控溅射镀膜系统及其控制方法
KR102675105B1 (ko) * 2022-04-01 2024-06-14 세메스 주식회사 플라즈마 처리 장치

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4166018A (en) 1974-01-31 1979-08-28 Airco, Inc. Sputtering process and apparatus
US3956093A (en) 1974-12-16 1976-05-11 Airco, Inc. Planar magnetron sputtering method and apparatus
DE2707144A1 (de) 1976-02-19 1977-08-25 Sloan Technology Corp Kathodenzerstaeubungsvorrichtung
JPS5747870A (en) * 1980-09-04 1982-03-18 Fujitsu Ltd Magnetron sputtering method for ferromagnetic material
US4356073A (en) 1981-02-12 1982-10-26 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
JPS57190320A (en) 1981-05-20 1982-11-22 Toshiba Corp Dry etching method
US4466877A (en) 1983-10-11 1984-08-21 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
JPS6134177A (ja) 1984-07-25 1986-02-18 Tokuda Seisakusho Ltd マグネツト駆動装置
JPS61295368A (ja) * 1985-06-25 1986-12-26 Shinku Kikai Kogyo Kk マグネトロンスパツタ用カソ−ド
JPS61295369A (ja) 1985-06-25 1986-12-26 Nec Corp スパツタリング装置
DE4017111C2 (de) * 1990-05-28 1998-01-29 Hauzer Holding Lichtbogen-Magnetron-Vorrichtung
JPH0230757A (ja) 1988-07-19 1990-02-01 Tokyo Electron Ltd マグネトロンスパッタリング方法
DE3929695C2 (de) * 1989-09-07 1996-12-19 Leybold Ag Vorrichtung zum Beschichten eines Substrats
JPH04276069A (ja) 1991-03-04 1992-10-01 Ube Ind Ltd スパッタリング方法およびその装置
DE4107505A1 (de) 1991-03-08 1992-09-10 Leybold Ag Verfahren zum betrieb einer sputteranlage und vorrichtung zur durchfuehrung des verfahrens
US5399253A (en) 1992-12-23 1995-03-21 Balzers Aktiengesellschaft Plasma generating device
JPH1143766A (ja) * 1997-07-23 1999-02-16 Matsushita Electric Ind Co Ltd 薄膜形成方法及び装置
EP0918351A1 (de) * 1997-11-19 1999-05-26 Sinvaco N.V. Flaches magnetron mit bewegbarer Magnetsanlage
DE69937948D1 (de) 1999-06-21 2008-02-21 Bekaert Advanced Coatings N V Magnetron mit beweglicher Magnetanordnung zur Kompensation des Erosionsprofils
US7101466B2 (en) * 2003-09-19 2006-09-05 Kdf Electronic + Vacuum Services Inc Linear sweeping magnetron sputtering cathode and scanning in-line system for arc-free reactive deposition and high target utilization

Also Published As

Publication number Publication date
CN101375366B (zh) 2011-04-27
KR20080080365A (ko) 2008-09-03
WO2007068133A1 (en) 2007-06-21
JP5171636B2 (ja) 2013-03-27
EP1964150A1 (de) 2008-09-03
US20070175749A1 (en) 2007-08-02
CN101375366A (zh) 2009-02-25
EP1964150B1 (de) 2012-04-11
JP2009519375A (ja) 2009-05-14
US8273221B2 (en) 2012-09-25

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