BE843588A - Procede et dispositif de montage de duilles de contact sur les broches de boitiers de composants electonique - Google Patents

Procede et dispositif de montage de duilles de contact sur les broches de boitiers de composants electonique

Info

Publication number
BE843588A
BE843588A BE168463A BE168463A BE843588A BE 843588 A BE843588 A BE 843588A BE 168463 A BE168463 A BE 168463A BE 168463 A BE168463 A BE 168463A BE 843588 A BE843588 A BE 843588A
Authority
BE
Belgium
Prior art keywords
spindles
electronic component
mounting contact
component boxes
ducts
Prior art date
Application number
BE168463A
Other languages
English (en)
Inventor
R D Wellington
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE843588A publication Critical patent/BE843588A/fr

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/043Feeding one by one by other means than belts
    • H05K13/0439Feeding one by one by other means than belts incorporating means for treating the terminal leads only before insertion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/103Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y10T29/4914Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
    • Y10T29/49142Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal including metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
  • Multi-Conductor Connections (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
BE168463A 1975-06-30 1976-06-30 Procede et dispositif de montage de duilles de contact sur les broches de boitiers de composants electonique BE843588A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/591,413 US3983623A (en) 1975-06-30 1975-06-30 Method for mounting socket contacts to dual-in-line package leads and for mounting the combination onto pre-drilled printed circuit boards

Publications (1)

Publication Number Publication Date
BE843588A true BE843588A (fr) 1976-10-18

Family

ID=24366389

Family Applications (1)

Application Number Title Priority Date Filing Date
BE168463A BE843588A (fr) 1975-06-30 1976-06-30 Procede et dispositif de montage de duilles de contact sur les broches de boitiers de composants electonique

Country Status (9)

Country Link
US (1) US3983623A (fr)
JP (1) JPS525488A (fr)
BE (1) BE843588A (fr)
CA (1) CA1063218A (fr)
DE (1) DE2626274A1 (fr)
FR (1) FR2316765A1 (fr)
GB (1) GB1555227A (fr)
NL (1) NL7607186A (fr)
SE (1) SE426629B (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58197686A (ja) * 1982-05-11 1983-11-17 山一電機工業株式会社 スリ−ブ端子の整列植込方法
JPS59883A (ja) * 1982-06-28 1984-01-06 山一電機工業株式会社 スリ−ブ端子の整列植込方法
JPH0267800A (ja) * 1988-09-02 1990-03-07 Tdk Corp リード線付電子部品の自動挿入方法及び装置
US6563299B1 (en) * 2000-08-30 2003-05-13 Micron Technology, Inc. Apparatus for measuring parasitic capacitance and inductance of I/O leads on an electrical component using a network analyzer

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2937358A (en) * 1955-04-18 1960-05-17 Gen Electric Printed circuit sandwiched in glass
US3611562A (en) * 1969-12-05 1971-10-12 Thomas & Betts Corp Method of attaching microcircuit packs to a panel board
US3834015A (en) * 1973-01-29 1974-09-10 Philco Ford Corp Method of forming electrical connections

Also Published As

Publication number Publication date
CA1063218A (fr) 1979-09-25
SE426629B (sv) 1983-01-31
DE2626274A1 (de) 1977-01-27
GB1555227A (en) 1979-11-07
FR2316765B1 (fr) 1981-12-31
US3983623A (en) 1976-10-05
NL7607186A (nl) 1977-01-03
SE7607399L (sv) 1976-12-31
JPS525488A (en) 1977-01-17
FR2316765A1 (fr) 1977-01-28

Similar Documents

Publication Publication Date Title
BE885022A (fr) Dispositif et procede de montage de composants electriques sur des platines
FR2304247A1 (fr) Procede et dispositif d'interconnexion de composants electroniques
NO159830C (no) Anordning for montering av et elektronikkapparat.
DE2963553D1 (en) Method and device for checking the dimensions of vehicles
BE838353A (fr) Procede et dispositif pour encapsuler des cables
FR2351466A1 (fr) Procede et dispositif de reduction de l'amplitude de vibrations indesirables
BE855977A (fr) Procede et appareil de montage de dispositifs sur un substrat
FR2307281A1 (fr) Procede et dispositif pour la fabrication technique de porte-objets prerevetus
FR2323228A1 (fr) Composant dielectrique sur semi-conducteur a liaison electrostatique et procede de fabrication d'un tel composant
FR2299145A1 (fr) Procede et dispositif pour la f
EP0195820A4 (fr) Procede et dispositif de montage de composants electroniques.
FR2298649A1 (fr) Pivot pour engins de travaux publics et procede de montage de celui-ci
FR2336025A1 (fr) Dispositif de montage automatique de composants
FR2304176A1 (fr) Procede et dispositif de soudage par immersion de composants a semi-conducteurs
FR2316166A1 (fr) Dispositif et procede pour decharger des vehicules sans conducteur
FR2507428B1 (fr) Machine de montage de composants electroniques sur des circuits
FR2307279A1 (fr) Procede et dispositif pour l'etude du sous-sol et de sa nature electro-magnetique
BE843588A (fr) Procede et dispositif de montage de duilles de contact sur les broches de boitiers de composants electonique
FR2322662A2 (fr) Procede et dispositif de precipitation electrostatique
FR2492620B1 (fr) Dispositif pour le montage de composants electriques et electroniques
FR2313470A1 (fr) Procede et dispositif pour l'elimination d'impuretes sur les cardes
BE842824A (fr) Dispositif de montage pour terminaux de conditionnement d'air
FR2340565A1 (fr) Procede et installation pour la fabrication de composants semi-conducteurs
JPS5516476A (en) Method of mounting semiconductor device
JPS5521125A (en) Method of mounting semiconductor device

Legal Events

Date Code Title Description
RE Patent lapsed

Owner name: AUGAT INC.

Effective date: 19850630