BE766700A - Procede de profilage d'un corps semi-conducteur par morsure selective - Google Patents

Procede de profilage d'un corps semi-conducteur par morsure selective

Info

Publication number
BE766700A
BE766700A BE766700A BE766700A BE766700A BE 766700 A BE766700 A BE 766700A BE 766700 A BE766700 A BE 766700A BE 766700 A BE766700 A BE 766700A BE 766700 A BE766700 A BE 766700A
Authority
BE
Belgium
Prior art keywords
bitting
profiling
selective
semiconductor body
semiconductor
Prior art date
Application number
BE766700A
Other languages
English (en)
Inventor
W C Erdman
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of BE766700A publication Critical patent/BE766700A/fr

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00Etching of wafers, substrates or parts of devices
    • H10P50/69Etching of wafers, substrates or parts of devices using masks for semiconductor materials
    • H10P50/691Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials
    • H10P50/692Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials characterised by their composition, e.g. multilayer masks or materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/40Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/43Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/942Masking
    • Y10S438/945Special, e.g. metal
BE766700A 1970-05-08 1971-05-04 Procede de profilage d'un corps semi-conducteur par morsure selective BE766700A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US3574670A 1970-05-08 1970-05-08

Publications (1)

Publication Number Publication Date
BE766700A true BE766700A (fr) 1971-10-01

Family

ID=21884554

Family Applications (1)

Application Number Title Priority Date Filing Date
BE766700A BE766700A (fr) 1970-05-08 1971-05-04 Procede de profilage d'un corps semi-conducteur par morsure selective

Country Status (5)

Country Link
US (1) US3674580A (fr)
BE (1) BE766700A (fr)
DE (1) DE2121834B2 (fr)
FR (1) FR2088446B1 (fr)
NL (1) NL7106068A (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3947304A (en) * 1972-08-15 1976-03-30 Bell Telephone Laboratories, Incorporated Etching of group III-V semiconductors
DE3567768D1 (en) * 1984-05-04 1989-02-23 Bbc Brown Boveri & Cie Dry-etching process
US4619894A (en) * 1985-04-12 1986-10-28 Massachusetts Institute Of Technology Solid-transformation thermal resist
US4680243A (en) * 1985-08-02 1987-07-14 Micronix Corporation Method for producing a mask for use in X-ray photolithography and resulting structure
DE3534418A1 (de) * 1985-09-27 1987-04-02 Telefunken Electronic Gmbh Verfahren zum herstellen von vertiefungen in einem halbleiterbauelemente enthaltenden halbleiterkoerper
US6811610B2 (en) * 2002-06-03 2004-11-02 Diamond Innovations, Inc. Method of making enhanced CVD diamond

Also Published As

Publication number Publication date
DE2121834B2 (de) 1972-12-14
NL7106068A (fr) 1971-11-10
FR2088446A1 (fr) 1972-01-07
US3674580A (en) 1972-07-04
DE2121834A1 (de) 1971-11-11
FR2088446B1 (fr) 1974-05-31

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