BRPI0413775A - material de enchimento não fluivel tendo baixo coeficiente de expansão térmica e boa performance de fluxo de soldagem em bolhas - Google Patents

material de enchimento não fluivel tendo baixo coeficiente de expansão térmica e boa performance de fluxo de soldagem em bolhas

Info

Publication number
BRPI0413775A
BRPI0413775A BRPI0413775A BRPI0413775A BR PI0413775 A BRPI0413775 A BR PI0413775A BR PI0413775 A BRPI0413775 A BR PI0413775A BR PI0413775 A BRPI0413775 A BR PI0413775A
Authority
BR
Brazil
Prior art keywords
thermal expansion
flow performance
expansion coefficient
filler material
welding flow
Prior art date
Application number
Other languages
English (en)
Inventor
Slawomir Rubinsztajn
Sandeep Tonapi
John Campbell
Ananth Prabhakumar
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of BRPI0413775A publication Critical patent/BRPI0413775A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/02—Layer formed of wires, e.g. mesh
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Sealing Material Composition (AREA)

Abstract

"MATERIAL DE ENCHIMENTO NãO FLUIVEL TENDO BAIXO COEFICIENTE DE EXPANSãO TéRMICA E BOA PERFORMANCE DE FLUXO DE SOLDAGEM EM BOLHAS". Uma composição de enchimento não fluivel compreendendo uma resina epóxi em combinação com um endurecedor epóxi e reagentes opcionais e um enchimento de sílica coloidal tendo um tamanho de partícula variando de 1 mm a em torno de 250 nm. A sílica coloidal é funcionalizada com ao menos um agente de funcionalização organoacolxisilano e subseqüentemente funcionalizado com ao menos um agente de capeamento. O endurecedor epóxi inclui agentes de cura anidrido. Os reagentes opcionais incluem catalizadores de cura e monómeros contendo hidroxil. Os promotores de adesão, retardadores de chama e agentes desformantes também podem ser adicionados a composição. Um desenvolvimento adicional da presente descrição inclui dispositivos de estado sólido empacotados compreendendo as composições de enchimento.
BRPI0413775 2003-09-02 2004-09-01 material de enchimento não fluivel tendo baixo coeficiente de expansão térmica e boa performance de fluxo de soldagem em bolhas BRPI0413775A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/653,371 US20050048700A1 (en) 2003-09-02 2003-09-02 No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance
PCT/US2004/028404 WO2005021647A1 (en) 2003-09-02 2004-09-01 No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance

Publications (1)

Publication Number Publication Date
BRPI0413775A true BRPI0413775A (pt) 2006-10-31

Family

ID=34217877

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0413775 BRPI0413775A (pt) 2003-09-02 2004-09-01 material de enchimento não fluivel tendo baixo coeficiente de expansão térmica e boa performance de fluxo de soldagem em bolhas

Country Status (12)

Country Link
US (1) US20050048700A1 (pt)
EP (1) EP1664192A1 (pt)
JP (1) JP2007504336A (pt)
KR (1) KR20060132799A (pt)
CN (1) CN1875068A (pt)
AU (1) AU2004268147A1 (pt)
BR (1) BRPI0413775A (pt)
CA (1) CA2537688A1 (pt)
MX (1) MXPA06002463A (pt)
RU (1) RU2006110560A (pt)
WO (1) WO2005021647A1 (pt)
ZA (1) ZA200602272B (pt)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
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US20050170188A1 (en) * 2003-09-03 2005-08-04 General Electric Company Resin compositions and methods of use thereof
US20050266263A1 (en) * 2002-11-22 2005-12-01 General Electric Company Refractory solid, adhesive composition, and device, and associated method
US20060147719A1 (en) * 2002-11-22 2006-07-06 Slawomir Rubinsztajn Curable composition, underfill, and method
US20040102529A1 (en) * 2002-11-22 2004-05-27 Campbell John Robert Functionalized colloidal silica, dispersions and methods made thereby
JP2007504334A (ja) * 2003-09-03 2007-03-01 ゼネラル・エレクトリック・カンパニイ 溶媒改質樹脂組成物及びその使用法
TW200604269A (en) * 2004-04-06 2006-02-01 Showa Denko Kk Thermosetting composition and curing method thereof
US7446136B2 (en) * 2005-04-05 2008-11-04 Momentive Performance Materials Inc. Method for producing cure system, adhesive system, and electronic device
US10041176B2 (en) 2005-04-07 2018-08-07 Momentive Performance Materials Inc. No-rinse pretreatment methods and compositions
GB0512610D0 (en) * 2005-06-18 2005-07-27 Hexcel Composites Ltd Composite material
US8048819B2 (en) * 2005-06-23 2011-11-01 Momentive Performance Materials Inc. Cure catalyst, composition, electronic device and associated method
KR100833568B1 (ko) 2006-12-28 2008-05-30 제일모직주식회사 플립칩 패키지용 비도전성 페이스트 조성물
US8039305B2 (en) * 2007-04-27 2011-10-18 Sumitomo Bakelite Company, Ltd. Method for bonding semiconductor wafers and method for manufacturing semiconductor device
CN101809088B (zh) * 2007-09-25 2012-10-24 日立化成工业株式会社 热固性光反射用树脂组合物、使用该组合物的光半导体元件搭载用基板及其制造方法、以及光半导体装置
JP5493327B2 (ja) * 2007-12-18 2014-05-14 日立化成株式会社 封止充てん用樹脂組成物、並びに半導体装置及びその製造方法
JP5152656B2 (ja) * 2008-03-26 2013-02-27 荒川化学工業株式会社 表面被覆シリカオルガノゾルの製造方法、および表面被覆シリカ粒子含有エポキシ樹脂組成物の製造方法
US8070046B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Amine flux composition and method of soldering
US8070045B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Curable amine flux composition and method of soldering
KR20130059291A (ko) 2011-11-28 2013-06-05 닛토덴코 가부시키가이샤 언더필재 및 반도체 장치의 제조 방법
KR101867955B1 (ko) * 2012-04-13 2018-06-15 삼성전자주식회사 패키지 온 패키지 장치 및 이의 제조 방법

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4217438A (en) * 1978-12-15 1980-08-12 General Electric Company Polycarbonate transesterification process
JPH07100766B2 (ja) * 1987-06-25 1995-11-01 ソマール株式会社 エポキシ樹脂粉体塗料組成物
CA2010331A1 (en) * 1989-03-02 1990-09-02 James O. Peterson Low stress epoxy encapsulant compositions
JP3098663B2 (ja) * 1993-09-28 2000-10-16 日東電工株式会社 熱硬化性樹脂組成物およびその製法
US6180696B1 (en) * 1997-02-19 2001-01-30 Georgia Tech Research Corporation No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant
US6576718B1 (en) * 1999-10-05 2003-06-10 General Electric Company Powder coating of thermosetting resin(s) and poly(phenylene ethers(s))
US6555602B1 (en) * 1999-10-06 2003-04-29 Nitto Denko Corporation Composition of epoxy resin, anhydride and microcapsule accelerator
JP4633214B2 (ja) * 1999-12-08 2011-02-16 富士通株式会社 エポキシ樹脂組成物
US6664318B1 (en) * 1999-12-20 2003-12-16 3M Innovative Properties Company Encapsulant compositions with thermal shock resistance
JP3707534B2 (ja) * 2000-12-15 2005-10-19 信越化学工業株式会社 半導体スクリーン印刷封止用液状エポキシ樹脂組成物
JP2003105168A (ja) * 2001-09-28 2003-04-09 Nitto Denko Corp 半導体封止用樹脂組成物およびそれを用いた半導体装置
US6548189B1 (en) * 2001-10-26 2003-04-15 General Electric Company Epoxy adhesive
US20040101688A1 (en) * 2002-11-22 2004-05-27 Slawomir Rubinsztajn Curable epoxy compositions, methods and articles made therefrom
US20040102529A1 (en) * 2002-11-22 2004-05-27 Campbell John Robert Functionalized colloidal silica, dispersions and methods made thereby
JP4176619B2 (ja) * 2003-07-18 2008-11-05 信越化学工業株式会社 フリップチップ実装用サイドフィル材及び半導体装置
JP3925803B2 (ja) * 2003-07-18 2007-06-06 信越化学工業株式会社 フリップチップ実装用サイドフィル材及び半導体装置

Also Published As

Publication number Publication date
JP2007504336A (ja) 2007-03-01
US20050048700A1 (en) 2005-03-03
AU2004268147A1 (en) 2005-03-10
KR20060132799A (ko) 2006-12-22
WO2005021647A1 (en) 2005-03-10
CA2537688A1 (en) 2005-03-10
CN1875068A (zh) 2006-12-06
MXPA06002463A (es) 2006-06-20
ZA200602272B (en) 2007-06-27
RU2006110560A (ru) 2007-10-10
EP1664192A1 (en) 2006-06-07

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 6A E 7A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2159 DE 22/05/2012.