BE880470A - Dispositif de soudage de plaquettes de circuit imprime garnies de composants - Google Patents

Dispositif de soudage de plaquettes de circuit imprime garnies de composants

Info

Publication number
BE880470A
BE880470A BE0/198454A BE198454A BE880470A BE 880470 A BE880470 A BE 880470A BE 0/198454 A BE0/198454 A BE 0/198454A BE 198454 A BE198454 A BE 198454A BE 880470 A BE880470 A BE 880470A
Authority
BE
Belgium
Prior art keywords
components
printed circuit
circuit boards
welding device
boards filled
Prior art date
Application number
BE0/198454A
Other languages
English (en)
Original Assignee
Epm A G
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epm A G filed Critical Epm A G
Publication of BE880470A publication Critical patent/BE880470A/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0669—Solder baths with dipping means
    • B23K3/0676—Conveyors therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
BE0/198454A 1978-12-08 1979-12-06 Dispositif de soudage de plaquettes de circuit imprime garnies de composants BE880470A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1254378A CH633984A5 (de) 1978-12-08 1978-12-08 Einrichtung zum verloeten von bestueckten leiterplatten.

Publications (1)

Publication Number Publication Date
BE880470A true BE880470A (fr) 1980-06-06

Family

ID=4384008

Family Applications (1)

Application Number Title Priority Date Filing Date
BE0/198454A BE880470A (fr) 1978-12-08 1979-12-06 Dispositif de soudage de plaquettes de circuit imprime garnies de composants

Country Status (9)

Country Link
US (1) US4284225A (fr)
BE (1) BE880470A (fr)
CA (1) CA1120603A (fr)
CH (1) CH633984A5 (fr)
DE (1) DE2945750C2 (fr)
FR (1) FR2443788A1 (fr)
GB (1) GB2036625B (fr)
HK (1) HK54883A (fr)
NL (1) NL7908543A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114850714A (zh) * 2022-04-12 2022-08-05 深圳市林鑫达智能装备有限公司 一种焊接设备

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4512510A (en) * 1982-10-26 1985-04-23 Nihon Den-Nitsu Keiki Co. Ltd. Printed circuit board soldering apparatus
JPS59202163A (ja) * 1983-04-30 1984-11-15 Tamura Seisakusho Co Ltd 自動はんだ付け装置
US4697730A (en) * 1984-05-25 1987-10-06 The Htc Corporation Continuous solder system
US4637541A (en) * 1985-06-28 1987-01-20 Unit Industries, Inc. Circuit board soldering device
US4776508A (en) * 1985-06-28 1988-10-11 Unit Design Inc. Electronic component lead tinning device
GB8616939D0 (en) * 1986-07-11 1986-08-20 Sun Ind Coatings Pte Ltd Soldering apparatus
US5611475A (en) * 1986-07-11 1997-03-18 Sun Industrial Coatings Private Ltd. Soldering apparatus
DE102009049905A1 (de) * 2009-10-12 2011-04-14 Gebr. Schmid Gmbh & Co. Halteeinrichtung für dünne flächige Substrate
CN109434234B (zh) * 2018-11-20 2024-03-01 无锡奥特维科技股份有限公司 电池串返修装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB828178A (en) * 1957-08-01 1960-02-17 Ultra Electric Ltd Improvements in and relating to dip soldering machines
GB1207667A (en) * 1966-11-03 1970-10-07 Zeva Elek Zitats Ges Smits & L Methods of and machines for soldering printed circuit panels
US3565319A (en) * 1967-05-15 1971-02-23 Banner Ind Inc Apparatus for application of solder to circuit boards
US3732615A (en) * 1968-12-11 1973-05-15 Gale Systems Method for producing standing wave of solder and protective film means
DE2148680A1 (de) * 1971-09-29 1973-04-05 Zevatron Gmbh Automatische loetmaschine
NL7212888A (fr) * 1971-09-29 1973-04-02
DE7621287U1 (de) * 1976-07-06 1976-10-28 Grundig E.M.V. Elektro-Mechanische Versuchsanstalt Max Grundig, 8510 Fuerth Vorrichtung zum automatischen verloeten von bauteilen auf gedruckten schaltungsplatten
US4171761A (en) * 1978-03-20 1979-10-23 Rockwell International Corporation Wave solder apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114850714A (zh) * 2022-04-12 2022-08-05 深圳市林鑫达智能装备有限公司 一种焊接设备
CN114850714B (zh) * 2022-04-12 2023-08-08 深圳市林鑫达智能装备有限公司 一种焊接设备

Also Published As

Publication number Publication date
DE2945750C2 (de) 1983-06-30
CH633984A5 (de) 1983-01-14
GB2036625A (en) 1980-07-02
NL7908543A (nl) 1980-06-10
FR2443788B1 (fr) 1984-10-12
HK54883A (en) 1983-11-18
FR2443788A1 (fr) 1980-07-04
US4284225A (en) 1981-08-18
DE2945750A1 (de) 1980-06-12
CA1120603A (fr) 1982-03-23
GB2036625B (en) 1983-02-09

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Legal Events

Date Code Title Description
RE Patent lapsed

Owner name: EPM A.G.

Effective date: 19931231