ATE676T1 - EPOXY MOLD. - Google Patents

EPOXY MOLD.

Info

Publication number
ATE676T1
ATE676T1 AT79810091T AT79810091T ATE676T1 AT E676 T1 ATE676 T1 AT E676T1 AT 79810091 T AT79810091 T AT 79810091T AT 79810091 T AT79810091 T AT 79810091T AT E676 T1 ATE676 T1 AT E676T1
Authority
AT
Austria
Prior art keywords
molding compositions
epoxy mold
bisphenols
wollastonite
cracking
Prior art date
Application number
AT79810091T
Other languages
German (de)
Inventor
Bruno Dr Schreiber
Original Assignee
Ciba Geigy Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=4354975&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE676(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Ciba Geigy Ag filed Critical Ciba Geigy Ag
Application granted granted Critical
Publication of ATE676T1 publication Critical patent/ATE676T1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

The invention relates to epoxy molding compositions consisting of diglycidyl ethers of bisphenols, anhydride hardeners and reinforcing fillers. At least half the total amount of filler consists of wollastonite. These molding compositions have greater resistance to cracking, which is particularly advantageous in encasing metal parts.
AT79810091T 1978-09-18 1979-09-12 EPOXY MOLD. ATE676T1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH972478A CH637149A5 (en) 1978-09-18 1978-09-18 EPOXY RESIN MOLDS AND THEIR USE FOR THE PRODUCTION OF MOLDED BODIES.
EP79810091A EP0010060B2 (en) 1978-09-18 1979-09-12 Epoxide resin-based moulding mass

Publications (1)

Publication Number Publication Date
ATE676T1 true ATE676T1 (en) 1982-02-15

Family

ID=4354975

Family Applications (1)

Application Number Title Priority Date Filing Date
AT79810091T ATE676T1 (en) 1978-09-18 1979-09-12 EPOXY MOLD.

Country Status (7)

Country Link
US (1) US4285853A (en)
EP (1) EP0010060B2 (en)
JP (1) JPS5540800A (en)
AT (1) ATE676T1 (en)
CA (1) CA1141058A (en)
CH (1) CH637149A5 (en)
DE (1) DE2962095D1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58500898A (en) * 1981-06-12 1983-06-02 ゼネラル・エレクトリック・カンパニイ molding compound
GB2129002A (en) * 1982-09-13 1984-05-10 Brian Bennett Filled thermosetting resin compositions
JPS6055834A (en) * 1983-09-06 1985-04-01 Mitsubishi Electric Corp Low moisture permeability mold material for underwater motor stator
JPH01259604A (en) * 1988-04-08 1989-10-17 Toshiba Corp Reflection mirror antenna
US6001902A (en) * 1996-03-27 1999-12-14 Ciba Specialty Chemicals Corp. Wollastonite-containing curable epoxy resin mixture
CA2300237A1 (en) * 2000-03-09 2001-09-09 Mikhail Pildysh A coated substrate having controlled release properties and a method for the production thereof
CN102695739B (en) 2009-08-27 2014-08-13 Abb研究有限公司 Curable epoxy resin composition

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3218288A (en) * 1961-08-17 1965-11-16 Gen Electric Methyl nadic and hexahydrophthalic anhydride as curing agents for epoxidized novolac resins
US3484398A (en) * 1965-03-18 1969-12-16 Dexter Corp Powdered epoxy resin compositions
US3547871A (en) * 1968-08-02 1970-12-15 Westinghouse Electric Corp Highly filled casting composition
SU410051A1 (en) * 1970-01-19 1974-01-05
CH547329A (en) * 1971-06-15 1974-03-29 Ciba Geigy Ag STORAGE-STABLE, FAST-CURING EPOXY RESIN COMPRESSION COMPOUNDS.
US3963666A (en) * 1971-06-15 1976-06-15 Ciba-Geigy Corporation Storage-stable, quick-curing epoxide resin moulding materials
CH587305A5 (en) * 1973-11-06 1977-04-29 Ciba Geigy Ag

Also Published As

Publication number Publication date
EP0010060A1 (en) 1980-04-16
DE2962095D1 (en) 1982-03-18
CA1141058A (en) 1983-02-08
CH637149A5 (en) 1983-07-15
US4285853A (en) 1981-08-25
EP0010060B1 (en) 1982-02-10
JPS5540800A (en) 1980-03-22
EP0010060B2 (en) 1984-08-08
JPS6247211B2 (en) 1987-10-07

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