BE870878A - Circuits electriques integres proteges, substrats d'interconnexion proteges comportant de tels circuits et procede d'obtention desdits circuits et substrats - Google Patents

Circuits electriques integres proteges, substrats d'interconnexion proteges comportant de tels circuits et procede d'obtention desdits circuits et substrats

Info

Publication number
BE870878A
BE870878A BE190796A BE190796A BE870878A BE 870878 A BE870878 A BE 870878A BE 190796 A BE190796 A BE 190796A BE 190796 A BE190796 A BE 190796A BE 870878 A BE870878 A BE 870878A
Authority
BE
Belgium
Prior art keywords
circuits
protected
substrates
obtaining
integrated electrical
Prior art date
Application number
BE190796A
Other languages
English (en)
Original Assignee
Cii
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cii filed Critical Cii
Publication of BE870878A publication Critical patent/BE870878A/fr

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
BE190796A 1977-10-03 1978-09-29 Circuits electriques integres proteges, substrats d'interconnexion proteges comportant de tels circuits et procede d'obtention desdits circuits et substrats BE870878A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7729686A FR2404992A1 (fr) 1977-10-03 1977-10-03 Circuits electriques integres proteges, substrats d'interconnexion proteges comportant de tels circuits et procede d'obtention desdits circuits et substrats

Publications (1)

Publication Number Publication Date
BE870878A true BE870878A (fr) 1979-01-15

Family

ID=9196038

Family Applications (1)

Application Number Title Priority Date Filing Date
BE190796A BE870878A (fr) 1977-10-03 1978-09-29 Circuits electriques integres proteges, substrats d'interconnexion proteges comportant de tels circuits et procede d'obtention desdits circuits et substrats

Country Status (8)

Country Link
JP (1) JPS5460566A (fr)
BE (1) BE870878A (fr)
DE (1) DE2843133A1 (fr)
FR (1) FR2404992A1 (fr)
GB (1) GB2009504B (fr)
IT (1) IT1098983B (fr)
NL (1) NL7809979A (fr)
SE (1) SE7810315L (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6300695B1 (en) 1999-07-29 2001-10-09 Encap Motor Corporation High speed spindle motor with hydrodynamic bearings
US6362554B1 (en) 1999-07-29 2002-03-26 Encap Motor Corporation Stator assembly
US6437464B1 (en) 1999-07-29 2002-08-20 Encap Motor Corporation Motor and disc assembly for computer hard drive
US6501616B1 (en) 1999-07-29 2002-12-31 Encap Motor Corporation Hard disc drive with base incorporating a spindle motor stator
US6617721B1 (en) 1999-07-29 2003-09-09 Encap Motor Corporation High speed spindle motor
US6753628B1 (en) 1999-07-29 2004-06-22 Encap Motor Corporation High speed spindle motor for disc drive
US6844636B2 (en) 1999-12-17 2005-01-18 Encap Motor Corporation Spindle motor with encapsulated stator and method of making same
US6892439B1 (en) 2001-02-01 2005-05-17 Encap Motor Corporation Motor with stator made from linear core preform
US7036207B2 (en) 2001-03-02 2006-05-02 Encap Motor Corporation Stator assembly made from a plurality of toroidal core segments and motor using same

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2922005A1 (de) * 1979-05-30 1980-12-04 Siemens Ag Halbleiterbauelement mit passiviertem halbleiterkoerper
JPS5623759A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Resin-sealed semiconductor device and manufacture thereof
JPS56114363A (en) * 1980-02-15 1981-09-08 Toshiba Corp Semiconductor device sealed with resin
US4419999A (en) * 1981-04-17 1983-12-13 May Jr James W Method and apparatus for monitoring vascular flow
FR2521350B1 (fr) * 1982-02-05 1986-01-24 Hitachi Ltd Boitier porteur de puce semi-conductrice
JPS59193596A (ja) * 1983-04-18 1984-11-02 Kyodo Printing Co Ltd Ｉｃカ−ド用ｉｃモジユ−ル
FI72409C (fi) * 1984-03-09 1987-05-11 Lohja Ab Oy Foerfarande foer inkapsling av pao en baerremsa anordnade halvledarkomponenter.
US4511620A (en) * 1984-06-29 1985-04-16 Dow Corning Corporation Method for prevention of bubble formation in polyorganosiloxane gels
DE3442131A1 (de) * 1984-11-17 1986-05-22 Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn Verfahren zum einkapseln von mikroelektronischen halbleiter- und schichtschaltungen

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6300695B1 (en) 1999-07-29 2001-10-09 Encap Motor Corporation High speed spindle motor with hydrodynamic bearings
US6362554B1 (en) 1999-07-29 2002-03-26 Encap Motor Corporation Stator assembly
US6437464B1 (en) 1999-07-29 2002-08-20 Encap Motor Corporation Motor and disc assembly for computer hard drive
US6501616B1 (en) 1999-07-29 2002-12-31 Encap Motor Corporation Hard disc drive with base incorporating a spindle motor stator
US6617721B1 (en) 1999-07-29 2003-09-09 Encap Motor Corporation High speed spindle motor
US6753628B1 (en) 1999-07-29 2004-06-22 Encap Motor Corporation High speed spindle motor for disc drive
US7154200B2 (en) 1999-07-29 2006-12-26 Encap Technologies, Inc. Motor
US6844636B2 (en) 1999-12-17 2005-01-18 Encap Motor Corporation Spindle motor with encapsulated stator and method of making same
US7067944B2 (en) 1999-12-17 2006-06-27 Encap Motor Corporation Motor with encapsulated stator and method of making same
US6892439B1 (en) 2001-02-01 2005-05-17 Encap Motor Corporation Motor with stator made from linear core preform
US7036207B2 (en) 2001-03-02 2006-05-02 Encap Motor Corporation Stator assembly made from a plurality of toroidal core segments and motor using same
US7067952B2 (en) 2001-03-02 2006-06-27 Encap Motor Corporation Stator assembly made from a molded web of core segments and motor using same

Also Published As

Publication number Publication date
IT1098983B (it) 1985-09-18
SE7810315L (sv) 1979-04-04
NL7809979A (nl) 1979-04-05
GB2009504B (en) 1982-05-12
JPS5460566A (en) 1979-05-16
FR2404992B1 (fr) 1981-05-08
DE2843133A1 (de) 1979-04-19
GB2009504A (en) 1979-06-13
IT7828365A0 (it) 1978-10-03
FR2404992A1 (fr) 1979-04-27

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