BE888756A - Boitier de circuits integres comportant une multiplicite de broches pour assurer des connexions electriques exterieures - Google Patents

Boitier de circuits integres comportant une multiplicite de broches pour assurer des connexions electriques exterieures

Info

Publication number
BE888756A
BE888756A BE0/204752A BE204752A BE888756A BE 888756 A BE888756 A BE 888756A BE 0/204752 A BE0/204752 A BE 0/204752A BE 204752 A BE204752 A BE 204752A BE 888756 A BE888756 A BE 888756A
Authority
BE
Belgium
Prior art keywords
multiplicity
pins
integrated circuit
electrical connections
external electrical
Prior art date
Application number
BE0/204752A
Other languages
English (en)
Inventor
R Zakhariya
Original Assignee
Ncr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ncr Corp filed Critical Ncr Corp
Publication of BE888756A publication Critical patent/BE888756A/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/103—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/451—Multilayered leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connecting Device With Holders (AREA)
BE0/204752A 1980-05-12 1981-05-11 Boitier de circuits integres comportant une multiplicite de broches pour assurer des connexions electriques exterieures BE888756A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14861380A 1980-05-12 1980-05-12

Publications (1)

Publication Number Publication Date
BE888756A true BE888756A (fr) 1981-08-28

Family

ID=22526542

Family Applications (1)

Application Number Title Priority Date Filing Date
BE0/204752A BE888756A (fr) 1980-05-12 1981-05-11 Boitier de circuits integres comportant une multiplicite de broches pour assurer des connexions electriques exterieures

Country Status (4)

Country Link
EP (1) EP0051666A1 (fr)
BE (1) BE888756A (fr)
WO (1) WO1981003396A1 (fr)
ZA (1) ZA812893B (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58159360A (ja) * 1982-03-17 1983-09-21 Fujitsu Ltd 半導体装置
DE3581576D1 (de) * 1984-03-22 1991-03-07 Sgs Thomson Microelectronics Leiter mit impedanz-anpassung.
US4796078A (en) * 1987-06-15 1989-01-03 International Business Machines Corporation Peripheral/area wire bonding technique
JP2507476B2 (ja) * 1987-09-28 1996-06-12 株式会社東芝 半導体集積回路装置
US5701086A (en) * 1993-10-26 1997-12-23 Hewlett-Packard Company Connecting test equipment to adjacent legs of an IC or the like by interdigitating conductive wedges with the legs
WO2003012828A2 (fr) * 2001-04-09 2003-02-13 Kla-Tencor, Inc. Systemes et procedes de mesure des proprietes de couches conductrices
JP6330765B2 (ja) * 2015-09-11 2018-05-30 トヨタ自動車株式会社 ワイヤ接続方法と端子

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3368114A (en) * 1965-07-06 1968-02-06 Radiation Inc Microelectronic circuit packages with improved connection structure
JPS4826069B1 (fr) * 1968-03-04 1973-08-04
JPS54132166A (en) * 1978-04-05 1979-10-13 Nec Corp Socket for semiconductor device

Also Published As

Publication number Publication date
ZA812893B (en) 1982-05-26
EP0051666A1 (fr) 1982-05-19
WO1981003396A1 (fr) 1981-11-26

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