CA1034898A - Placage or selectif sur composants electroniques - Google Patents

Placage or selectif sur composants electroniques

Info

Publication number
CA1034898A
CA1034898A CA220,365A CA220365A CA1034898A CA 1034898 A CA1034898 A CA 1034898A CA 220365 A CA220365 A CA 220365A CA 1034898 A CA1034898 A CA 1034898A
Authority
CA
Canada
Prior art keywords
gold
electronic devices
selective electrodeposition
electrodeposition
selective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA220,365A
Other languages
English (en)
Inventor
Kenneth R. Newby
Earl D. Winters
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Inc
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Application granted granted Critical
Publication of CA1034898A publication Critical patent/CA1034898A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/07—Current distribution within the bath

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
CA220,365A 1974-02-19 1975-02-18 Placage or selectif sur composants electroniques Expired CA1034898A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US443624A US3926747A (en) 1974-02-19 1974-02-19 Selective electrodeposition of gold on electronic devices

Publications (1)

Publication Number Publication Date
CA1034898A true CA1034898A (fr) 1978-07-18

Family

ID=23761548

Family Applications (1)

Application Number Title Priority Date Filing Date
CA220,365A Expired CA1034898A (fr) 1974-02-19 1975-02-18 Placage or selectif sur composants electroniques

Country Status (3)

Country Link
US (1) US3926747A (fr)
BE (1) BE825692A (fr)
CA (1) CA1034898A (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4062750A (en) * 1974-12-18 1977-12-13 James Francis Butler Thin film electrochemical electrode and cell
US4095876A (en) * 1975-12-08 1978-06-20 Rca Corporation Liquid crystal device and method for preparing same
US4176443A (en) * 1977-03-08 1979-12-04 Sgs-Ates Componenti Elettronici S.P.A. Method of connecting semiconductor structure to external circuits
US4414076A (en) * 1983-03-01 1983-11-08 The United States Of America As Represented By The Secretary Of The Navy Low resistance ohmic contact
JPH05206134A (ja) * 1991-11-12 1993-08-13 Nec Corp 半導体装置とその製造方法
JPH06326297A (ja) * 1993-03-19 1994-11-25 Nec Corp 半導体装置
US6476623B1 (en) * 2000-09-21 2002-11-05 Motorola, Inc. Percent backsputtering as a control parameter for metallization
DE10360206B4 (de) * 2003-12-13 2008-05-29 Infineon Technologies Ag Verfahren zum selektiven galvanischen Abscheiden in einer integrierten Schaltungsanordnung, insbesondere auf Kupfer, und integrierte Schaltungsanordnung
US20130175677A1 (en) * 2012-01-06 2013-07-11 Texas Instruments Incorporated Integrated Circuit Device With Wire Bond Connections
US9851337B2 (en) * 2013-12-06 2017-12-26 The University Of Akron Universal water condition monitoring device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1862231A (en) * 1928-06-22 1932-06-07 Wadsworth Watch Case Co Decorating base metals or alloys of base metals
US1750418A (en) * 1928-12-05 1930-03-11 Wadsworth Watch Case Co Etching and decorating metal surfaces
US2367314A (en) * 1941-06-24 1945-01-16 Western Electric Co Electrolytic method of coating localized areas of articles
BE531769A (fr) * 1957-08-07 1900-01-01
US3287612A (en) * 1963-12-17 1966-11-22 Bell Telephone Labor Inc Semiconductor contacts and protective coatings for planar devices
US3274670A (en) * 1965-03-18 1966-09-27 Bell Telephone Labor Inc Semiconductor contact
US3388048A (en) * 1965-12-07 1968-06-11 Bell Telephone Labor Inc Fabrication of beam lead semiconductor devices
GB1175667A (en) * 1966-04-07 1969-12-23 Associated Semiconductor Mft Improvements in the Electrodeposition of Metals using a Composite Mask
US3663279A (en) * 1969-11-19 1972-05-16 Bell Telephone Labor Inc Passivated semiconductor devices
US3708403A (en) * 1971-09-01 1973-01-02 L Terry Self-aligning electroplating mask
US3809625A (en) * 1972-08-15 1974-05-07 Gen Motors Corp Method of making contact bumps on flip-chips

Also Published As

Publication number Publication date
US3926747A (en) 1975-12-16
BE825692A (fr) 1975-06-16

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