BE871760A - Procede de fabrication de circuits resistifs a pellicule epaisse - Google Patents

Procede de fabrication de circuits resistifs a pellicule epaisse

Info

Publication number
BE871760A
BE871760A BE191533A BE191533A BE871760A BE 871760 A BE871760 A BE 871760A BE 191533 A BE191533 A BE 191533A BE 191533 A BE191533 A BE 191533A BE 871760 A BE871760 A BE 871760A
Authority
BE
Belgium
Prior art keywords
thick film
film resistive
resistive circuits
manufacturing thick
manufacturing
Prior art date
Application number
BE191533A
Other languages
English (en)
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of BE871760A publication Critical patent/BE871760A/fr

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49099—Coating resistive material on a base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
BE191533A 1977-11-04 1978-11-03 Procede de fabrication de circuits resistifs a pellicule epaisse BE871760A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/848,509 US4140817A (en) 1977-11-04 1977-11-04 Thick film resistor circuits

Publications (1)

Publication Number Publication Date
BE871760A true BE871760A (fr) 1979-03-01

Family

ID=25303475

Family Applications (1)

Application Number Title Priority Date Filing Date
BE191533A BE871760A (fr) 1977-11-04 1978-11-03 Procede de fabrication de circuits resistifs a pellicule epaisse

Country Status (9)

Country Link
US (1) US4140817A (fr)
JP (1) JPS5475064A (fr)
BE (1) BE871760A (fr)
DE (1) DE2847851A1 (fr)
FR (1) FR2408200A1 (fr)
GB (1) GB2007918A (fr)
IT (1) IT1100905B (fr)
NL (1) NL7810842A (fr)
SE (1) SE7811095L (fr)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4409261A (en) * 1980-02-07 1983-10-11 Cts Corporation Process for air firing oxidizable conductors
US4316920A (en) * 1980-07-03 1982-02-23 Bell Telephone Laboratories, Incorporated Thick film resistor circuits
US4317750A (en) * 1980-08-22 1982-03-02 Ferro Corporation Thick film conductor employing nickel oxide
US4322316A (en) * 1980-08-22 1982-03-30 Ferro Corporation Thick film conductor employing copper oxide
US4316942A (en) * 1980-10-06 1982-02-23 Cts Corporation Thick film copper conductor circuits
US4503090A (en) * 1983-02-23 1985-03-05 At&T Bell Laboratories Thick film resistor circuits
US4511601A (en) * 1983-05-13 1985-04-16 North American Philips Corporation Copper metallization for dielectric materials
US4503418A (en) * 1983-11-07 1985-03-05 Northern Telecom Limited Thick film resistor
JPS61194794A (ja) * 1985-02-22 1986-08-29 三菱電機株式会社 混成集積回路基板の製造方法
DE3537161C2 (de) * 1985-10-18 1995-08-03 Bosch Gmbh Robert Verfahren zur Herstellung festhaftender, lötfähiger und strukturierbarer Metallschichten auf Aluminiumoxid-haltiger Keramik
US4728534A (en) * 1986-08-04 1988-03-01 Motorola, Inc. Thick film conductor structure
WO1988009395A1 (fr) * 1987-05-20 1988-12-01 Matsushita Electric Industrial Co., Ltd. Procede de preparation d'un film mince compose d'un metal de base et application dudit film
US4975301A (en) * 1987-08-07 1990-12-04 The O. Hommel Company Glass coating
JPH01151205A (ja) * 1987-12-08 1989-06-14 Matsushita Electric Ind Co Ltd 抵抗器の製造方法
JP2887318B2 (ja) * 1988-08-29 1999-04-26 松下電器産業株式会社 金属薄膜抵抗体の製造方法
JPH0795483B2 (ja) * 1989-05-18 1995-10-11 株式会社東芝 厚膜抵抗素子の製造方法
US5336444A (en) * 1992-05-29 1994-08-09 International Business Machines Corporation Ceramic via composition, multilayer ceramic circuit containing same, and process for using same
US5680092A (en) * 1993-11-11 1997-10-21 Matsushita Electric Industrial Co., Ltd. Chip resistor and method for producing the same
EP1007308B1 (fr) * 1997-02-24 2003-11-12 Superior Micropowders LLC Procede et dispositif de production d'aerosol, produits particulaires et materiels electroniques realises a partir desdits produits
US6338809B1 (en) * 1997-02-24 2002-01-15 Superior Micropowders Llc Aerosol method and apparatus, particulate products, and electronic devices made therefrom
US6660680B1 (en) 1997-02-24 2003-12-09 Superior Micropowders, Llc Electrocatalyst powders, methods for producing powders and devices fabricated from same
DE19750123C2 (de) 1997-11-13 2000-09-07 Heraeus Electro Nite Int Verfahren zur Herstellung einer Sensoranordnung für die Temperaturmessung
US20050097987A1 (en) * 1998-02-24 2005-05-12 Cabot Corporation Coated copper-containing powders, methods and apparatus for producing such powders, and copper-containing devices fabricated from same
US7138354B2 (en) * 1998-02-24 2006-11-21 Cabot Corporation Method for the fabrication of an electrocatalyst layer
US6967183B2 (en) 1998-08-27 2005-11-22 Cabot Corporation Electrocatalyst powders, methods for producing powders and devices fabricated from same
US6753108B1 (en) * 1998-02-24 2004-06-22 Superior Micropowders, Llc Energy devices and methods for the fabrication of energy devices
CA2412426C (fr) * 2000-06-08 2007-09-04 Superior Micropowders, Llc Poudres electrocatalytiques, procedes permettant de les produire et dispositifs produits a partir desdites poudres
US6458669B1 (en) 2000-08-30 2002-10-01 Agere Systems Guardian Corp. Method of manufacturing an integrated circuit
US9113583B2 (en) 2012-07-31 2015-08-18 General Electric Company Electronic circuit board, assembly and a related method thereof
JP5766336B1 (ja) 2014-06-16 2015-08-19 株式会社マテリアル・コンセプト 銅ペーストの焼成方法
FR3044834A1 (fr) * 2015-12-02 2017-06-09 Pierre Guitton Dispositif de generation d'ions

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3481777A (en) * 1967-02-17 1969-12-02 Ibm Electroless coating method for making printed circuits
US3645783A (en) * 1970-06-03 1972-02-29 Infrared Ind Inc Thin film planar resistor
US3998980A (en) * 1972-05-05 1976-12-21 Hewlett-Packard Company Fabrication of thick film resistors
US4053866A (en) * 1975-11-24 1977-10-11 Trw Inc. Electrical resistor with novel termination and method of making same

Also Published As

Publication number Publication date
FR2408200A1 (fr) 1979-06-01
IT1100905B (it) 1985-09-28
JPS5475064A (en) 1979-06-15
NL7810842A (nl) 1979-05-08
DE2847851A1 (de) 1979-05-10
SE7811095L (sv) 1979-05-05
GB2007918A (en) 1979-05-23
US4140817A (en) 1979-02-20
IT7829432A0 (it) 1978-11-03

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