BR0014755A - Produtos para cmp aperfeiçoados - Google Patents

Produtos para cmp aperfeiçoados

Info

Publication number
BR0014755A
BR0014755A BR0014755-9A BR0014755A BR0014755A BR 0014755 A BR0014755 A BR 0014755A BR 0014755 A BR0014755 A BR 0014755A BR 0014755 A BR0014755 A BR 0014755A
Authority
BR
Brazil
Prior art keywords
products
cmp
cmp products
enhanced cmp
enhanced
Prior art date
Application number
BR0014755-9A
Other languages
English (en)
Inventor
Ajay K Garg
Brahmanandam V Tanikella
William R Delaney
Original Assignee
Saint Gobain Ceramics E Plasti
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Ceramics E Plasti filed Critical Saint Gobain Ceramics E Plasti
Publication of BR0014755A publication Critical patent/BR0014755A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C09K3/1445—Composite particles, e.g. coated particles the coating consisting exclusively of metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/773—Nanoparticle, i.e. structure having three dimensions of 100 nm or less
    • Y10S977/775—Nanosized powder or flake, e.g. nanosized catalyst
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/84—Manufacture, treatment, or detection of nanostructure
    • Y10S977/888—Shaping or removal of materials, e.g. etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Composite Materials (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

"PRODUTOS PARA CMP APERFEIçOADOS". Materiais abrasivos compreendendo partículas de alumina transicional revestidas com sílica com um tamanho médio de partícula menor do que 50 nanómetros e uma área superficial BET de pelo menos 50 m^ 2^/gm são úteis em processos para CMP tanto na forma de pastas fluidas quanto como abrasivos fixos.
BR0014755-9A 1999-10-15 2000-08-30 Produtos para cmp aperfeiçoados BR0014755A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US41947799A 1999-10-15 1999-10-15
PCT/US2000/023797 WO2001029145A1 (en) 1999-10-15 2000-08-30 Improved cmp products

Publications (1)

Publication Number Publication Date
BR0014755A true BR0014755A (pt) 2002-09-24

Family

ID=23662444

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0014755-9A BR0014755A (pt) 1999-10-15 2000-08-30 Produtos para cmp aperfeiçoados

Country Status (9)

Country Link
EP (1) EP1228159A1 (pt)
JP (1) JP2003512501A (pt)
KR (1) KR20020042869A (pt)
CN (1) CN1379803A (pt)
AU (1) AU754328B2 (pt)
BR (1) BR0014755A (pt)
CA (1) CA2383504A1 (pt)
MX (1) MXPA02003753A (pt)
WO (1) WO2001029145A1 (pt)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5137521B2 (ja) * 2006-10-12 2013-02-06 日揮触媒化成株式会社 金平糖状シリカ系ゾルおよびその製造方法
FR2928916B1 (fr) * 2008-03-21 2011-11-18 Saint Gobain Ct Recherches Grains fondus et revetus de silice
KR101208896B1 (ko) 2012-05-24 2012-12-06 주식회사 대한세라믹스 알루미나계 연마재 지립의 제조방법 및 이에 의해 제조된 알루미나계 연마재 지립
JP7183863B2 (ja) * 2018-03-13 2022-12-06 Jsr株式会社 化学機械研磨用組成物及び化学機械研磨方法
JP7167557B2 (ja) * 2018-08-30 2022-11-09 Jsr株式会社 化学機械研磨用アルミナ砥粒及びその製造方法
JP7167558B2 (ja) * 2018-08-30 2022-11-09 Jsr株式会社 化学機械研磨用水系分散体
CN114921057B (zh) * 2022-06-02 2023-06-13 江苏长电科技股份有限公司 一种环氧塑封料组合物、制备方法及应用

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU650382B2 (en) * 1992-02-05 1994-06-16 Norton Company Nano-sized alpha alumina particles
US5693239A (en) * 1995-10-10 1997-12-02 Rodel, Inc. Polishing slurries comprising two abrasive components and methods for their use

Also Published As

Publication number Publication date
EP1228159A1 (en) 2002-08-07
WO2001029145A1 (en) 2001-04-26
KR20020042869A (ko) 2002-06-07
CN1379803A (zh) 2002-11-13
AU7090000A (en) 2001-04-30
CA2383504A1 (en) 2001-04-26
MXPA02003753A (es) 2002-08-30
AU754328B2 (en) 2002-11-14
JP2003512501A (ja) 2003-04-02

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Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]