JPS6328896A - 軸受合金の電着方法および装置 - Google Patents

軸受合金の電着方法および装置

Info

Publication number
JPS6328896A
JPS6328896A JP62177387A JP17738787A JPS6328896A JP S6328896 A JPS6328896 A JP S6328896A JP 62177387 A JP62177387 A JP 62177387A JP 17738787 A JP17738787 A JP 17738787A JP S6328896 A JPS6328896 A JP S6328896A
Authority
JP
Japan
Prior art keywords
bearing
anode
alloy
plated
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62177387A
Other languages
English (en)
Japanese (ja)
Inventor
デビツド・レイモンド・イーサム
ジヨン・ケイス・デニス
ミツチエル・ターナー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AE PLC
Original Assignee
AE PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AE PLC filed Critical AE PLC
Publication of JPS6328896A publication Critical patent/JPS6328896A/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04Electroplating with moving electrodes
    • C25D5/06Brush or pad plating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/10Bearings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Sliding-Contact Bearings (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Physical Vapour Deposition (AREA)
JP62177387A 1986-07-19 1987-07-17 軸受合金の電着方法および装置 Pending JPS6328896A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8617675 1986-07-19
GB868617675A GB8617675D0 (en) 1986-07-19 1986-07-19 Deposition of bearing alloys

Publications (1)

Publication Number Publication Date
JPS6328896A true JPS6328896A (ja) 1988-02-06

Family

ID=10601361

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62177387A Pending JPS6328896A (ja) 1986-07-19 1987-07-17 軸受合金の電着方法および装置

Country Status (6)

Country Link
EP (1) EP0257670B1 (de)
JP (1) JPS6328896A (de)
AT (1) ATE67528T1 (de)
DE (1) DE3773088D1 (de)
ES (1) ES2024494B3 (de)
GB (2) GB8617675D0 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19500727C1 (de) * 1995-01-12 1996-05-23 Fraunhofer Ges Forschung Vorrichtung zum Auftragen elektrochemisch abscheidbarer Schichten
JPH08209384A (ja) * 1995-02-02 1996-08-13 Yamaha Motor Co Ltd 表面処理装置
DE19754221A1 (de) * 1997-12-06 1999-06-17 Federal Mogul Wiesbaden Gmbh Schichtverbundwerkstoff für Gleitlager mit bleifreier Gleitschicht
JP3523197B2 (ja) 1998-02-12 2004-04-26 エーシーエム リサーチ,インコーポレイティド メッキ設備及び方法
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
GB2336161B (en) 1998-04-06 2003-03-26 John Michael Lowe Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
US7136173B2 (en) 1998-07-09 2006-11-14 Acm Research, Inc. Method and apparatus for end-point detection
US6395152B1 (en) 1998-07-09 2002-05-28 Acm Research, Inc. Methods and apparatus for electropolishing metal interconnections on semiconductor devices
US6447668B1 (en) 1998-07-09 2002-09-10 Acm Research, Inc. Methods and apparatus for end-point detection
US6497801B1 (en) 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US6248222B1 (en) 1998-09-08 2001-06-19 Acm Research, Inc. Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
US7160421B2 (en) 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7585398B2 (en) 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
TW527444B (en) 1999-04-13 2003-04-11 Semitool Inc System for electrochemically processing a workpiece
US6916412B2 (en) 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7189318B2 (en) 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
AU2002343330A1 (en) 2001-08-31 2003-03-10 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
GB0216331D0 (en) 2002-07-13 2002-08-21 Dana Corp Bearings
CN110813657A (zh) * 2019-11-14 2020-02-21 昌河飞机工业(集团)有限责任公司 一种孔类零件用氧化刷涂装置及方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB760016A (en) * 1953-09-11 1956-10-31 Glacier Co Ltd Improvements in or relating to electroplating
GB1186357A (en) * 1966-09-15 1970-04-02 Metadalic Ltd Methods and Apparatus for Electrolytic Treatment of Continuous Strand Materials
GB1257541A (de) * 1968-04-03 1971-12-22
US3616285A (en) * 1969-12-31 1971-10-26 Sifco Ind Inc Repair of chromium plated surfaces
US3751343A (en) * 1971-06-14 1973-08-07 A Macula Brush electroplating metal at increased rates of deposition
GB1551212A (en) * 1976-06-11 1979-08-22 Owen S G Ltd Selective electro-plating
WO1979000608A1 (en) * 1978-02-09 1979-08-23 Kemwell Ltd Electrotreating a metal surface
US4399019A (en) * 1981-07-21 1983-08-16 Imperial Clevite Inc. Ultra-high current density electroplating cell
US4452684A (en) * 1983-03-11 1984-06-05 The Carolinch Company Apparatus for selective electrolytic plating
DE3312905C2 (de) * 1983-04-11 1986-03-27 Battelle-Institut E.V., 6000 Frankfurt Vorrichtung zur galvanischen Innenbeschichtung von Hohlteilen
US4610772A (en) * 1985-07-22 1986-09-09 The Carolinch Company Electrolytic plating apparatus

Also Published As

Publication number Publication date
GB2192642B (en) 1990-12-19
ATE67528T1 (de) 1991-10-15
EP0257670B1 (de) 1991-09-18
EP0257670A1 (de) 1988-03-02
GB8716477D0 (en) 1987-08-19
GB2192642A (en) 1988-01-20
GB8617675D0 (en) 1986-08-28
DE3773088D1 (de) 1991-10-24
ES2024494B3 (es) 1992-03-01

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