BE702724A - - Google Patents
Info
- Publication number
- BE702724A BE702724A BE702724DA BE702724A BE 702724 A BE702724 A BE 702724A BE 702724D A BE702724D A BE 702724DA BE 702724 A BE702724 A BE 702724A
- Authority
- BE
- Belgium
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/04—Manufacture or treatment of leadframes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/13—Containers comprising a conductive base serving as an interconnection
- H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H10W72/07336—Soldering or alloying
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
- Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4981—Utilizing transitory attached element or associated separate material
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES105551A DE1277446B (de) | 1966-08-26 | 1966-08-26 | Verfahren zum Herstellen von Halbleiterbauelementen mit vollstaendig gekapseltem Halbleiterelement |
| DE1564720A DE1564720C3 (de) | 1966-08-26 | 1966-09-22 | Verfahren zum gleichzeitigen Herstellen einer Vielzahl von Halbleiteranordnungen |
| DE1564770A DE1564770C3 (de) | 1966-08-26 | 1966-12-03 | Verfahren zum gleichzeitigen Herstellen einer Vielzahl von Halbleiteranordnungen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BE702724A true BE702724A (de) | 1968-01-15 |
Family
ID=27212985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE702724D BE702724A (de) | 1966-08-26 | 1967-08-16 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US3531858A (de) |
| BE (1) | BE702724A (de) |
| CH (1) | CH468721A (de) |
| DE (3) | DE1277446B (de) |
| GB (2) | GB1168357A (de) |
| NL (1) | NL6711275A (de) |
| SE (1) | SE317138B (de) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3849880A (en) * | 1969-12-12 | 1974-11-26 | Communications Satellite Corp | Solar cell array |
| FR2102512A5 (de) * | 1970-08-06 | 1972-04-07 | Liaison Electr Silec | |
| US3698073A (en) * | 1970-10-13 | 1972-10-17 | Motorola Inc | Contact bonding and packaging of integrated circuits |
| DE3036260A1 (de) * | 1980-09-26 | 1982-04-29 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zur herstellung von elektrischen kontakten an einer silizium-solarzelle |
| US6190947B1 (en) * | 1997-09-15 | 2001-02-20 | Zowie Technology Corporation | Silicon semiconductor rectifier chips and manufacturing method thereof |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE529799C (de) * | 1931-07-17 | Kloeckner Werke A G Abtlg Mann | Verfahren zur Herstellung von Messerklingen | |
| DE379716C (de) * | 1923-08-27 | Olof Oskar Kring | Zusammenloeten von Metallgegenstaenden | |
| DE708363C (de) * | 1936-11-13 | 1941-07-18 | Fried Krupp Akt Ges | Einrichtung zum Loeten in einer reduzierenden Gasatmosphaere |
| NL96632C (de) * | 1955-07-06 | |||
| NL222168A (de) * | 1957-11-05 | |||
| US3155936A (en) * | 1958-04-24 | 1964-11-03 | Motorola Inc | Transistor device with self-jigging construction |
| US2994121A (en) * | 1958-11-21 | 1961-08-01 | Shockley William | Method of making a semiconductive switching array |
| DE1831308U (de) * | 1960-09-27 | 1961-05-18 | Standard Elektrik Lorenz Ag | Hochspannungsgleichrichter. |
| NL256344A (de) * | 1960-09-28 | |||
| DE1188731B (de) * | 1961-03-17 | 1965-03-11 | Intermetall | Verfahren zum gleichzeitigen Herstellen von mehreren Halbleiteranordnungen |
| DE1180067C2 (de) * | 1961-03-17 | 1970-03-12 | Elektronik M B H | Verfahren zum gleichzeitigen Kontaktieren mehrerer Halbleiteranordnungen |
| DE1199408B (de) * | 1961-06-28 | 1965-08-26 | Siemens Ag | Verfahren zum Herstellen von Halbleiterbau-elementen und nach diesem Verfahren hergestelltes Halbleiterbauelement |
| US3270399A (en) * | 1962-04-24 | 1966-09-06 | Burroughs Corp | Method of fabricating semiconductor devices |
-
1966
- 1966-08-26 DE DES105551A patent/DE1277446B/de active Pending
- 1966-09-22 DE DE1564720A patent/DE1564720C3/de not_active Expired
- 1966-12-03 DE DE1564770A patent/DE1564770C3/de not_active Expired
-
1967
- 1967-08-15 CH CH1146467A patent/CH468721A/de unknown
- 1967-08-16 NL NL6711275A patent/NL6711275A/xx unknown
- 1967-08-16 BE BE702724D patent/BE702724A/xx unknown
- 1967-08-20 GB GB39313/67A patent/GB1168357A/en not_active Expired
- 1967-08-22 SE SE11734/67A patent/SE317138B/xx unknown
- 1967-08-25 GB GB22405/68A patent/GB1168358A/en not_active Expired
- 1967-09-21 US US669661A patent/US3531858A/en not_active Expired - Lifetime
- 1967-12-01 US US687966A patent/US3550262A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE1564720A1 (de) | 1970-09-17 |
| DE1564720B2 (de) | 1977-08-04 |
| GB1168357A (en) | 1969-10-22 |
| DE1564770C3 (de) | 1980-07-10 |
| US3550262A (en) | 1970-12-29 |
| NL6711275A (de) | 1968-02-27 |
| DE1564770A1 (de) | 1971-01-28 |
| SE317138B (de) | 1969-11-10 |
| DE1564720C3 (de) | 1978-04-06 |
| DE1277446B (de) | 1968-09-12 |
| GB1168358A (en) | 1969-10-22 |
| DE1564770B2 (de) | 1979-10-18 |
| CH468721A (de) | 1969-02-15 |
| US3531858A (en) | 1970-10-06 |