NL7014656A - - Google Patents

Info

Publication number
NL7014656A
NL7014656A NL7014656A NL7014656A NL7014656A NL 7014656 A NL7014656 A NL 7014656A NL 7014656 A NL7014656 A NL 7014656A NL 7014656 A NL7014656 A NL 7014656A NL 7014656 A NL7014656 A NL 7014656A
Authority
NL
Netherlands
Application number
NL7014656A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL7014656A publication Critical patent/NL7014656A/xx

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00Subject matter not provided for in other groups of this subclass
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2893Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0446Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0611Sorting devices
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49004Electrical device making including measuring or testing of device or component part

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Wire Bonding (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
NL7014656A 1969-10-07 1970-10-06 NL7014656A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86436769A 1969-10-07 1969-10-07

Publications (1)

Publication Number Publication Date
NL7014656A true NL7014656A (fr) 1971-04-13

Family

ID=25343116

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7014656A NL7014656A (fr) 1969-10-07 1970-10-06

Country Status (8)

Country Link
US (1) US3604108A (fr)
JP (1) JPS4842386B1 (fr)
BE (1) BE757111A (fr)
DE (1) DE2049077A1 (fr)
FR (1) FR2064181B1 (fr)
GB (1) GB1325016A (fr)
NL (1) NL7014656A (fr)
SE (1) SE357847B (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4873785A (fr) * 1971-12-31 1973-10-04
US3920949A (en) * 1974-03-13 1975-11-18 Mallory & Co Inc P R Beam leaded device welding machine
JPS5158617U (fr) * 1974-10-30 1976-05-08
US4242157A (en) * 1979-04-20 1980-12-30 Rockwell International Corporation Method of assembly of microwave integrated circuits having a structurally continuous ground plane
US4552300A (en) * 1983-05-09 1985-11-12 Pace, Incorporated Method and apparatus for soldering and desoldering leadless semiconductor modules for printed wiring boards
US4593820A (en) * 1984-03-28 1986-06-10 International Business Machines Corporation Robotic, in-transit, device tester/sorter
US4934309A (en) * 1988-04-15 1990-06-19 International Business Machines Corporation Solder deposition system
US5148003A (en) * 1990-11-28 1992-09-15 International Business Machines Corporation Modular test oven
KR0175267B1 (ko) * 1995-09-30 1999-04-01 김광호 회전운동을 하는 픽업 툴을 구비하는 다이 본딩 장치
KR100392229B1 (ko) * 2001-01-09 2003-07-22 미래산업 주식회사 반도체 소자 테스트 핸들러의 인덱스헤드
AU2003241973A1 (en) * 2003-05-30 2005-01-21 Advantest Corporation Electronic component test instrument
CN112061919B (zh) * 2020-08-31 2022-04-22 杭州临安森源电缆有限公司 一种电梯计时计数器测试方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3083291A (en) * 1960-10-18 1963-03-26 Kulicke & Soffa Mfg Co Device for mounting and bonding semiconductor wafers
US3230338A (en) * 1962-07-02 1966-01-18 Ibm Selective heating apparatus
US3271555A (en) * 1965-03-29 1966-09-06 Int Resistance Co Handling and bonding apparatus
US3333274A (en) * 1965-04-21 1967-07-25 Micro Tech Mfg Inc Testing device
US3337941A (en) * 1965-05-27 1967-08-29 Ibm Recycle control circuit for a chip positioning machine
US3534462A (en) * 1967-08-31 1970-10-20 Western Electric Co Simultaneous multiple lead bonding

Also Published As

Publication number Publication date
FR2064181B1 (fr) 1974-03-01
GB1325016A (en) 1973-08-01
US3604108A (en) 1971-09-14
BE757111A (fr) 1971-03-16
FR2064181A1 (fr) 1971-07-16
DE2049077A1 (de) 1971-04-08
SE357847B (fr) 1973-07-09
JPS4842386B1 (fr) 1973-12-12

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