BR0307364A - Método para embutir um componente em uma base e produzir um contato - Google Patents

Método para embutir um componente em uma base e produzir um contato

Info

Publication number
BR0307364A
BR0307364A BR0307364-5A BR0307364A BR0307364A BR 0307364 A BR0307364 A BR 0307364A BR 0307364 A BR0307364 A BR 0307364A BR 0307364 A BR0307364 A BR 0307364A
Authority
BR
Brazil
Prior art keywords
base
component
contact
semiconductor components
semiconductor
Prior art date
Application number
BR0307364-5A
Other languages
English (en)
Other versions
BRPI0307364B1 (pt
Inventor
Risto Tuominen
Original Assignee
Imbera Eletronics Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imbera Eletronics Oy filed Critical Imbera Eletronics Oy
Publication of BR0307364A publication Critical patent/BR0307364A/pt
Publication of BRPI0307364B1 publication Critical patent/BRPI0307364B1/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H10W70/614—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together the multiple chips being integrally enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/10—Configurations of laterally-adjacent chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
  • Reverberation, Karaoke And Other Acoustics (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

"MéTODO PARA EMBUTIR UM COMPONENTE EM UMA BASE E PRODUZIR UM CONTATO". A presente invenção divulga um método em que componentes semicondutores que fazem parte de um circuito eletrónico, ou pelo menos alguns dos mesmos, são embutidos em uma base, tal como um painel de circuito, durante a fabricação da base. Assim, a estrutura da base é mais ou menos fabricada em torno do componente semicondutor. De acordo com a invenção, em primeiro lugar, são feitos na base pelo menos três padrões condutores e furos vazados para os componentes semicondutores. Em seguida, os componentes semicondutores são colocados nos furos em alinhamento com o padrão condutor. Os componentes semicondutores são fixados à estrutura da base e uma ou mais camadas de padrões condutores são feitas na base, de tal modo que pelo menos um padrão condutor forme um contato elétrico com as áreas de contato da superfície do componente semicondutor.
BRPI0307364A 2002-01-31 2003-01-28 método para embutir um componente em uma base e produzir um contato, e módulo eletrônico fabricado usando o referido método BRPI0307364B1 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20020190A FI115285B (fi) 2002-01-31 2002-01-31 Menetelmä komponentin upottamiseksi alustaan ja kontaktin muodostamiseksi
PCT/FI2003/000064 WO2003065778A1 (en) 2002-01-31 2003-01-28 Method for embedding a component in a base and forming a contact

Publications (2)

Publication Number Publication Date
BR0307364A true BR0307364A (pt) 2004-12-14
BRPI0307364B1 BRPI0307364B1 (pt) 2017-02-21

Family

ID=8563006

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0307364A BRPI0307364B1 (pt) 2002-01-31 2003-01-28 método para embutir um componente em uma base e produzir um contato, e módulo eletrônico fabricado usando o referido método

Country Status (12)

Country Link
US (1) US6991966B2 (pt)
EP (1) EP1474959B1 (pt)
JP (1) JP2005517287A (pt)
KR (2) KR101013325B1 (pt)
CN (1) CN100566511C (pt)
AT (1) ATE295064T1 (pt)
BR (1) BRPI0307364B1 (pt)
DE (1) DE60300619T2 (pt)
FI (1) FI115285B (pt)
IL (1) IL163238A (pt)
RU (1) RU2297736C2 (pt)
WO (1) WO2003065778A1 (pt)

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DE60300619T2 (de) 2006-01-19
HK1077151A1 (zh) 2006-02-03
EP1474959B1 (en) 2005-05-04
JP2005517287A (ja) 2005-06-09
IL163238A (en) 2009-06-15
FI115285B (fi) 2005-03-31
RU2004126137A (ru) 2005-06-10
DE60300619D1 (de) 2005-06-09
KR20100126546A (ko) 2010-12-01
RU2297736C2 (ru) 2007-04-20
EP1474959A1 (en) 2004-11-10
ATE295064T1 (de) 2005-05-15
KR101013325B1 (ko) 2011-02-09
CN1625927A (zh) 2005-06-08
CN100566511C (zh) 2009-12-02
BRPI0307364B1 (pt) 2017-02-21
FI20020190A0 (fi) 2002-01-31
WO2003065778A1 (en) 2003-08-07
US6991966B2 (en) 2006-01-31
FI20020190A7 (fi) 2003-08-01
KR20040073606A (ko) 2004-08-19
US20050124148A1 (en) 2005-06-09

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