BRPI0415539A - processo para a produção de um filme - Google Patents

processo para a produção de um filme

Info

Publication number
BRPI0415539A
BRPI0415539A BRPI0415539-4A BRPI0415539A BRPI0415539A BR PI0415539 A BRPI0415539 A BR PI0415539A BR PI0415539 A BRPI0415539 A BR PI0415539A BR PI0415539 A BRPI0415539 A BR PI0415539A
Authority
BR
Brazil
Prior art keywords
film
model
adhesive layer
base film
electrical functional
Prior art date
Application number
BRPI0415539-4A
Other languages
English (en)
Inventor
Heinrich Wild
Ludwig Brehm
Achim Hansen
Original Assignee
Kurz Leonhard Fa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kurz Leonhard Fa filed Critical Kurz Leonhard Fa
Publication of BRPI0415539A publication Critical patent/BRPI0415539A/pt
Publication of BRPI0415539B1 publication Critical patent/BRPI0415539B1/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/18—Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/743—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Thin Film Transistor (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electroluminescent Light Sources (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Adhesive Tapes (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Decoration By Transfer Pictures (AREA)

Abstract

"PROCESSO PARA A PRODUçãO DE UM FILME". A invenção diz respeito a um filme (66) tendo pelo menos um componente elétrico e a um processo para a produção desse filme. Uma camada adesiva, compreendendo um adesivo reticulável por radiação, é aplicada a um filme de base (61). A camada adesiva é aplicada ao filme de base, em uma forma de ser estruturada em forma de modelo e/ou é irradiada em forma de modelo de tal modo que a camada adesiva endurece com estruturação em forma de modelo. Um filme de transferência (41), que compreende um filme transportador e uma camada funcional elétrica, é aplicado à camada adesiva. O filme transportador (41) é puxado do corpo de filme compreendendo o filme de base, a camada adesiva e a camada funcional elétrica, em que, em uma primeira região estruturada em forma de modelo, a camada funcional elétrica permanece sobre o filme de base (62), e em uma segunda região, estruturada em forma de modelo, a camada funcional elétrica permanece sobre o filme transportador e é puxada do filme de base (61) com o filme transportador.
BRPI0415539A 2003-10-24 2004-10-19 processo para a produção de um filme BRPI0415539B1 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10349963A DE10349963A1 (de) 2003-10-24 2003-10-24 Verfahren zur Herstellung einer Folie
PCT/DE2004/002319 WO2005039868A2 (de) 2003-10-24 2004-10-19 Strukturierung von elektrischen funktionsschichten mittels einer transferfolie und strukturierung des klebers

Publications (2)

Publication Number Publication Date
BRPI0415539A true BRPI0415539A (pt) 2006-12-26
BRPI0415539B1 BRPI0415539B1 (pt) 2017-06-06

Family

ID=34485079

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0415539A BRPI0415539B1 (pt) 2003-10-24 2004-10-19 processo para a produção de um filme

Country Status (14)

Country Link
US (1) US7700402B2 (pt)
EP (1) EP1676330B1 (pt)
JP (1) JP4943852B2 (pt)
KR (1) KR101193315B1 (pt)
CN (1) CN1871721B (pt)
AT (1) ATE469442T1 (pt)
AU (1) AU2004283127B2 (pt)
BR (1) BRPI0415539B1 (pt)
CA (1) CA2542360C (pt)
DE (2) DE10349963A1 (pt)
ES (1) ES2346655T3 (pt)
RU (1) RU2346359C2 (pt)
TW (1) TWI383459B (pt)
WO (1) WO2005039868A2 (pt)

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DE102007032250B3 (de) * 2007-07-11 2008-12-18 ROWO Coating Gesellschaft für Beschichtung mbH Vorrichtung zum Detektieren von Flüssigkeitslecks
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Also Published As

Publication number Publication date
CA2542360C (en) 2011-06-14
ES2346655T3 (es) 2010-10-19
TW200520112A (en) 2005-06-16
CN1871721B (zh) 2010-04-28
RU2346359C2 (ru) 2009-02-10
KR101193315B1 (ko) 2012-10-19
AU2004283127A1 (en) 2005-05-06
KR20060125769A (ko) 2006-12-06
JP2007515782A (ja) 2007-06-14
TWI383459B (zh) 2013-01-21
ATE469442T1 (de) 2010-06-15
CN1871721A (zh) 2006-11-29
EP1676330A2 (de) 2006-07-05
EP1676330B1 (de) 2010-05-26
JP4943852B2 (ja) 2012-05-30
RU2006117778A (ru) 2007-11-27
DE10349963A1 (de) 2005-06-02
DE502004011216D1 (de) 2010-07-08
AU2004283127B2 (en) 2009-07-30
CA2542360A1 (en) 2005-05-06
US7700402B2 (en) 2010-04-20
WO2005039868A2 (de) 2005-05-06
BRPI0415539B1 (pt) 2017-06-06
WO2005039868A3 (de) 2006-01-26
US20070077679A1 (en) 2007-04-05

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