ATE555179T1 - Teilchenförmiges schleifmaterial und verfahren zur planierung eines werkstücks mithilfe des teilchenförmigen schleifmaterials - Google Patents
Teilchenförmiges schleifmaterial und verfahren zur planierung eines werkstücks mithilfe des teilchenförmigen schleifmaterialsInfo
- Publication number
- ATE555179T1 ATE555179T1 AT06825992T AT06825992T ATE555179T1 AT E555179 T1 ATE555179 T1 AT E555179T1 AT 06825992 T AT06825992 T AT 06825992T AT 06825992 T AT06825992 T AT 06825992T AT E555179 T1 ATE555179 T1 AT E555179T1
- Authority
- AT
- Austria
- Prior art keywords
- abrasive material
- particle abrasive
- planning
- workpiece
- particle
- Prior art date
Links
- 239000002245 particle Substances 0.000 title abstract 5
- 239000003082 abrasive agent Substances 0.000 title 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 4
- 230000007704 transition Effects 0.000 abstract 2
- 239000011236 particulate material Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
- C01F7/00—Compounds of aluminium
- C01F7/02—Aluminium oxide; Aluminium hydroxide; Aluminates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/02—Amorphous compounds
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/10—Particle morphology extending in one dimension, e.g. needle-like
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/20—Particle morphology extending in two dimensions, e.g. plate-like
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/54—Particles characterised by their aspect ratio, i.e. the ratio of sizes in the longest to the shortest dimension
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/10—Solid density
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Nanotechnology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Inorganic Chemistry (AREA)
- Geology (AREA)
- Physics & Mathematics (AREA)
- Composite Materials (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/251,633 US8685123B2 (en) | 2005-10-14 | 2005-10-14 | Abrasive particulate material, and method of planarizing a workpiece using the abrasive particulate material |
| PCT/US2006/040295 WO2007047547A2 (en) | 2005-10-14 | 2006-10-13 | Abrasive particulate material, and method of planarizing a workpiece using the abrasive particulate material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE555179T1 true ATE555179T1 (de) | 2012-05-15 |
Family
ID=37722443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT06825992T ATE555179T1 (de) | 2005-10-14 | 2006-10-13 | Teilchenförmiges schleifmaterial und verfahren zur planierung eines werkstücks mithilfe des teilchenförmigen schleifmaterials |
Country Status (18)
| Country | Link |
|---|---|
| US (1) | US8685123B2 (de) |
| EP (1) | EP1934300B1 (de) |
| JP (1) | JP5384938B2 (de) |
| KR (1) | KR101120417B1 (de) |
| CN (1) | CN101370896B (de) |
| AT (1) | ATE555179T1 (de) |
| AU (1) | AU2006304356B2 (de) |
| BR (1) | BRPI0617413A2 (de) |
| CA (1) | CA2625273C (de) |
| IL (1) | IL190737A0 (de) |
| MY (1) | MY145461A (de) |
| NO (1) | NO20082195L (de) |
| NZ (1) | NZ567318A (de) |
| RU (1) | RU2401856C2 (de) |
| TW (1) | TWI308928B (de) |
| UA (1) | UA87938C2 (de) |
| WO (1) | WO2007047547A2 (de) |
| ZA (1) | ZA200803185B (de) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8685123B2 (en) | 2005-10-14 | 2014-04-01 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive particulate material, and method of planarizing a workpiece using the abrasive particulate material |
| US20070287004A1 (en) * | 2006-05-25 | 2007-12-13 | Gottzmann Andreas M | Laminate and Method of Manufacture |
| FR2906800B1 (fr) * | 2006-10-09 | 2008-11-28 | Rhodia Recherches & Tech | Suspension liquide et poudre de particules d'oxyde de cerium, procedes de preparation de celles-ci et utilisation dans le polissage |
| US7837888B2 (en) * | 2006-11-13 | 2010-11-23 | Cabot Microelectronics Corporation | Composition and method for damascene CMP |
| KR20100125339A (ko) * | 2008-03-03 | 2010-11-30 | 유니버시티 오브 플로리다 리서치 파운데이션, 인크. | 나노입자 졸-겔 복합 혼성 투명 코팅 물질 |
| WO2009151120A1 (ja) * | 2008-06-13 | 2009-12-17 | 株式会社 フジミインコーポレーテッド | アルミニウム酸化物粒子及びそれを含有する研磨用組成物 |
| US8382016B2 (en) * | 2009-02-25 | 2013-02-26 | Thiele Kaolin Company | Nano particle mineral pigment |
| CN102348535B (zh) * | 2009-03-11 | 2015-01-14 | 圣戈班磨料磨具有限公司 | 包含具有改进形状的熔凝的氧化锆氧化铝颗粒的磨料物品 |
| KR20140000496A (ko) * | 2012-06-22 | 2014-01-03 | 에스케이하이닉스 주식회사 | 연마 조성물, 이의 제조 방법 및 이를 이용한 화학적 기계적 연마 방법 |
| KR101889698B1 (ko) | 2013-09-30 | 2018-08-21 | 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 | 형상화 연마입자 및 이의 형성 방법 |
| CN104726061A (zh) * | 2013-12-19 | 2015-06-24 | 3M创新有限公司 | 磨料、研磨件及其制备方法 |
| CN103952084B (zh) * | 2014-04-29 | 2016-03-23 | 德米特(苏州)电子环保材料有限公司 | 一种氧化铝基质的金属抛光液的制备方法 |
| JP6233296B2 (ja) * | 2014-12-26 | 2017-11-22 | 株式会社Sumco | 砥粒の評価方法、および、シリコンウェーハの製造方法 |
| JP6803176B2 (ja) * | 2016-08-26 | 2020-12-23 | 一般財団法人ファインセラミックスセンター | 多孔質アルミナ粒子材料の製造方法 |
| WO2021049154A1 (ja) * | 2019-09-11 | 2021-03-18 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびこれを用いた研磨方法 |
| KR102261151B1 (ko) | 2020-02-27 | 2021-06-07 | 비드오리진(주) | 표면 돌기가 형성된 구형 무기 입자 및 그 제조 방법 |
| EP4314179A4 (de) * | 2021-03-29 | 2025-06-18 | Entegris, Inc. | Suspension zur chemisch-mechanischen planarisierung (cmp) und verfahren damit |
| JP7638349B1 (ja) * | 2023-10-26 | 2025-03-03 | 株式会社トッパンインフォメディア | 研磨スラリー |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4318896A (en) * | 1980-04-14 | 1982-03-09 | Uop Inc. | Manufacture of alumina particles |
| US4835124A (en) * | 1985-09-30 | 1989-05-30 | Aluminum Company Of America | Alumina ceramic product from colloidal alumina |
| US5302368A (en) * | 1987-01-29 | 1994-04-12 | Sumitomo Chemical Company, Limited | Process for preparation of alumina |
| US4797139A (en) * | 1987-08-11 | 1989-01-10 | Norton Company | Boehmite produced by a seeded hydyothermal process and ceramic bodies produced therefrom |
| JPH04193712A (ja) | 1990-11-26 | 1992-07-13 | Sumitomo Chem Co Ltd | 遷移アルミナおよびその製造方法 |
| DE4118564A1 (de) | 1991-06-06 | 1992-12-17 | Vaw Ver Aluminium Werke Ag | Teilkristalline uebergangsaluminiumoxide, verfahren zu deren herstellung und verwendung zur gewinnung von formkoerpern, die im wesentlichen aus gamma-al(pfeil abwaerts)2(pfeil abwaerts)o(pfeil abwaerts)3(pfeil abwaerts) bestehen |
| FR2678922B1 (fr) * | 1991-07-08 | 1994-03-25 | Sumitomo Chemical Cy Ltd | Poudre d'alumine theta, son procede de preparation et support d'enregistrement magnetique la contenant. |
| US5527423A (en) * | 1994-10-06 | 1996-06-18 | Cabot Corporation | Chemical mechanical polishing slurry for metal layers |
| US5725162A (en) * | 1995-04-05 | 1998-03-10 | Saint Gobain/Norton Industrial Ceramics Corporation | Firing sol-gel alumina particles |
| KR960041316A (ko) * | 1995-05-22 | 1996-12-19 | 고사이 아키오 | 연마용 입상체, 이의 제조방법 및 이의 용도 |
| US5693239A (en) * | 1995-10-10 | 1997-12-02 | Rodel, Inc. | Polishing slurries comprising two abrasive components and methods for their use |
| JPH10125638A (ja) | 1996-08-29 | 1998-05-15 | Sumitomo Chem Co Ltd | 研磨用組成物及びそれを使用した半導体基板上の金属膜の平坦化方法 |
| KR19980019046A (ko) * | 1996-08-29 | 1998-06-05 | 고사이 아키오 | 연마용 조성물 및 이의 용도(Abrasive composition and use of the same) |
| US6194317B1 (en) * | 1998-04-30 | 2001-02-27 | 3M Innovative Properties Company | Method of planarizing the upper surface of a semiconductor wafer |
| JPH11268911A (ja) | 1998-01-08 | 1999-10-05 | Nissan Chem Ind Ltd | アルミナ粉末及びその製造方法並びに研磨用組成物 |
| MY117813A (en) * | 1998-01-08 | 2004-08-30 | Nissan Chemical Ind Ltd | Alumina powder, process for producing the same and polishing composition. |
| JP3545950B2 (ja) | 1998-10-29 | 2004-07-21 | ロデール・ニッタ株式会社 | 研磨用組成物 |
| JP4134458B2 (ja) | 1999-06-23 | 2008-08-20 | Jsr株式会社 | 半導体部品用洗浄剤、半導体部品の洗浄方法 |
| EP1256548A4 (de) | 1999-12-27 | 2004-05-19 | Showa Denko Kk | Aluminiumoxidteilchen, verfahren zu deren herstellung, zusammensetzung diese enthaltend, sowie aluminiumoxidaufschlämmung zum polieren |
| US7067105B2 (en) * | 1999-12-27 | 2006-06-27 | Showa Denko K.K. | Alumina particles, production process thereof, composition comprising the particles and alumina slurry for polishing |
| TWI272249B (en) * | 2001-02-27 | 2007-02-01 | Nissan Chemical Ind Ltd | Crystalline ceric oxide sol and process for producing the same |
| US6756340B2 (en) * | 2002-04-08 | 2004-06-29 | Uop Llc | Dehydrogenation catalyst composition |
| TWI307712B (en) * | 2002-08-28 | 2009-03-21 | Kao Corp | Polishing composition |
| US7344988B2 (en) * | 2003-10-27 | 2008-03-18 | Dupont Air Products Nanomaterials Llc | Alumina abrasive for chemical mechanical polishing |
| DE10360087A1 (de) | 2003-12-20 | 2005-07-21 | Degussa Ag | Flammenhydrolytisch hergestelltes, hochoberflächiges Aluminiumoxidpulver |
| TW200531924A (en) * | 2004-03-12 | 2005-10-01 | Sumitomo Chemical Co | Method for producing α-alumina particle |
| US20060104895A1 (en) | 2004-11-18 | 2006-05-18 | Saint-Gobain Ceramics & Plastics, Inc. | Transitional alumina particulate materials having controlled morphology and processing for forming same |
| TWI271555B (en) | 2005-06-13 | 2007-01-21 | Basf Ag | Slurry composition for polishing color filter |
| US8685123B2 (en) | 2005-10-14 | 2014-04-01 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive particulate material, and method of planarizing a workpiece using the abrasive particulate material |
-
2005
- 2005-10-14 US US11/251,633 patent/US8685123B2/en active Active
-
2006
- 2006-10-13 CN CN2006800463685A patent/CN101370896B/zh active Active
- 2006-10-13 CA CA2625273A patent/CA2625273C/en not_active Expired - Fee Related
- 2006-10-13 RU RU2008114107/04A patent/RU2401856C2/ru not_active IP Right Cessation
- 2006-10-13 AT AT06825992T patent/ATE555179T1/de active
- 2006-10-13 JP JP2008535762A patent/JP5384938B2/ja active Active
- 2006-10-13 UA UAA200804717A patent/UA87938C2/ru unknown
- 2006-10-13 TW TW095137814A patent/TWI308928B/zh active
- 2006-10-13 EP EP06825992A patent/EP1934300B1/de not_active Not-in-force
- 2006-10-13 NZ NZ567318A patent/NZ567318A/en unknown
- 2006-10-13 KR KR1020087011372A patent/KR101120417B1/ko active Active
- 2006-10-13 WO PCT/US2006/040295 patent/WO2007047547A2/en not_active Ceased
- 2006-10-13 AU AU2006304356A patent/AU2006304356B2/en not_active Ceased
- 2006-10-13 BR BRPI0617413-2A patent/BRPI0617413A2/pt not_active IP Right Cessation
-
2008
- 2008-04-09 IL IL190737A patent/IL190737A0/en unknown
- 2008-04-10 ZA ZA200803185A patent/ZA200803185B/xx unknown
- 2008-04-11 MY MYPI20081089A patent/MY145461A/en unknown
- 2008-05-13 NO NO20082195A patent/NO20082195L/no not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| AU2006304356B2 (en) | 2010-07-01 |
| WO2007047547A2 (en) | 2007-04-26 |
| RU2008114107A (ru) | 2009-11-20 |
| IL190737A0 (en) | 2008-11-03 |
| BRPI0617413A2 (pt) | 2011-07-26 |
| TW200724657A (en) | 2007-07-01 |
| JP5384938B2 (ja) | 2014-01-08 |
| EP1934300B1 (de) | 2012-04-25 |
| US8685123B2 (en) | 2014-04-01 |
| UA87938C2 (ru) | 2009-08-25 |
| US20070084134A1 (en) | 2007-04-19 |
| KR20080066799A (ko) | 2008-07-16 |
| TWI308928B (en) | 2009-04-21 |
| WO2007047547A3 (en) | 2007-06-14 |
| CN101370896B (zh) | 2012-10-17 |
| ZA200803185B (en) | 2009-01-28 |
| JP2009511719A (ja) | 2009-03-19 |
| EP1934300A2 (de) | 2008-06-25 |
| MY145461A (en) | 2012-02-15 |
| AU2006304356A1 (en) | 2007-04-26 |
| RU2401856C2 (ru) | 2010-10-20 |
| KR101120417B1 (ko) | 2012-03-16 |
| NZ567318A (en) | 2011-06-30 |
| CA2625273A1 (en) | 2007-04-26 |
| CN101370896A (zh) | 2009-02-18 |
| NO20082195L (no) | 2008-07-03 |
| CA2625273C (en) | 2011-08-23 |
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