BR0200848A - Condutores blindados microfabricados - Google Patents

Condutores blindados microfabricados

Info

Publication number
BR0200848A
BR0200848A BR0200848-3A BR0200848A BR0200848A BR 0200848 A BR0200848 A BR 0200848A BR 0200848 A BR0200848 A BR 0200848A BR 0200848 A BR0200848 A BR 0200848A
Authority
BR
Brazil
Prior art keywords
microfabricated
microstructure
shielded conductors
mems
conductors
Prior art date
Application number
BR0200848-3A
Other languages
English (en)
Other versions
BR0200848B1 (pt
Inventor
Peter M Gulvin
Jingkuang Chen
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xerox Corp filed Critical Xerox Corp
Publication of BR0200848A publication Critical patent/BR0200848A/pt
Publication of BR0200848B1 publication Critical patent/BR0200848B1/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
    • B41J2/1639—Manufacturing processes molding sacrificial molding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/0006—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14403—Structure thereof only for on-demand ink jet heads including a filter

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Abstract

"CONDUTORES BLINDADOS MICROFABRICADOS". Uma microestrutura que pode ser usada como uma conexão elétrica num aparelho de sistema eletromecânico microfabricado (MEMS) . A microestrutura pode possuir uma ou mais conexões elétricas para transmissão de sinal. A microestrutura permite que um aparelho MEMS proteja transmissões de sinal contra os efeitos de interferência eletromagnética ou de fluidos condutivos.
BRPI0200848-3A 2001-03-19 2002-03-18 Microestrutura de um sistema eletromecânico microfabricado BR0200848B1 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/812,498 US6465856B2 (en) 2001-03-19 2001-03-19 Micro-fabricated shielded conductors

Publications (2)

Publication Number Publication Date
BR0200848A true BR0200848A (pt) 2003-03-25
BR0200848B1 BR0200848B1 (pt) 2014-08-05

Family

ID=25209756

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0200848-3A BR0200848B1 (pt) 2001-03-19 2002-03-18 Microestrutura de um sistema eletromecânico microfabricado

Country Status (7)

Country Link
US (1) US6465856B2 (pt)
EP (1) EP1243550B1 (pt)
JP (1) JP2002307697A (pt)
BR (1) BR0200848B1 (pt)
CA (1) CA2375712C (pt)
DE (1) DE60212229T2 (pt)
MX (1) MXPA02002849A (pt)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003007049A1 (en) 1999-10-05 2003-01-23 Iridigm Display Corporation Photonic mems and structures
US20040213511A1 (en) * 2002-03-19 2004-10-28 Scholz Christopher J. Erbium doped waveguide amplifier (EDWA) with pump reflector
US6952042B2 (en) * 2002-06-17 2005-10-04 Honeywell International, Inc. Microelectromechanical device with integrated conductive shield
US7781850B2 (en) 2002-09-20 2010-08-24 Qualcomm Mems Technologies, Inc. Controlling electromechanical behavior of structures within a microelectromechanical systems device
US7002215B1 (en) * 2002-09-30 2006-02-21 Pts Corporation Floating entrance guard for preventing electrical short circuits
DE10304835A1 (de) * 2003-02-06 2004-08-05 Robert Bosch Gmbh Mikroelektromechanisches Bauelement
DE602004010927T2 (de) * 2003-10-31 2008-12-24 Nxp B.V. Mikroelektromechanische hochfrequenz-systeme und verfahren zur herstellung solcher systeme
EP2444368A3 (en) * 2003-10-31 2012-07-25 Epcos AG A method of manufacturing an electronic device and electronic device
EP1779173A1 (en) 2004-07-29 2007-05-02 Idc, Llc System and method for micro-electromechanical operating of an interferometric modulator
US7373026B2 (en) 2004-09-27 2008-05-13 Idc, Llc MEMS device fabricated on a pre-patterned substrate
US7369296B2 (en) 2004-09-27 2008-05-06 Idc, Llc Device and method for modifying actuation voltage thresholds of a deformable membrane in an interferometric modulator
US7327510B2 (en) 2004-09-27 2008-02-05 Idc, Llc Process for modifying offset voltage characteristics of an interferometric modulator
EP2495212A3 (en) 2005-07-22 2012-10-31 QUALCOMM MEMS Technologies, Inc. Mems devices having support structures and methods of fabricating the same
JP2009509786A (ja) * 2005-09-30 2009-03-12 クォルコム・メムズ・テクノロジーズ・インコーポレーテッド Ｍｅｍｓ装置及びｍｅｍｓ装置における相互接続
US7652814B2 (en) 2006-01-27 2010-01-26 Qualcomm Mems Technologies, Inc. MEMS device with integrated optical element
US7450295B2 (en) 2006-03-02 2008-11-11 Qualcomm Mems Technologies, Inc. Methods for producing MEMS with protective coatings using multi-component sacrificial layers
US7643203B2 (en) 2006-04-10 2010-01-05 Qualcomm Mems Technologies, Inc. Interferometric optical display system with broadband characteristics
US7417784B2 (en) 2006-04-19 2008-08-26 Qualcomm Mems Technologies, Inc. Microelectromechanical device and method utilizing a porous surface
US7369292B2 (en) 2006-05-03 2008-05-06 Qualcomm Mems Technologies, Inc. Electrode and interconnect materials for MEMS devices
US7566664B2 (en) 2006-08-02 2009-07-28 Qualcomm Mems Technologies, Inc. Selective etching of MEMS using gaseous halides and reactive co-etchants
US7706042B2 (en) 2006-12-20 2010-04-27 Qualcomm Mems Technologies, Inc. MEMS device and interconnects for same
US7535621B2 (en) 2006-12-27 2009-05-19 Qualcomm Mems Technologies, Inc. Aluminum fluoride films for microelectromechanical system applications
US7733552B2 (en) 2007-03-21 2010-06-08 Qualcomm Mems Technologies, Inc MEMS cavity-coating layers and methods
US7719752B2 (en) 2007-05-11 2010-05-18 Qualcomm Mems Technologies, Inc. MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same
US20090033516A1 (en) * 2007-08-02 2009-02-05 Schlumberger Technology Corporation Instrumented wellbore tools and methods
US7570415B2 (en) 2007-08-07 2009-08-04 Qualcomm Mems Technologies, Inc. MEMS device and interconnects for same
US8589832B2 (en) * 2007-08-24 2013-11-19 International Business Machines Corporation On chip shielding structure for integrated circuits or devices on a substrate and method of shielding
US8566759B2 (en) * 2007-08-24 2013-10-22 International Business Machines Corporation Structure for on chip shielding structure for integrated circuits or devices on a substrate
US20090088618A1 (en) 2007-10-01 2009-04-02 Arneson Michael R System and Method for Manufacturing a Swallowable Sensor Device
US8349635B1 (en) * 2008-05-20 2013-01-08 Silicon Laboratories Inc. Encapsulated MEMS device and method to form the same
CA2841750C (en) * 2011-10-24 2016-09-06 Hewlett-Packard Development Company, L.P. Inkjet printhead device, fluid ejection device, and method thereof
CA2841736C (en) * 2011-10-24 2017-08-22 Hewlett-Packard Development Company, L.P. Fluid ejection devices and methods thereof
US9323041B2 (en) 2011-11-30 2016-04-26 Pixtronix, Inc. Electromechanical systems display apparatus incorporating charge dissipation surfaces
US9018715B2 (en) 2012-11-30 2015-04-28 Silicon Laboratories Inc. Gas-diffusion barriers for MEMS encapsulation
US11646576B2 (en) 2021-09-08 2023-05-09 Analog Devices International Unlimited Company Electrical overstress protection of microelectromechanical systems

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5467068A (en) * 1994-07-07 1995-11-14 Hewlett-Packard Company Micromachined bi-material signal switch
US6012336A (en) * 1995-09-06 2000-01-11 Sandia Corporation Capacitance pressure sensor
US6758552B1 (en) * 1995-12-06 2004-07-06 Hewlett-Packard Development Company Integrated thin-film drive head for thermal ink-jet printer
US6174820B1 (en) * 1999-02-16 2001-01-16 Sandia Corporation Use of silicon oxynitride as a sacrificial material for microelectromechanical devices

Also Published As

Publication number Publication date
JP2002307697A (ja) 2002-10-23
CA2375712A1 (en) 2002-09-19
US20020130916A1 (en) 2002-09-19
MXPA02002849A (es) 2005-07-25
EP1243550B1 (en) 2006-06-14
DE60212229D1 (de) 2006-07-27
CA2375712C (en) 2005-01-25
US6465856B2 (en) 2002-10-15
BR0200848B1 (pt) 2014-08-05
EP1243550A2 (en) 2002-09-25
DE60212229T2 (de) 2006-10-05
EP1243550A3 (en) 2004-06-16

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Legal Events

Date Code Title Description
B15K Others concerning applications: alteration of classification

Free format text: ALTERADA A CLASSIFICACAO DE H01R 43/00 PARA B87B 7/04 E B81C 1/00

Ipc: B81B 7/04 (2006.01), B81C 1/00 (2006.01)

B06A Notification to applicant to reply to the report for non-patentability or inadequacy of the application [chapter 6.1 patent gazette]
B06A Notification to applicant to reply to the report for non-patentability or inadequacy of the application [chapter 6.1 patent gazette]
B06A Notification to applicant to reply to the report for non-patentability or inadequacy of the application [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted

Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 05/08/2014, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 14A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2371 DE 14-06-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.