ATE554486T1 - Keramik-chip-anordnung - Google Patents

Keramik-chip-anordnung

Info

Publication number
ATE554486T1
ATE554486T1 AT09012025T AT09012025T ATE554486T1 AT E554486 T1 ATE554486 T1 AT E554486T1 AT 09012025 T AT09012025 T AT 09012025T AT 09012025 T AT09012025 T AT 09012025T AT E554486 T1 ATE554486 T1 AT E554486T1
Authority
AT
Austria
Prior art keywords
ceramic base
pair
ceramic
ceramic chip
external electrodes
Prior art date
Application number
AT09012025T
Other languages
English (en)
Inventor
Sun-Ki Kim
Suk-Joo Lee
Original Assignee
Joinset Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Joinset Co Ltd filed Critical Joinset Co Ltd
Application granted granted Critical
Publication of ATE554486T1 publication Critical patent/ATE554486T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/008—Thermistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Thermistors And Varistors (AREA)
AT09012025T 2008-10-09 2009-09-22 Keramik-chip-anordnung ATE554486T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20080099110 2008-10-09
KR20090060215A KR101038755B1 (ko) 2008-10-09 2009-07-02 세라믹 칩 어셈블리

Publications (1)

Publication Number Publication Date
ATE554486T1 true ATE554486T1 (de) 2012-05-15

Family

ID=42216414

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09012025T ATE554486T1 (de) 2008-10-09 2009-09-22 Keramik-chip-anordnung

Country Status (4)

Country Link
JP (1) JP2010093258A (de)
KR (1) KR101038755B1 (de)
CN (1) CN101719418B (de)
AT (1) ATE554486T1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI590511B (zh) * 2010-07-02 2017-07-01 太谷電子日本合同公司 Ｐｔｃ裝置及具有ｐｔｃ裝置的二次電池
KR101036951B1 (ko) * 2010-07-28 2011-05-25 김선기 세라믹 칩 어셈블리
KR101008310B1 (ko) * 2010-07-30 2011-01-13 김선기 세라믹 칩 어셈블리
KR101110482B1 (ko) 2011-11-29 2012-02-20 디에스씨전자 주식회사 고절연 특성 부온도계수(ｎｔｃ) 써미스터
JP6278957B2 (ja) * 2012-05-14 2018-02-14 深▲セン▼市敏▲傑▼▲電▼子科技有限公司 表面温度計測の温度センサー
JP2013219404A (ja) * 2013-08-02 2013-10-24 Sumida Corporation アンテナ部品の製造方法
US9653205B2 (en) * 2014-04-30 2017-05-16 Cyntec Co., Ltd. Electrode structure and the corresponding electrical component using the same and the fabrication method thereof
KR101494634B1 (ko) * 2014-08-26 2015-02-23 한국세라믹기술원 써미스터 소자의 가속 수명 시험방법
CN108028308B (zh) * 2015-07-21 2019-07-23 皇家飞利浦有限公司 换能器层压板
JP6716701B2 (ja) * 2016-08-04 2020-07-01 岡本株式会社 電子機能部材およびそれを用いた編物製品並びに電子機能部材の製造方法
JP7082539B2 (ja) * 2018-07-13 2022-06-08 ニチコン株式会社 Ｐｔｃサーミスタ
CN112530650B (zh) * 2020-12-22 2022-07-19 湖州浩通电子科技有限公司 一种陶瓷热敏元件
CN116315747A (zh) * 2023-02-07 2023-06-23 中国航发四川燃气涡轮研究院 一种铠装引线与导线的转接装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5797907U (de) * 1980-12-03 1982-06-16
JPS6312125A (ja) * 1987-05-22 1988-01-19 太陽誘電株式会社 電気部品配列物の製造方法
JP3150180B2 (ja) * 1991-12-19 2001-03-26 ティーディーケイ株式会社 サーミスタ素子の製造方法
JPH05347201A (ja) * 1992-06-15 1993-12-27 Tdk Corp 薄膜抵抗器
CN2144852Y (zh) * 1992-10-29 1993-10-27 蔡雅凤 过电流保护快速响应正温度系数热敏电阻器
JP3494709B2 (ja) * 1994-06-07 2004-02-09 石塚電子株式会社 温度センサとそのリードフレーム
JPH08128901A (ja) * 1994-10-31 1996-05-21 Sanyo Electric Co Ltd 温度センサーとパック電池
KR0174589B1 (ko) * 1995-09-07 1999-04-01 우덕창 리드 부착형 ntc 서미스터
JPH09297069A (ja) * 1996-05-07 1997-11-18 Tdk Corp 温度検知用センサ
JPH1154301A (ja) * 1997-08-07 1999-02-26 Murata Mfg Co Ltd チップ型サーミスタ
JP2001141575A (ja) * 1999-11-17 2001-05-25 Matsushita Electric Ind Co Ltd 温度センサ素子およびその素子を用いた温度センサ
JP3516204B2 (ja) * 1999-11-26 2004-04-05 Ｔｄｋ株式会社 温度検知用センサの組立方法並びに同センサ
JP4547475B2 (ja) * 2004-08-20 2010-09-22 石塚電子株式会社 平板型温度センサ
KR100734788B1 (ko) * 2005-11-25 2007-07-04 주식회사 제임스텍 부온도계수 써미스터 온도센서 및 그 제조방법

Also Published As

Publication number Publication date
CN101719418B (zh) 2011-08-31
KR20100040241A (ko) 2010-04-19
CN101719418A (zh) 2010-06-02
JP2010093258A (ja) 2010-04-22
KR101038755B1 (ko) 2011-06-03

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