BE1006649A3 - Dispositif pour recouvrir un substrat et de preference pour recouvrir du verre plat avec une couche d'oxyde d'indium et d'etain. - Google Patents

Dispositif pour recouvrir un substrat et de preference pour recouvrir du verre plat avec une couche d'oxyde d'indium et d'etain. Download PDF

Info

Publication number: BE1006649A3
Authority: BE; Belgium
Prior art keywords: target; coating; cathode; substrate; sprayed
Prior art date: 1991-03-04

Application number

BE9200035A

Other languages

English (en)

French (fr)

Inventor

Michael Schanz

Rudolf Latz

Michael Scherer

Original Assignee

Leybold Ag

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1991-03-04

Filing date

1992-01-15

Publication date

1994-11-08

1992-01-15 Application filed by Leybold Ag filed Critical Leybold Ag

1994-11-08 Application granted granted Critical

1994-11-08 Publication of BE1006649A3 publication Critical patent/BE1006649A3/fr

Links

238000000576 coating method Methods 0.000 title claims abstract description 17
239000000758 substrate Substances 0.000 title claims abstract description 16
239000011248 coating agent Substances 0.000 title claims abstract description 15
239000005357 flat glass Substances 0.000 title claims description 5
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title description 2
229910003437 indium oxide Inorganic materials 0.000 title description 2
PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 title description 2
239000002245 particle Substances 0.000 claims abstract description 8
238000010438 heat treatment Methods 0.000 claims abstract description 7
238000000034 method Methods 0.000 claims abstract description 7
AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims abstract description 6
239000007789 gas Substances 0.000 claims abstract description 5
238000003825 pressing Methods 0.000 claims description 2
XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 abstract description 4
229910052786 argon Inorganic materials 0.000 abstract description 2
239000011521 glass Substances 0.000 abstract description 2
230000015572 biosynthetic process Effects 0.000 abstract 1
239000000843 powder Substances 0.000 description 4
150000002500 ions Chemical class 0.000 description 3
206010037888 Rash pustular Diseases 0.000 description 2
239000004020 conductor Substances 0.000 description 2
230000005684 electric field Effects 0.000 description 2
238000009434 installation Methods 0.000 description 2
239000000463 material Substances 0.000 description 2
208000029561 pustule Diseases 0.000 description 2
238000005507 spraying Methods 0.000 description 2
QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
239000003990 capacitor Substances 0.000 description 1
239000000919 ceramic Substances 0.000 description 1
238000004140 cleaning Methods 0.000 description 1
230000007547 defect Effects 0.000 description 1
238000000151 deposition Methods 0.000 description 1
238000009413 insulation Methods 0.000 description 1
230000001788 irregular Effects 0.000 description 1
230000007774 longterm Effects 0.000 description 1
238000005259 measurement Methods 0.000 description 1
229910052751 metal Inorganic materials 0.000 description 1
239000002184 metal Substances 0.000 description 1
239000007769 metal material Substances 0.000 description 1
150000002739 metals Chemical class 0.000 description 1
239000000203 mixture Substances 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
239000001301 oxygen Substances 0.000 description 1
229910052760 oxygen Inorganic materials 0.000 description 1
239000011347 resin Substances 0.000 description 1
229920005989 resin Polymers 0.000 description 1
239000007921 spray Substances 0.000 description 1
238000004544 sputter deposition Methods 0.000 description 1
239000002887 superconductor Substances 0.000 description 1
238000009834 vaporization Methods 0.000 description 1
230000008016 vaporization Effects 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3421—Cathode assembly for sputtering apparatus, e.g. Target using heated targets
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Physics & Mathematics (AREA)
Plasma & Fusion (AREA)
Analytical Chemistry (AREA)
Physical Vapour Deposition (AREA)

BE9200035A 1991-03-04 1992-01-15 Dispositif pour recouvrir un substrat et de preference pour recouvrir du verre plat avec une couche d'oxyde d'indium et d'etain. BE1006649A3 (fr)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DE4106771A DE4106771A1 (de)	1991-03-04	1991-03-04	Vorrichtung zum beschichten eines substrats, vorzugsweise zum beschichten von flachglas, mit einer indium-zinn-oxid-schicht

Publications (1)

Publication Number	Publication Date
BE1006649A3 true BE1006649A3 (fr)	1994-11-08

Family

ID=6426381

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
BE9200035A BE1006649A3 (fr)	1991-03-04	1992-01-15	Dispositif pour recouvrir un substrat et de preference pour recouvrir du verre plat avec une couche d'oxyde d'indium et d'etain.

Country Status (5)

Country	Link
JP (1)	JPH0565632A (de)
BE (1)	BE1006649A3 (de)
CH (1)	CH684000A5 (de)
DE (1)	DE4106771A1 (de)
FI (1)	FI920457A7 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE10018842C2 (de) *	2000-04-14	2002-03-21	Ardenne Anlagentech Gmbh	Verfahren zum Aufbringen von TCO-Schichten auf Substrate
EP2360290A1 (de) *	2010-02-11	2011-08-24	Applied Materials, Inc.	Verfahren zur Herstellung einer ITO-Schicht und Sputtersystem

Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE3029567A1 (de) *	1980-07-15	1982-03-18	Murata Manufacturing Co., Ltd., Nagaokakyo, Kyoto	Sputter-vorrichtung fuer die niederschlagung nicht-metallischer duenner schichten auf substraten
DE3210351A1 (de) *	1982-03-20	1983-09-22	Leybold-Heraeus GmbH, 5000 Köln	Verfahren und vorrichtung zum herstellen von magnetischen aufzeichnungsschichten

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB1365492A (en) *	1971-02-05	1974-09-04	Triplex Safety Glass Co	Metal oxide films

1991
- 1991-03-04 DE DE4106771A patent/DE4106771A1/de not_active Withdrawn
- 1991-10-24 CH CH3112/91A patent/CH684000A5/de not_active IP Right Cessation
1992
- 1992-01-15 BE BE9200035A patent/BE1006649A3/fr not_active IP Right Cessation
- 1992-02-03 FI FI920457A patent/FI920457A7/fi unknown
- 1992-03-02 JP JP4044612A patent/JPH0565632A/ja active Pending

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE3029567A1 (de) *	1980-07-15	1982-03-18	Murata Manufacturing Co., Ltd., Nagaokakyo, Kyoto	Sputter-vorrichtung fuer die niederschlagung nicht-metallischer duenner schichten auf substraten
DE3210351A1 (de) *	1982-03-20	1983-09-22	Leybold-Heraeus GmbH, 5000 Köln	Verfahren und vorrichtung zum herstellen von magnetischen aufzeichnungsschichten

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
E.A.TURENKO ET AL.: "MAGNETRON DISCHARGE IN THE VAPOR OF THE CATHODE MATERIAL", SOVIET TECHNICAL PHYSICS LETTERS, vol. 15, no. 7, July 1989 (1989-07-01), N.Y,U.S, pages 519 - 520, XP000114427 *

Also Published As

Publication number	Publication date
FI920457A7 (fi)	1992-09-05
DE4106771A1 (de)	1992-09-10
FI920457A0 (fi)	1992-02-03
CH684000A5 (de)	1994-06-30
JPH0565632A (ja)	1993-03-19

Legal Events

Date

Code

Title

Description

1995-07-31

RE

Patent lapsed

Owner name: LEYBOLD A.G.

Effective date: 19950131

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US5306407A (en)	1994-04-26	Method and apparatus for coating substrates
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