BRPI0409723A - componente moldado em resina multicor para aparelhos móveis - Google Patents

componente moldado em resina multicor para aparelhos móveis

Info

Publication number
BRPI0409723A
BRPI0409723A BRPI0409723-8A BRPI0409723A BRPI0409723A BR PI0409723 A BRPI0409723 A BR PI0409723A BR PI0409723 A BRPI0409723 A BR PI0409723A BR PI0409723 A BRPI0409723 A BR PI0409723A
Authority
BR
Brazil
Prior art keywords
mobile devices
resin
multicolour
resin molded
molded component
Prior art date
Application number
BRPI0409723-8A
Other languages
English (en)
Inventor
Takashi Yasuhara
Original Assignee
Sunarrow Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sunarrow Ltd filed Critical Sunarrow Ltd
Publication of BRPI0409723A publication Critical patent/BRPI0409723A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/02—Details
    • H01H13/12—Movable parts; Contacts mounted thereon
    • H01H13/14—Operating parts, e.g. push-button
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2229/00—Manufacturing
    • H01H2229/014—Electro deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2229/00—Manufacturing
    • H01H2229/044—Injection moulding
    • H01H2229/046—Multi-colour or double shot injection moulding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Push-Button Switches (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacture Of Switches (AREA)

Abstract

"COMPONENTE MOLDADO EM RESINA MULTICOR PARA APARELHOS MóVEIS". Para realizar um projeto mais avançado e mais diversificado para um topo de tecla ou membro ornamental de um comutador de botão de pressão desenvolveu-se um processo de ornamentação usado na metalização de componentes de resina para aparelhos móveis. Um topo de tecla ou membro ornamental de um comutador de botão de pressão proposto é formado usando um processo de moldagem de resina multicor em que diferentes materiais de resina são integralmente moldados, e uma película metalizada do mesmo metal ou de diferentes tipos de metais é afixada a cada uma de uma pluralidade de regiões mutuamente isoladas sobre uma superfície do componente de resina.
BRPI0409723-8A 2003-04-25 2004-04-15 componente moldado em resina multicor para aparelhos móveis BRPI0409723A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003122060A JP2004327306A (ja) 2003-04-25 2003-04-25 モバイル機器用の多色樹脂成形部品
PCT/JP2004/005416 WO2004097875A1 (ja) 2003-04-25 2004-04-15 モバイル機器用の多色樹脂成形部品

Publications (1)

Publication Number Publication Date
BRPI0409723A true BRPI0409723A (pt) 2006-05-02

Family

ID=33410060

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0409723-8A BRPI0409723A (pt) 2003-04-25 2004-04-15 componente moldado em resina multicor para aparelhos móveis

Country Status (8)

Country Link
US (1) US20060222824A1 (pt)
EP (1) EP1626422A4 (pt)
JP (1) JP2004327306A (pt)
KR (1) KR20060010724A (pt)
CN (1) CN1762034A (pt)
BR (1) BRPI0409723A (pt)
MX (1) MXPA05011504A (pt)
WO (1) WO2004097875A1 (pt)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007198483A (ja) * 2006-01-26 2007-08-09 Kyocera Corp メッキ付樹脂部材の固定構造、電子機器及びメッキ付樹脂部材の固定方法
JP2008000983A (ja) * 2006-06-22 2008-01-10 Seiko Epson Corp ２色成形部材、２色製品、電子機器及びメッキ処理方法
DE102008044974A1 (de) 2008-08-29 2010-03-04 Daimler Ag Bauteil mit einem Kunststoffkörper mit einem metallisch beschichteten Oberflächenbereich und Verfahren zu dessen Herstellung
KR101041281B1 (ko) * 2009-05-18 2011-06-14 주식회사 니프코코리아 자동차의 에어벤트 다이얼
KR101474394B1 (ko) 2011-07-13 2014-12-18 주식회사 엘지화학 이차 전지 제조 방법 및 그 방법에 의하여 제조된 이차 전지
FR3003080B1 (fr) * 2013-03-08 2015-03-13 Seb Sa Tableau de commande d'appareil electromenager et procede de fabrication d'un tel tableau de commande
US11326268B2 (en) * 2015-05-14 2022-05-10 Lacks Enterprises, Inc. Floating metallized element assembly and method of manufacturing thereof
US10737530B2 (en) * 2015-05-14 2020-08-11 Lacks Enterprises, Inc. Two-shot molding for selectively metalizing parts
US11408086B2 (en) * 2015-05-14 2022-08-09 Lacks Enterprises, Inc. Method for creating multiple electrical current pathways on a work piece
US20230242049A1 (en) * 2015-05-14 2023-08-03 Lacks Enterprises, Inc. Decorative automotive component having multiple electrical current pathways and different surface finishes
US11639552B2 (en) * 2015-05-14 2023-05-02 Lacks Enterprises, Inc. Method for creating multiple electrical current pathways on a work piece
JP6789586B1 (ja) 2020-01-16 2020-11-25 山本印刷株式会社 通信機器用の外郭部材

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1254308A (en) * 1968-12-19 1971-11-17 Bakelite Xylonite Ltd Selective plating of plastics mouldings
US3640789A (en) * 1969-04-01 1972-02-08 Furniture City Mfg Corp Method of making metal-plated plastic articles
JPS531135A (en) * 1976-06-25 1978-01-07 Nissan Motor Partial plating method of plastics
JPS55745A (en) * 1978-06-20 1980-01-07 Nissei Plastics Ind Co Partial metal plating of synthetic resin molded article
EP0132485A1 (en) * 1983-07-21 1985-02-13 Celluloid I Gislaved Ab A method of producing chromium-plated plastics materials or plastics details, and an apparatus for carrying the method into effect
JPH10102268A (ja) * 1996-09-24 1998-04-21 Kanehiro Metaraijingu:Kk 装飾品
FI973391A7 (fi) * 1997-08-19 1999-02-20 Silitek Corp Metallivärinen kaksoisväritetty ekstrudoitu muovinäppäin
JPH11167839A (ja) * 1997-12-02 1999-06-22 Porimatec Kk 照光キースイッチ
EP1020947A3 (en) * 1998-12-22 2000-10-04 Nokia Mobile Phones Ltd. Method for manufacturing an antenna body for a phone and phone or handset having an internal antenna
US6433728B1 (en) * 1999-01-22 2002-08-13 Lear Automotive Dearborn, Inc. Integrally molded remote entry transmitter
JP4489929B2 (ja) * 2000-11-09 2010-06-23 ポリマテック株式会社 キーシート
JP2002175738A (ja) * 2000-12-07 2002-06-21 Polymatech Co Ltd 加飾キートップ
JP2002212780A (ja) * 2001-01-19 2002-07-31 Ishikawa Kinzoku Kogyo Kk プラスチックへの部分めっき方法
TW554086B (en) * 2001-02-16 2003-09-21 Taiyo Mfg Co Ltd Method for producing plated molded product
JP2003077358A (ja) * 2001-08-31 2003-03-14 Polymatech Co Ltd 押釦スイッチ用キートップおよびその製造方法

Also Published As

Publication number Publication date
JP2004327306A (ja) 2004-11-18
US20060222824A1 (en) 2006-10-05
KR20060010724A (ko) 2006-02-02
EP1626422A1 (en) 2006-02-15
EP1626422A4 (en) 2007-08-08
MXPA05011504A (es) 2006-04-18
WO2004097875A1 (ja) 2004-11-11
CN1762034A (zh) 2006-04-19

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Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]