ATE67528T1 - Verfahren und vorrichtung zum aufbringen von gleitlager-legierungen. - Google Patents

Verfahren und vorrichtung zum aufbringen von gleitlager-legierungen.

Info

Publication number
ATE67528T1
ATE67528T1 AT87201324T AT87201324T ATE67528T1 AT E67528 T1 ATE67528 T1 AT E67528T1 AT 87201324 T AT87201324 T AT 87201324T AT 87201324 T AT87201324 T AT 87201324T AT E67528 T1 ATE67528 T1 AT E67528T1
Authority
AT
Austria
Prior art keywords
deposition
porous pad
plain bearing
bearing alloys
overlay
Prior art date
Application number
AT87201324T
Other languages
English (en)
Inventor
David Raymond Eastham
John Keith Dennis
Michael Turner
Original Assignee
Ae Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ae Plc filed Critical Ae Plc
Application granted granted Critical
Publication of ATE67528T1 publication Critical patent/ATE67528T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C25D5/06—Brush or pad plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/10—Bearings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Sliding-Contact Bearings (AREA)
  • Physical Vapour Deposition (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
AT87201324T 1986-07-19 1987-07-13 Verfahren und vorrichtung zum aufbringen von gleitlager-legierungen. ATE67528T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB868617675A GB8617675D0 (en) 1986-07-19 1986-07-19 Deposition of bearing alloys
EP87201324A EP0257670B1 (de) 1986-07-19 1987-07-13 Verfahren und Vorrichtung zum Aufbringen von Gleitlager-Legierungen

Publications (1)

Publication Number Publication Date
ATE67528T1 true ATE67528T1 (de) 1991-10-15

Family

ID=10601361

Family Applications (1)

Application Number Title Priority Date Filing Date
AT87201324T ATE67528T1 (de) 1986-07-19 1987-07-13 Verfahren und vorrichtung zum aufbringen von gleitlager-legierungen.

Country Status (6)

Country Link
EP (1) EP0257670B1 (de)
JP (1) JPS6328896A (de)
AT (1) ATE67528T1 (de)
DE (1) DE3773088D1 (de)
ES (1) ES2024494B3 (de)
GB (2) GB8617675D0 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19500727C1 (de) * 1995-01-12 1996-05-23 Fraunhofer Ges Forschung Vorrichtung zum Auftragen elektrochemisch abscheidbarer Schichten
JPH08209384A (ja) * 1995-02-02 1996-08-13 Yamaha Motor Co Ltd 表面処理装置
DE19754221A1 (de) * 1997-12-06 1999-06-17 Federal Mogul Wiesbaden Gmbh Schichtverbundwerkstoff für Gleitlager mit bleifreier Gleitschicht
CA2320278C (en) 1998-02-12 2006-01-03 Acm Research, Inc. Plating apparatus and method
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
GB2336161B (en) * 1998-04-06 2003-03-26 John Michael Lowe Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
US6447668B1 (en) 1998-07-09 2002-09-10 Acm Research, Inc. Methods and apparatus for end-point detection
US6395152B1 (en) 1998-07-09 2002-05-28 Acm Research, Inc. Methods and apparatus for electropolishing metal interconnections on semiconductor devices
US7136173B2 (en) 1998-07-09 2006-11-14 Acm Research, Inc. Method and apparatus for end-point detection
US6497801B1 (en) 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US6248222B1 (en) 1998-09-08 2001-06-19 Acm Research, Inc. Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
US6916412B2 (en) 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7160421B2 (en) 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7585398B2 (en) 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
EP1194613A4 (de) 1999-04-13 2006-08-23 Semitool Inc Bearbeitungsvorrichtung und bearbeitungskammer mit verbessertem fluss von prozessfluiden
US7189318B2 (en) 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7090751B2 (en) 2001-08-31 2006-08-15 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
GB0216331D0 (en) 2002-07-13 2002-08-21 Dana Corp Bearings
CN110813657A (zh) * 2019-11-14 2020-02-21 昌河飞机工业（集团）有限责任公司 一种孔类零件用氧化刷涂装置及方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB760016A (en) * 1953-09-11 1956-10-31 Glacier Co Ltd Improvements in or relating to electroplating
GB1186357A (en) * 1966-09-15 1970-04-02 Metadalic Ltd Methods and Apparatus for Electrolytic Treatment of Continuous Strand Materials
GB1257541A (de) * 1968-04-03 1971-12-22
US3616285A (en) * 1969-12-31 1971-10-26 Sifco Ind Inc Repair of chromium plated surfaces
US3751343A (en) * 1971-06-14 1973-08-07 A Macula Brush electroplating metal at increased rates of deposition
GB1551212A (en) * 1976-06-11 1979-08-22 Owen S G Ltd Selective electro-plating
EP0003680A1 (de) * 1978-02-09 1979-08-22 Weldex A.G. Verfahren zur Tampongalvanisierung, Elektrode und Elektrolyt dafür
US4399019A (en) * 1981-07-21 1983-08-16 Imperial Clevite Inc. Ultra-high current density electroplating cell
US4452684A (en) * 1983-03-11 1984-06-05 The Carolinch Company Apparatus for selective electrolytic plating
DE3312905C2 (de) * 1983-04-11 1986-03-27 Battelle-Institut E.V., 6000 Frankfurt Vorrichtung zur galvanischen Innenbeschichtung von Hohlteilen
US4610772A (en) * 1985-07-22 1986-09-09 The Carolinch Company Electrolytic plating apparatus

Also Published As

Publication number Publication date
GB2192642B (en) 1990-12-19
JPS6328896A (ja) 1988-02-06
GB8716477D0 (en) 1987-08-19
DE3773088D1 (de) 1991-10-24
EP0257670B1 (de) 1991-09-18
GB2192642A (en) 1988-01-20
GB8617675D0 (en) 1986-08-28
EP0257670A1 (de) 1988-03-02
ES2024494B3 (es) 1992-03-01

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee