BR0207724A - Banho para a eletrodeposição de ouro e ligas de ouro e o uso do mesmo - Google Patents
Banho para a eletrodeposição de ouro e ligas de ouro e o uso do mesmoInfo
- Publication number
- BR0207724A BR0207724A BR0207724-8A BR0207724A BR0207724A BR 0207724 A BR0207724 A BR 0207724A BR 0207724 A BR0207724 A BR 0207724A BR 0207724 A BR0207724 A BR 0207724A
- Authority
- BR
- Brazil
- Prior art keywords
- gold
- bath
- bismuth
- alloys
- compound
- Prior art date
Links
- 229910001020 Au alloy Inorganic materials 0.000 title abstract 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title abstract 3
- 239000010931 gold Substances 0.000 title abstract 3
- 229910052737 gold Inorganic materials 0.000 title abstract 3
- 239000003353 gold alloy Substances 0.000 title abstract 3
- 238000004070 electrodeposition Methods 0.000 title abstract 2
- 239000000654 additive Substances 0.000 abstract 2
- 229910052797 bismuth Inorganic materials 0.000 abstract 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 2
- 238000009713 electroplating Methods 0.000 abstract 2
- SRCZENKQCOSNAI-UHFFFAOYSA-H gold(3+);trisulfite Chemical class [Au+3].[Au+3].[O-]S([O-])=O.[O-]S([O-])=O.[O-]S([O-])=O SRCZENKQCOSNAI-UHFFFAOYSA-H 0.000 abstract 2
- URDCARMUOSMFFI-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]ethyl-(2-hydroxyethyl)amino]acetic acid Chemical compound OCCN(CC(O)=O)CCN(CC(O)=O)CC(O)=O URDCARMUOSMFFI-UHFFFAOYSA-N 0.000 abstract 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 abstract 1
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 abstract 1
- 150000001622 bismuth compounds Chemical class 0.000 abstract 1
- 239000008139 complexing agent Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 238000002360 preparation method Methods 0.000 abstract 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Dental Preparations (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
"BANHO PARA A ELETRODEPOSIçãO DE OURO E LIGAS DE OURO E O USO DO MESMO". A invenção refere-se a um banho para a eletrodeposição de ouro e ligas de ouro e ao seu uso para a produção de modelagens dentais. Neste banho, o ouro está na forma de um complexo de sulfito de ouro. O banho de acordo com a invenção e/ou o uso de acordo com a invenção é distinguido pelo fato de que, além da presença opcional de outros metais e aditivos usuais para os banhos de sulfito de ouro deste tipo, há pelo menos um composto de bismuto. Este composto de bismuto é, de preferência, um composto de complexo, em particular com os agentes formadores de complexos NTA, HEDTA, TEPA, DTPA, EDNTA e EDTA. A invenção tem uma faixa ampla de vantagens associadas a essa. Uma vantagem que deve ser particularmente enfatizada é que a adição de bismuto pode ser feita ao banho tão cedo como durante a sua preparação. Isso significa que o usuário é provido com um banho, que é capaz de funcionar por um período de tempo prolongado e ao qual não é imperativo adicionar outros aditivos, antes da eletrodeposição.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2001110743 DE10110743A1 (de) | 2001-02-28 | 2001-02-28 | Bad zur galvanischen Abscheidung von Gold und Goldlegierungen sowie dessen Verwendung |
| EP01108448A EP1236814A1 (de) | 2001-02-28 | 2001-04-04 | Bad zur galvanischen Abscheidung von Gold und Goldlegierungen sowie dessen Verwendung |
| PCT/EP2002/002128 WO2002068728A1 (de) | 2001-02-28 | 2002-02-28 | Bad zur galvanischen abscheidung von gold und goldlegierungen sowie dessen verwendung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR0207724A true BR0207724A (pt) | 2004-03-23 |
Family
ID=26008695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR0207724-8A BR0207724A (pt) | 2001-02-28 | 2002-02-28 | Banho para a eletrodeposição de ouro e ligas de ouro e o uso do mesmo |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20040065225A1 (pt) |
| EP (1) | EP1366219B1 (pt) |
| JP (1) | JP4183240B2 (pt) |
| CN (1) | CN100392155C (pt) |
| AU (1) | AU2002308221A1 (pt) |
| BR (1) | BR0207724A (pt) |
| CA (1) | CA2438207A1 (pt) |
| WO (1) | WO2002068728A1 (pt) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1378590A1 (fr) * | 2002-07-04 | 2004-01-07 | Metalor Technologies International S.A. | Bain pour dépôts electrolytiques d'or |
| US7700133B2 (en) * | 2004-02-18 | 2010-04-20 | Marianna Cooley | Antimicrobial formulations and methods of using the same |
| CN1308493C (zh) * | 2004-07-27 | 2007-04-04 | 滕先弟 | 硫代硫酸金铵络合物及其制备方法 |
| JP5442400B2 (ja) * | 2009-11-13 | 2014-03-12 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置の製造方法 |
| CN101781758B (zh) * | 2010-04-09 | 2011-12-07 | 厦门华弘昌科技有限公司 | 化学镀镍稳定剂、化学镀镍溶液及化学镀镍工艺 |
| US11579344B2 (en) | 2012-09-17 | 2023-02-14 | Government Of The United States Of America, As Represented By The Secretary Of Commerce | Metallic grating |
| US10889908B2 (en) * | 2012-09-17 | 2021-01-12 | Government Of The United States Of America, As Represented By The Secretary Of Commerce | Superconformal filling composition and superconformally filling a recessed feature of an article |
| ITFI20120208A1 (it) * | 2012-10-12 | 2014-04-13 | Bluclad S R L | Soluzione per l'elettrodeposizione di una lega di oro e la lega da essa derivante. |
| ITFI20130057A1 (it) * | 2013-03-18 | 2014-09-19 | Bluclad S R L | Soluzione per l¿elettrodeposizione di una lega di oro e la lega da essa derivante. |
| CN103938232B (zh) * | 2014-03-04 | 2015-04-01 | 深圳市联合蓝海新技术有限公司 | 一种无氰电镀液及其应用 |
| CN103938231B (zh) * | 2014-03-04 | 2015-04-01 | 深圳市联合蓝海科技开发有限公司 | 一种电镀黄金的方法和硬质黄金的制备方法 |
| CN104047037B (zh) * | 2014-06-16 | 2015-06-03 | 深圳市联合蓝海科技开发有限公司 | 一种硬化剂 |
| CN104862752B (zh) * | 2015-06-12 | 2016-02-17 | 深圳市联合蓝海投资控股集团有限公司 | 改性无氰镀金液及其应用和硬质黄金的制备方法 |
| US20240271306A1 (en) * | 2021-09-16 | 2024-08-15 | P & S, Galvasols | High-speed pure gold electroforming/electroplating bath |
| JP7219847B1 (ja) | 2022-09-26 | 2023-02-08 | Ｅｅｊａ株式会社 | 金電気めっき液および金電気めっき方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE754151A (fr) * | 1969-08-08 | 1970-12-31 | Sel Rex Corp | Bain aqueux pour le placage electrolytique d'or ou d'alliage d'or sur un article conducteur, procede de fabrication dudit bain aqueux et utilisation de celui-ci |
| CH622829A5 (pt) * | 1977-08-29 | 1981-04-30 | Systemes Traitements Surfaces | |
| JP2592246B2 (ja) * | 1987-04-10 | 1997-03-19 | 株式会社ジーシー | 歯冠修復用複合冠の内側冠の作製方法及び装置 |
| DE3805627A1 (de) * | 1988-02-24 | 1989-09-07 | Wieland Edelmetalle | Goldbad |
| US5277790A (en) * | 1992-07-10 | 1994-01-11 | Technic Incorporated | Non-cyanide electroplating solution for gold or alloys thereof |
| DE19629658C2 (de) * | 1996-07-23 | 1999-01-14 | Degussa | Cyanidfreies galvanisches Bad zur Abscheidung von Gold und Goldlegierungen |
| DE19845506A1 (de) * | 1998-10-02 | 2000-04-06 | Wieland Edelmetalle | Verfahren zur Herstellung von prothetischen Formteilen für den Dentalbereich und prothetisches Formteil |
-
2002
- 2002-02-28 BR BR0207724-8A patent/BR0207724A/pt not_active Application Discontinuation
- 2002-02-28 US US10/469,146 patent/US20040065225A1/en not_active Abandoned
- 2002-02-28 AU AU2002308221A patent/AU2002308221A1/en not_active Abandoned
- 2002-02-28 JP JP2002568818A patent/JP4183240B2/ja not_active Expired - Fee Related
- 2002-02-28 CN CNB028056736A patent/CN100392155C/zh not_active Expired - Lifetime
- 2002-02-28 CA CA002438207A patent/CA2438207A1/en not_active Abandoned
- 2002-02-28 WO PCT/EP2002/002128 patent/WO2002068728A1/de not_active Ceased
- 2002-02-28 EP EP02744906.5A patent/EP1366219B1/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004527653A (ja) | 2004-09-09 |
| WO2002068728A8 (de) | 2003-09-18 |
| WO2002068728A1 (de) | 2002-09-06 |
| US20040065225A1 (en) | 2004-04-08 |
| AU2002308221A1 (en) | 2002-09-12 |
| EP1366219A2 (de) | 2003-12-03 |
| JP4183240B2 (ja) | 2008-11-19 |
| CA2438207A1 (en) | 2002-09-06 |
| CN100392155C (zh) | 2008-06-04 |
| EP1366219B1 (de) | 2014-09-03 |
| CN1494606A (zh) | 2004-05-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B11A | Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing | ||
| B11Y | Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette] |