BE851858A - Systeme d'emballage de pastilles de semi-conducteurs - Google Patents

Systeme d'emballage de pastilles de semi-conducteurs

Info

Publication number
BE851858A
BE851858A BE175288A BE175288A BE851858A BE 851858 A BE851858 A BE 851858A BE 175288 A BE175288 A BE 175288A BE 175288 A BE175288 A BE 175288A BE 851858 A BE851858 A BE 851858A
Authority
BE
Belgium
Prior art keywords
packaging system
semiconductor pellet
pellet packaging
semiconductor
pellet
Prior art date
Application number
BE175288A
Other languages
English (en)
Original Assignee
Monsanto Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Monsanto Co filed Critical Monsanto Co
Publication of BE851858A publication Critical patent/BE851858A/fr

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1911—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like
    • H10P72/1912—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like characterised by shock absorbing elements, e.g. retainers or cushions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/02—Internal fittings
    • B65D25/10—Devices to locate articles in containers
    • B65D25/107—Grooves, ribs, or the like, situated on opposed walls and between which the articles are located
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1921—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
BE175288A 1976-09-07 1977-02-25 Systeme d'emballage de pastilles de semi-conducteurs BE851858A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/721,014 US4129211A (en) 1976-09-07 1976-09-07 Wafer packaging system

Publications (1)

Publication Number Publication Date
BE851858A true BE851858A (fr) 1977-08-25

Family

ID=24896164

Family Applications (1)

Application Number Title Priority Date Filing Date
BE175288A BE851858A (fr) 1976-09-07 1977-02-25 Systeme d'emballage de pastilles de semi-conducteurs

Country Status (6)

Country Link
US (1) US4129211A (fr)
JP (1) JPS6029216B2 (fr)
BE (1) BE851858A (fr)
CA (1) CA1107692A (fr)
DE (1) DE2705789A1 (fr)
GB (1) GB1567973A (fr)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4248349A (en) * 1978-12-07 1981-02-03 Dougherty Brothers Company Tray for ampoules or the like
US4459104A (en) * 1983-06-01 1984-07-10 Quartz Engineering & Materials, Inc. Cantilever diffusion tube apparatus and method
US4668484A (en) * 1984-02-13 1987-05-26 Elliott David J Transport containers for semiconductor wafers
IT1181778B (it) * 1985-05-07 1987-09-30 Dynamit Nobel Silicon Spa Contenitore per l'immagazzinamento ed il trasporto di dischetti (fette) di silicio
JPS6285008U (fr) * 1985-11-14 1987-05-30
JPH0613114Y2 (ja) * 1987-04-21 1994-04-06 信越ポリマ−株式会社 密閉容器の係止構造
US4796756A (en) * 1988-04-11 1989-01-10 Silor Optical Of Florida, Inc. Optical lens carrier
JPH05160242A (ja) * 1991-12-02 1993-06-25 Tadahiro Omi 高清浄試料運搬装置及び試料運搬方法
US5255797A (en) * 1992-02-26 1993-10-26 Fluoroware, Inc. Wafer carrier with wafer retaining cushions
KR100293906B1 (ko) * 1992-11-17 2001-11-22 가끼자끼다께요시 수지제박판수납용기
KR100281004B1 (ko) * 1992-12-14 2001-03-02 마에다 시게루 기판 반송 시스템
USD376688S (en) 1994-12-20 1996-12-24 Empak, Inc. Semiconductor wafer cassette transport box
USD387903S (en) * 1995-10-13 1997-12-23 Empak, Inc. Shipping container
US6170690B1 (en) * 1997-05-09 2001-01-09 Shin-Etsu Polymer Co., Ltd. Air-tightly sealable container with bell jar covering
US5870881A (en) * 1997-06-27 1999-02-16 Memc Electronic Materials, Inc. Box closing apparatus
US5894711A (en) * 1997-07-11 1999-04-20 Memc Electronic Materials, Inc. Box handling apparatus and method
EP1119039A1 (fr) * 1999-07-28 2001-07-25 Shin-Etsu Handotai Company Limited Procede de stockage de plaquette, contenant de stockage destine a cet effet et procede de transfert de plaquette dans ce contenant
US6540467B1 (en) * 2001-06-18 2003-04-01 Lsi Logic Corporation Apparatus and method of semiconductor wafer protection
US20040004008A1 (en) 2002-06-26 2004-01-08 Peck James M. Contact lens packages
US6851551B2 (en) * 2002-07-05 2005-02-08 Emballage Conseil 2000 Inc. Container for coins or tokens
EP2281584A1 (fr) * 2002-12-23 2011-02-09 Johnson and Johnson Vision Care, Inc. Emballages de lentilles de contact contenant des additifs
JP2006001647A (ja) * 2004-05-18 2006-01-05 Sumitomo Electric Ind Ltd 容器、包装体、容器の製造方法、包装体の製造方法および化合物半導体基板
CN100435309C (zh) * 2005-10-20 2008-11-19 京元电子股份有限公司 高温烘烤晶舟
FR2896912B1 (fr) * 2005-12-09 2008-11-28 Alcatel Sa Enceinte etanche pour le transport et le stockage de substrats semi-conducteurs
WO2007130661A2 (fr) * 2006-05-04 2007-11-15 Mattel, Inc. Contenants
CN112222038B (zh) * 2020-10-13 2021-08-03 宁波丞达精机股份有限公司 一种半导体封装装置用的供料机构
CN116721957B (zh) * 2023-08-10 2023-10-13 四川明泰微电子科技股份有限公司 一种封装芯片推料机构及芯片成型装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7524253U (de) * 1976-01-29 Wacker-Chemitronic Gesellschaft Fuer Elektronik-Grundstoffe Mbh, 8263 Burghausen Stapelbare Paletten-Verpackung für Halbleiterscheiben
DE182075C (fr) *
GB475299A (en) * 1936-09-22 1937-11-17 Alfred Astley An improved frame for holding, carrying or transporting articles of a fragile nature
US2284551A (en) * 1940-08-03 1942-05-26 Peter P Alexander Packing of powdered metals
US2384042A (en) * 1944-03-13 1945-09-04 Continental Can Co End seam for metal containers
US2389312A (en) * 1945-04-28 1945-11-20 Charles R Honza Coin display holder
US2642987A (en) * 1948-11-27 1953-06-23 Columbia Protektosite Co Inc Receptacle having hinged cover
DE945136C (de) * 1953-04-11 1956-06-28 Deena Ges M B H Zum Verpacken von Tuben dienende Faltschachtel
GB932669A (en) * 1960-10-05 1963-07-31 William Cleland Ltd Improvements in or relating to folding boxes
US3048668A (en) * 1961-04-17 1962-08-07 Beltone Hearing Aid Company Transducer suspension system
US3229809A (en) * 1963-08-07 1966-01-18 Simon L Friedman Coin holder
US3379303A (en) * 1966-05-31 1968-04-23 John H. Jenkins Slide holder
FR1501968A (fr) * 1966-09-30 1967-11-18 Parisienne D Expansion Chimiqu Article de conditionnement pour objet de révolution
US3400809A (en) * 1967-05-22 1968-09-10 Product Packaging Corp Light tight package
US3467242A (en) * 1968-03-04 1969-09-16 Dale E De Rousse Storage unit for wafer-like articles
US3607440A (en) * 1970-01-29 1971-09-21 Esb Inc Battery container having springlike packing ribs to accommodate elements of varying thicknesses
US3710900A (en) * 1970-09-30 1973-01-16 A Fink Modular system for transporting and storing tape cartridges and cassettes
US3860116A (en) * 1973-04-30 1975-01-14 Ppg Industries Inc Packaging device
US3926305A (en) * 1973-07-12 1975-12-16 Fluoroware Inc Wafer basket
US3961877A (en) * 1974-09-11 1976-06-08 Fluoroware, Inc. Reinforced wafer basket

Also Published As

Publication number Publication date
DE2705789A1 (de) 1978-03-09
JPS5333052A (en) 1978-03-28
US4129211A (en) 1978-12-12
JPS6029216B2 (ja) 1985-07-09
GB1567973A (en) 1980-05-21
CA1107692A (fr) 1981-08-25

Similar Documents

Publication Publication Date Title
BE851857A (fr) Systeme d'emballage de pastilles de semi-conducteurs
JPS5421170A (en) Package for semiconductor device
JPS5548953A (en) Semiconductor package
JPS52106993A (en) Compound package film
JPS5392661A (en) Packaging case for disk semiconductor
SE8105257L (sv) Halvledaranordning
JPS5387165A (en) Package for pushhpull semiconductor device
JPS554797A (en) Semiconductor memory device
MY8700605A (en) Semiconductor memory device
JPS5595344A (en) Semiconductor package
FR2311403A1 (fr) Unite de fixation de pastille semi-conductrice
JPS52156086A (en) Compound package
IT1088716B (it) Confezione di video-disco
DK515183A (da) Indpakningsapparat til ispinde
BE848335A (fr) Circuit de protection pour thyristors,
SE7706521L (sv) Anordning for behandling av forpackningsdelar
BE844588A (fr) Conditionnement pour des pastilles de semi-conducteurs
GB2065970B (en) Packaged semiconductor device
DE3022122A1 (de) Halbleitervorrichtung
IT8124803A0 (it) Dispositivo semiconduttore
JPS5650542A (en) Semiconductor package
BR8000967A (pt) Dispositivo semicondutor
DE2967103D1 (en) Semiconductor memory device
SE8001042L (sv) Halvledaranordning
BE877850A (fr) Dispositif semiconducteur

Legal Events

Date Code Title Description
RE Patent lapsed

Owner name: MONSANTO CY

Effective date: 19850225