BE757111A - Procede pour manipuler des dispositifs a micropoutres a un poste d'essai - Google Patents

Procede pour manipuler des dispositifs a micropoutres a un poste d'essai

Info

Publication number
BE757111A
BE757111A BE757111DA BE757111A BE 757111 A BE757111 A BE 757111A BE 757111D A BE757111D A BE 757111DA BE 757111 A BE757111 A BE 757111A
Authority
BE
Belgium
Prior art keywords
microbush
handling
devices
test station
station
Prior art date
Application number
Other languages
English (en)
Inventor
P Mallery
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of BE757111A publication Critical patent/BE757111A/fr

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0611—Sorting devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Wire Bonding (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
BE757111D 1969-10-07 Procede pour manipuler des dispositifs a micropoutres a un poste d'essai BE757111A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86436769A 1969-10-07 1969-10-07

Publications (1)

Publication Number Publication Date
BE757111A true BE757111A (fr) 1971-03-16

Family

ID=25343116

Family Applications (1)

Application Number Title Priority Date Filing Date
BE757111D BE757111A (fr) 1969-10-07 Procede pour manipuler des dispositifs a micropoutres a un poste d'essai

Country Status (8)

Country Link
US (1) US3604108A (fr)
JP (1) JPS4842386B1 (fr)
BE (1) BE757111A (fr)
DE (1) DE2049077A1 (fr)
FR (1) FR2064181B1 (fr)
GB (1) GB1325016A (fr)
NL (1) NL7014656A (fr)
SE (1) SE357847B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112061919A (zh) * 2020-08-31 2020-12-11 杭州临安森源电缆有限公司 一种电梯计时计数器测试方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4873785A (fr) * 1971-12-31 1973-10-04
US3920949A (en) * 1974-03-13 1975-11-18 Mallory & Co Inc P R Beam leaded device welding machine
JPS5158617U (fr) * 1974-10-30 1976-05-08
US4242157A (en) * 1979-04-20 1980-12-30 Rockwell International Corporation Method of assembly of microwave integrated circuits having a structurally continuous ground plane
US4552300A (en) * 1983-05-09 1985-11-12 Pace, Incorporated Method and apparatus for soldering and desoldering leadless semiconductor modules for printed wiring boards
US4593820A (en) * 1984-03-28 1986-06-10 International Business Machines Corporation Robotic, in-transit, device tester/sorter
US4934309A (en) * 1988-04-15 1990-06-19 International Business Machines Corporation Solder deposition system
US5148003A (en) * 1990-11-28 1992-09-15 International Business Machines Corporation Modular test oven
KR0175267B1 (ko) * 1995-09-30 1999-04-01 김광호 회전운동을 하는 픽업 툴을 구비하는 다이 본딩 장치
KR100392229B1 (ko) * 2001-01-09 2003-07-22 미래산업 주식회사 반도체 소자 테스트 핸들러의 인덱스헤드
AU2003241973A1 (en) * 2003-05-30 2005-01-21 Advantest Corporation Electronic component test instrument

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3083291A (en) * 1960-10-18 1963-03-26 Kulicke & Soffa Mfg Co Device for mounting and bonding semiconductor wafers
US3230338A (en) * 1962-07-02 1966-01-18 Ibm Selective heating apparatus
US3271555A (en) * 1965-03-29 1966-09-06 Int Resistance Co Handling and bonding apparatus
US3333274A (en) * 1965-04-21 1967-07-25 Micro Tech Mfg Inc Testing device
US3337941A (en) * 1965-05-27 1967-08-29 Ibm Recycle control circuit for a chip positioning machine
US3534462A (en) * 1967-08-31 1970-10-20 Western Electric Co Simultaneous multiple lead bonding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112061919A (zh) * 2020-08-31 2020-12-11 杭州临安森源电缆有限公司 一种电梯计时计数器测试方法

Also Published As

Publication number Publication date
SE357847B (fr) 1973-07-09
FR2064181A1 (fr) 1971-07-16
JPS4842386B1 (fr) 1973-12-12
US3604108A (en) 1971-09-14
FR2064181B1 (fr) 1974-03-01
NL7014656A (fr) 1971-04-13
DE2049077A1 (de) 1971-04-08
GB1325016A (en) 1973-08-01

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