FR2532472B1 - Procede de fabrication de connexions electriques pour circuit hybride et circuit hybride comportant de telles connexions - Google Patents

Procede de fabrication de connexions electriques pour circuit hybride et circuit hybride comportant de telles connexions

Info

Publication number
FR2532472B1
FR2532472B1 FR8214896A FR8214896A FR2532472B1 FR 2532472 B1 FR2532472 B1 FR 2532472B1 FR 8214896 A FR8214896 A FR 8214896A FR 8214896 A FR8214896 A FR 8214896A FR 2532472 B1 FR2532472 B1 FR 2532472B1
Authority
FR
France
Prior art keywords
hybrid circuit
connections
manufacturing electrical
electrical connections
hybrid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8214896A
Other languages
English (en)
Other versions
FR2532472A1 (fr
Inventor
Jean-Bernard Ranger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lignes Telegraphiques et Telephoniques LTT SA
Original Assignee
Lignes Telegraphiques et Telephoniques LTT SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lignes Telegraphiques et Telephoniques LTT SA filed Critical Lignes Telegraphiques et Telephoniques LTT SA
Priority to FR8214896A priority Critical patent/FR2532472B1/fr
Publication of FR2532472A1 publication Critical patent/FR2532472A1/fr
Application granted granted Critical
Publication of FR2532472B1 publication Critical patent/FR2532472B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3473—Plating of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
FR8214896A 1982-08-31 1982-08-31 Procede de fabrication de connexions electriques pour circuit hybride et circuit hybride comportant de telles connexions Expired FR2532472B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8214896A FR2532472B1 (fr) 1982-08-31 1982-08-31 Procede de fabrication de connexions electriques pour circuit hybride et circuit hybride comportant de telles connexions

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8214896A FR2532472B1 (fr) 1982-08-31 1982-08-31 Procede de fabrication de connexions electriques pour circuit hybride et circuit hybride comportant de telles connexions

Publications (2)

Publication Number Publication Date
FR2532472A1 FR2532472A1 (fr) 1984-03-02
FR2532472B1 true FR2532472B1 (fr) 1985-12-20

Family

ID=9277157

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8214896A Expired FR2532472B1 (fr) 1982-08-31 1982-08-31 Procede de fabrication de connexions electriques pour circuit hybride et circuit hybride comportant de telles connexions

Country Status (1)

Country Link
FR (1) FR2532472B1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1179418B (it) * 1984-07-20 1987-09-16 Selenia Ind Elettroniche Procedimento per la realizzazione di resistori integrati a film sottile con doppio strato resistivo, mediante erosione ionica
US5221639A (en) * 1991-10-20 1993-06-22 Motorola, Inc. Method of fabricating resistive conductive patterns on aluminum nitride substrates

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3649392A (en) * 1968-12-06 1972-03-14 Western Electric Co Thin-film circuit formation
CH613556A5 (en) * 1975-03-05 1979-09-28 Bbc Brown Boveri & Cie Process for photolithographic patterning of resistor tracks in hybrid circuits
DE2509912C3 (de) * 1975-03-07 1979-11-29 Robert Bosch Gmbh, 7000 Stuttgart Elektronische Dünnfilmschaltung
DE3136198A1 (de) * 1981-01-15 1982-08-05 Robert Bosch Gmbh, 7000 Stuttgart "elektronische duennschichtschaltung"

Also Published As

Publication number Publication date
FR2532472A1 (fr) 1984-03-02

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Legal Events

Date Code Title Description
ST Notification of lapse