BE825692A - Procede de deposition electrolytique - Google Patents
Procede de deposition electrolytiqueInfo
- Publication number
- BE825692A BE825692A BE153483A BE153483A BE825692A BE 825692 A BE825692 A BE 825692A BE 153483 A BE153483 A BE 153483A BE 153483 A BE153483 A BE 153483A BE 825692 A BE825692 A BE 825692A
- Authority
- BE
- Belgium
- Prior art keywords
- deposition process
- electrolytic deposition
- electrolytic
- deposition
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
- H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
- H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing of the conductive pattern
- H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S204/00—Chemistry: electrical and wave energy
- Y10S204/07—Current distribution within the bath
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US443624A US3926747A (en) | 1974-02-19 | 1974-02-19 | Selective electrodeposition of gold on electronic devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BE825692A true BE825692A (fr) | 1975-06-16 |
Family
ID=23761548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE153483A BE825692A (fr) | 1974-02-19 | 1975-02-19 | Procede de deposition electrolytique |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US3926747A (fr) |
| BE (1) | BE825692A (fr) |
| CA (1) | CA1034898A (fr) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4062750A (en) * | 1974-12-18 | 1977-12-13 | James Francis Butler | Thin film electrochemical electrode and cell |
| US4095876A (en) * | 1975-12-08 | 1978-06-20 | Rca Corporation | Liquid crystal device and method for preparing same |
| US4176443A (en) * | 1977-03-08 | 1979-12-04 | Sgs-Ates Componenti Elettronici S.P.A. | Method of connecting semiconductor structure to external circuits |
| US4414076A (en) * | 1983-03-01 | 1983-11-08 | The United States Of America As Represented By The Secretary Of The Navy | Low resistance ohmic contact |
| JPH05206134A (ja) * | 1991-11-12 | 1993-08-13 | Nec Corp | 半導体装置とその製造方法 |
| JPH06326297A (ja) * | 1993-03-19 | 1994-11-25 | Nec Corp | 半導体装置 |
| US6476623B1 (en) * | 2000-09-21 | 2002-11-05 | Motorola, Inc. | Percent backsputtering as a control parameter for metallization |
| DE10360206B4 (de) * | 2003-12-13 | 2008-05-29 | Infineon Technologies Ag | Verfahren zum selektiven galvanischen Abscheiden in einer integrierten Schaltungsanordnung, insbesondere auf Kupfer, und integrierte Schaltungsanordnung |
| US20130175677A1 (en) * | 2012-01-06 | 2013-07-11 | Texas Instruments Incorporated | Integrated Circuit Device With Wire Bond Connections |
| US9851337B2 (en) * | 2013-12-06 | 2017-12-26 | The University Of Akron | Universal water condition monitoring device |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1862231A (en) * | 1928-06-22 | 1932-06-07 | Wadsworth Watch Case Co | Decorating base metals or alloys of base metals |
| US1750418A (en) * | 1928-12-05 | 1930-03-11 | Wadsworth Watch Case Co | Etching and decorating metal surfaces |
| US2367314A (en) * | 1941-06-24 | 1945-01-16 | Western Electric Co | Electrolytic method of coating localized areas of articles |
| BE531769A (fr) * | 1957-08-07 | 1900-01-01 | ||
| US3287612A (en) * | 1963-12-17 | 1966-11-22 | Bell Telephone Labor Inc | Semiconductor contacts and protective coatings for planar devices |
| US3274670A (en) * | 1965-03-18 | 1966-09-27 | Bell Telephone Labor Inc | Semiconductor contact |
| US3388048A (en) * | 1965-12-07 | 1968-06-11 | Bell Telephone Labor Inc | Fabrication of beam lead semiconductor devices |
| GB1175667A (en) * | 1966-04-07 | 1969-12-23 | Associated Semiconductor Mft | Improvements in the Electrodeposition of Metals using a Composite Mask |
| US3663279A (en) * | 1969-11-19 | 1972-05-16 | Bell Telephone Labor Inc | Passivated semiconductor devices |
| US3708403A (en) * | 1971-09-01 | 1973-01-02 | L Terry | Self-aligning electroplating mask |
| US3809625A (en) * | 1972-08-15 | 1974-05-07 | Gen Motors Corp | Method of making contact bumps on flip-chips |
-
1974
- 1974-02-19 US US443624A patent/US3926747A/en not_active Expired - Lifetime
-
1975
- 1975-02-18 CA CA220,365A patent/CA1034898A/fr not_active Expired
- 1975-02-19 BE BE153483A patent/BE825692A/fr not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CA1034898A (fr) | 1978-07-18 |
| US3926747A (en) | 1975-12-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RE | Patent lapsed |
Owner name: WESTERN ELECTRIC CY INC. Effective date: 19870228 |