CN1379803A - 改进的cmp制品 - Google Patents
改进的cmp制品 Download PDFInfo
- Publication number
- CN1379803A CN1379803A CN00814323A CN00814323A CN1379803A CN 1379803 A CN1379803 A CN 1379803A CN 00814323 A CN00814323 A CN 00814323A CN 00814323 A CN00814323 A CN 00814323A CN 1379803 A CN1379803 A CN 1379803A
- Authority
- CN
- China
- Prior art keywords
- alumina
- abrasive
- silica
- particles
- transition state
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
- C09K3/1445—Composite particles, e.g. coated particles the coating consisting exclusively of metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B24B37/245—Pads with fixed abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
- H10P52/40—Chemomechanical polishing [CMP]
- H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/773—Nanoparticle, i.e. structure having three dimensions of 100 nm or less
- Y10S977/775—Nanosized powder or flake, e.g. nanosized catalyst
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/84—Manufacture, treatment, or detection of nanostructure
- Y10S977/888—Shaping or removal of materials, e.g. etching
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Composite Materials (AREA)
- Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US41947799A | 1999-10-15 | 1999-10-15 | |
| US09/419,477 | 1999-10-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1379803A true CN1379803A (zh) | 2002-11-13 |
Family
ID=23662444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN00814323A Pending CN1379803A (zh) | 1999-10-15 | 2000-08-30 | 改进的cmp制品 |
Country Status (9)
| Country | Link |
|---|---|
| EP (1) | EP1228159A1 (pt) |
| JP (1) | JP2003512501A (pt) |
| KR (1) | KR20020042869A (pt) |
| CN (1) | CN1379803A (pt) |
| AU (1) | AU754328B2 (pt) |
| BR (1) | BR0014755A (pt) |
| CA (1) | CA2383504A1 (pt) |
| MX (1) | MXPA02003753A (pt) |
| WO (1) | WO2001029145A1 (pt) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114921057A (zh) * | 2022-06-02 | 2022-08-19 | 江苏长电科技股份有限公司 | 一种环氧塑封料组合物、制备方法及应用 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5137521B2 (ja) * | 2006-10-12 | 2013-02-06 | 日揮触媒化成株式会社 | 金平糖状シリカ系ゾルおよびその製造方法 |
| FR2928916B1 (fr) * | 2008-03-21 | 2011-11-18 | Saint Gobain Ct Recherches | Grains fondus et revetus de silice |
| KR101208896B1 (ko) | 2012-05-24 | 2012-12-06 | 주식회사 대한세라믹스 | 알루미나계 연마재 지립의 제조방법 및 이에 의해 제조된 알루미나계 연마재 지립 |
| JP7183863B2 (ja) * | 2018-03-13 | 2022-12-06 | Jsr株式会社 | 化学機械研磨用組成物及び化学機械研磨方法 |
| JP7167557B2 (ja) * | 2018-08-30 | 2022-11-09 | Jsr株式会社 | 化学機械研磨用アルミナ砥粒及びその製造方法 |
| JP7167558B2 (ja) * | 2018-08-30 | 2022-11-09 | Jsr株式会社 | 化学機械研磨用水系分散体 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU650382B2 (en) * | 1992-02-05 | 1994-06-16 | Norton Company | Nano-sized alpha alumina particles |
| US5693239A (en) * | 1995-10-10 | 1997-12-02 | Rodel, Inc. | Polishing slurries comprising two abrasive components and methods for their use |
-
2000
- 2000-08-30 MX MXPA02003753A patent/MXPA02003753A/es not_active Application Discontinuation
- 2000-08-30 KR KR1020027004829A patent/KR20020042869A/ko not_active Ceased
- 2000-08-30 CA CA002383504A patent/CA2383504A1/en not_active Abandoned
- 2000-08-30 WO PCT/US2000/023797 patent/WO2001029145A1/en not_active Ceased
- 2000-08-30 JP JP2001531935A patent/JP2003512501A/ja active Pending
- 2000-08-30 EP EP00959610A patent/EP1228159A1/en not_active Withdrawn
- 2000-08-30 BR BR0014755-9A patent/BR0014755A/pt not_active Application Discontinuation
- 2000-08-30 CN CN00814323A patent/CN1379803A/zh active Pending
- 2000-08-30 AU AU70900/00A patent/AU754328B2/en not_active Ceased
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114921057A (zh) * | 2022-06-02 | 2022-08-19 | 江苏长电科技股份有限公司 | 一种环氧塑封料组合物、制备方法及应用 |
| CN114921057B (zh) * | 2022-06-02 | 2023-06-13 | 江苏长电科技股份有限公司 | 一种环氧塑封料组合物、制备方法及应用 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1228159A1 (en) | 2002-08-07 |
| WO2001029145A1 (en) | 2001-04-26 |
| KR20020042869A (ko) | 2002-06-07 |
| AU7090000A (en) | 2001-04-30 |
| CA2383504A1 (en) | 2001-04-26 |
| MXPA02003753A (es) | 2002-08-30 |
| AU754328B2 (en) | 2002-11-14 |
| BR0014755A (pt) | 2002-09-24 |
| JP2003512501A (ja) | 2003-04-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |