BR0207724A - Banho para a eletrodeposição de ouro e ligas de ouro e o uso do mesmo - Google Patents

Banho para a eletrodeposição de ouro e ligas de ouro e o uso do mesmo

Info

Publication number: BR0207724A
Authority: BR; Brazil
Prior art keywords: gold; bath; bismuth; alloys; compound
Prior art date: 2001-02-28

Application number

BR0207724-8A

Other languages

English (en)

Portuguese (pt)

Inventor

Susane Ruebel

Manfred Stuemke

Original Assignee

Wieland Dental & Technik Gmbh

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2001-02-28

Filing date

2002-02-28

Publication date

2004-03-23

2001-02-28 Priority claimed from DE2001110743 external-priority patent/DE10110743A1/de

2002-02-28 Application filed by Wieland Dental & Technik Gmbh filed Critical Wieland Dental & Technik Gmbh

2004-03-23 Publication of BR0207724A publication Critical patent/BR0207724A/pt

Links

229910001020 Au alloy Inorganic materials 0.000 title abstract 3
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title abstract 3
239000010931 gold Substances 0.000 title abstract 3
229910052737 gold Inorganic materials 0.000 title abstract 3
239000003353 gold alloy Substances 0.000 title abstract 3
238000004070 electrodeposition Methods 0.000 title abstract 2
239000000654 additive Substances 0.000 abstract 2
229910052797 bismuth Inorganic materials 0.000 abstract 2
JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 abstract 2
150000001875 compounds Chemical class 0.000 abstract 2
238000009713 electroplating Methods 0.000 abstract 2
SRCZENKQCOSNAI-UHFFFAOYSA-H gold(3+);trisulfite Chemical class [Au+3].[Au+3].[O-]S([O-])=O.[O-]S([O-])=O.[O-]S([O-])=O SRCZENKQCOSNAI-UHFFFAOYSA-H 0.000 abstract 2
URDCARMUOSMFFI-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]ethyl-(2-hydroxyethyl)amino]acetic acid Chemical compound OCCN(CC(O)=O)CCN(CC(O)=O)CC(O)=O URDCARMUOSMFFI-UHFFFAOYSA-N 0.000 abstract 1
KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 abstract 1
QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 abstract 1
150000001622 bismuth compounds Chemical class 0.000 abstract 1
239000008139 complexing agent Substances 0.000 abstract 1
238000004519 manufacturing process Methods 0.000 abstract 1
229910052751 metal Inorganic materials 0.000 abstract 1
239000002184 metal Substances 0.000 abstract 1
150000002739 metals Chemical class 0.000 abstract 1
238000002360 preparation method Methods 0.000 abstract 1
FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 abstract 1

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electroplating And Plating Baths Therefor (AREA)
Dental Preparations (AREA)
Electroplating Methods And Accessories (AREA)

BR0207724-8A 2001-02-28 2002-02-28 Banho para a eletrodeposição de ouro e ligas de ouro e o uso do mesmo BR0207724A (pt)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
DE2001110743 DE10110743A1 (de)	2001-02-28	2001-02-28	Bad zur galvanischen Abscheidung von Gold und Goldlegierungen sowie dessen Verwendung
EP01108448A EP1236814A1 (de)	2001-02-28	2001-04-04	Bad zur galvanischen Abscheidung von Gold und Goldlegierungen sowie dessen Verwendung
PCT/EP2002/002128 WO2002068728A1 (de)	2001-02-28	2002-02-28	Bad zur galvanischen abscheidung von gold und goldlegierungen sowie dessen verwendung

Publications (1)

Publication Number	Publication Date
BR0207724A true BR0207724A (pt)	2004-03-23

Family

ID=26008695

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
BR0207724-8A BR0207724A (pt)	2001-02-28	2002-02-28	Banho para a eletrodeposição de ouro e ligas de ouro e o uso do mesmo

Country Status (8)

Country	Link
US (1)	US20040065225A1 (de)
EP (1)	EP1366219B1 (de)
JP (1)	JP4183240B2 (de)
CN (1)	CN100392155C (de)
AU (1)	AU2002308221A1 (de)
BR (1)	BR0207724A (de)
CA (1)	CA2438207A1 (de)
WO (1)	WO2002068728A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP1378590A1 (de) *	2002-07-04	2004-01-07	Metalor Technologies International S.A.	Bad für goldgalvanischen Goldüberzug
CA2558475A1 (en) *	2004-02-18	2005-09-01	Marianna Cooley	Antimicrobial formulations and methods of using the same
CN1308493C (zh) *	2004-07-27	2007-04-04	滕先弟	硫代硫酸金铵络合物及其制备方法
JP5442400B2 (ja) *	2009-11-13	2014-03-12	ルネサスエレクトロニクス株式会社	半導体集積回路装置の製造方法
CN101781758B (zh) *	2010-04-09	2011-12-07	厦门华弘昌科技有限公司	化学镀镍稳定剂、化学镀镍溶液及化学镀镍工艺
US11579344B2 (en)	2012-09-17	2023-02-14	Government Of The United States Of America, As Represented By The Secretary Of Commerce	Metallic grating
US10889908B2 (en) *	2012-09-17	2021-01-12	Government Of The United States Of America, As Represented By The Secretary Of Commerce	Superconformal filling composition and superconformally filling a recessed feature of an article
ITFI20120208A1 (it) *	2012-10-12	2014-04-13	Bluclad S R L	Soluzione per l'elettrodeposizione di una lega di oro e la lega da essa derivante.
ITFI20130057A1 (it) *	2013-03-18	2014-09-19	Bluclad S R L	Soluzione per l¿elettrodeposizione di una lega di oro e la lega da essa derivante.
CN103938231B (zh) *	2014-03-04	2015-04-01	深圳市联合蓝海科技开发有限公司	一种电镀黄金的方法和硬质黄金的制备方法
CN103938232B (zh) *	2014-03-04	2015-04-01	深圳市联合蓝海新技术有限公司	一种无氰电镀液及其应用
CN104047037B (zh) *	2014-06-16	2015-06-03	深圳市联合蓝海科技开发有限公司	一种硬化剂
CN104862752B (zh) *	2015-06-12	2016-02-17	深圳市联合蓝海投资控股集团有限公司	改性无氰镀金液及其应用和硬质黄金的制备方法
DE112021008234T5 (de) *	2021-09-16	2024-07-11	P & S, Galvasols	Hochgeschwindigkeits-elektroformungs- /elektroplattierungsbad für reines gold
JP7219847B1 (ja)	2022-09-26	2023-02-08	Ｅｅｊａ株式会社	金電気めっき液および金電気めっき方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
BE754151A (fr) *	1969-08-08	1970-12-31	Sel Rex Corp	Bain aqueux pour le placage electrolytique d'or ou d'alliage d'or sur un article conducteur, procede de fabrication dudit bain aqueux et utilisation de celui-ci
CH622829A5 (de) *	1977-08-29	1981-04-30	Systemes Traitements Surfaces
JP2592246B2 (ja) *	1987-04-10	1997-03-19	株式会社ジーシー	歯冠修復用複合冠の内側冠の作製方法及び装置
DE3805627A1 (de) *	1988-02-24	1989-09-07	Wieland Edelmetalle	Goldbad
US5277790A (en) *	1992-07-10	1994-01-11	Technic Incorporated	Non-cyanide electroplating solution for gold or alloys thereof
DE19629658C2 (de) *	1996-07-23	1999-01-14	Degussa	Cyanidfreies galvanisches Bad zur Abscheidung von Gold und Goldlegierungen
DE19845506A1 (de) *	1998-10-02	2000-04-06	Wieland Edelmetalle	Verfahren zur Herstellung von prothetischen Formteilen für den Dentalbereich und prothetisches Formteil

2002
- 2002-02-28 CA CA002438207A patent/CA2438207A1/en not_active Abandoned
- 2002-02-28 EP EP02744906.5A patent/EP1366219B1/de not_active Expired - Lifetime
- 2002-02-28 WO PCT/EP2002/002128 patent/WO2002068728A1/de not_active Ceased
- 2002-02-28 CN CNB028056736A patent/CN100392155C/zh not_active Expired - Lifetime
- 2002-02-28 BR BR0207724-8A patent/BR0207724A/pt not_active Application Discontinuation
- 2002-02-28 JP JP2002568818A patent/JP4183240B2/ja not_active Expired - Fee Related
- 2002-02-28 AU AU2002308221A patent/AU2002308221A1/en not_active Abandoned
- 2002-02-28 US US10/469,146 patent/US20040065225A1/en not_active Abandoned

Also Published As

Publication number	Publication date
CA2438207A1 (en)	2002-09-06
EP1366219B1 (de)	2014-09-03
JP4183240B2 (ja)	2008-11-19
CN100392155C (zh)	2008-06-04
EP1366219A2 (de)	2003-12-03
WO2002068728A8 (de)	2003-09-18
WO2002068728A1 (de)	2002-09-06
JP2004527653A (ja)	2004-09-09
AU2002308221A1 (en)	2002-09-12
US20040065225A1 (en)	2004-04-08
CN1494606A (zh)	2004-05-05

Legal Events

Date	Code	Title	Description
2006-10-03	B11A	Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
2006-12-26	B11Y	Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]

Publication	Publication Date	Title
BR0207724A (pt)	2004-03-23	Banho para a eletrodeposição de ouro e ligas de ouro e o uso do mesmo
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DE69912279D1 (de)	2003-11-27	5-ht1f agonisten
FR2396013A1 (fr)	1979-01-26	Compositions a base de dialkyl(inferieurs) magnesium
FR2428999A1 (fr)	1980-01-18	Matelas benefique pour la sante
DE60108382D1 (de)	2005-02-17	Korrosionsbeständige legierungen der 6000 serien verwendbar für die luftfahrt
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ATE463174T1 (de)	2010-04-15	Entfaltbare schnalle für armband
ES2050317T3 (es)	1994-05-16	Baño galvanico para aleacion de oro.
FR2839155B1 (fr)	2005-02-04	Procede pour detecter et localiser des traces de sang et compose pour detecter des traces de sang
BRPI0408621A (pt)	2006-03-07	formulação para inibir corrosão e carepas
EP0892087A3 (de)	2000-06-07	Elektrobeschichtung von spannungsarmem Nickel
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BR0316810A (pt)	2005-10-18	Uso de um agonista de ppar(alfa) e metformina para diminuir os triglicerìdeos séricos
PE20040713A1 (es)	2004-12-02	Avermectina b1 y derivados de monosacaridos de avermectina b1 que tienen un sustituyente alcoximetilo en la posicion 4" o 4'
ATE418932T1 (de)	2009-01-15	Dentalimplantat für magnetische befestigung
CO5560615A2 (es)	2005-09-30	Derivados de 4-desoxi-4(s)-amino avermectina
FR2400571A1 (fr)	1979-03-16	Procede et composition d'electrodeposition acide de zinc
BR0213357A (pt)	2004-10-26	Compostos orgânicos