BRPI0418349A - portadora flexìvel com uma estrutura eletricamente condutiva - Google Patents

portadora flexìvel com uma estrutura eletricamente condutiva

Info

Publication number
BRPI0418349A
BRPI0418349A BRPI0418349-5A BRPI0418349A BRPI0418349A BR PI0418349 A BRPI0418349 A BR PI0418349A BR PI0418349 A BRPI0418349 A BR PI0418349A BR PI0418349 A BRPI0418349 A BR PI0418349A
Authority
BR
Brazil
Prior art keywords
electrically conductive
flexible carrier
conductive structure
base layer
layer
Prior art date
Application number
BRPI0418349-5A
Other languages
English (en)
Inventor
Andreas Ziegler
Norman D Rr
Werner Hammon
Markus Luethi
Wolfgang Lohwasser
Matthias Rheinhold
Original Assignee
Alcan Tech & Man Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcan Tech & Man Ltd filed Critical Alcan Tech & Man Ltd
Publication of BRPI0418349A publication Critical patent/BRPI0418349A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/08—Flat or ribbon cables
    • H01B7/0861—Flat or ribbon cables comprising one or more screens
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Conductors (AREA)
  • Communication Cables (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

PORTADORA FLEXìVEL COM UMA ESTRUTURA ELETRICAMENTE CONDUTIVA. A presente invenção refere-se a uma portadora flexível (10) consistindo em uma camada de base feita pelo menos uma estrutura conutiva (20) que é impressa pelo menos na camada de base (12) com uma tinta eletricamente condutiva em um de seus lados.pelo menos uma camada eletricamente condutiva (20) é disposta entre a camada de base (12) e pelo menos uma camada de cobertura (14) feita de plástico e cada uma das opcionalmente outras estruturas eletricamente condutivas (22) é respectivamente disposta entre duas sucessivas outras camadas de cobertura.A camada de base 12 é conectada a pelo menos uma camada de cobertura (14) cada uma das opcionalmente outras camadas de cobertura é conectada às camadas de cobertura adjacentes.
BRPI0418349-5A 2004-01-05 2004-12-17 portadora flexìvel com uma estrutura eletricamente condutiva BRPI0418349A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP04405004A EP1551037A1 (de) 2004-01-05 2004-01-05 Flexibler Träger mit elektrisch leitfähiger Struktur
PCT/EP2004/014390 WO2006048041A1 (de) 2004-01-05 2004-12-17 Flexibler träger mit elektrisch leitfähiger struktur

Publications (1)

Publication Number Publication Date
BRPI0418349A true BRPI0418349A (pt) 2007-05-02

Family

ID=34560281

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0418349-5A BRPI0418349A (pt) 2004-01-05 2004-12-17 portadora flexìvel com uma estrutura eletricamente condutiva

Country Status (8)

Country Link
US (1) US20070151748A1 (pt)
EP (2) EP1551037A1 (pt)
JP (1) JP2007518222A (pt)
BR (1) BRPI0418349A (pt)
CA (1) CA2552217A1 (pt)
RU (1) RU2361377C2 (pt)
TW (1) TW200534759A (pt)
WO (1) WO2006048041A1 (pt)

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JP4901141B2 (ja) * 2005-06-22 2012-03-21 鷹羽産業株式会社 ケーブル及びその製造方法
KR101442276B1 (ko) * 2006-10-24 2014-09-22 파나소닉 주식회사 프린트 배선판, 프린트 배선판의 제조 방법, 및 전기 기기
DE102007023935B4 (de) * 2007-05-23 2009-05-20 Sukalo, Drazenko, Dipl.-Ing. Elektrokabel mit optimierter Propagationszeit zur Signalübertragung
CA2736086A1 (en) * 2008-09-03 2010-03-11 Usg Interiors, Inc. Electrically conductive element, system, and method of manufacturing
WO2010028007A2 (en) * 2008-09-03 2010-03-11 Usg Interiors, Inc. Electrically conductive tape for walls and ceilings
RU2390978C1 (ru) * 2008-09-15 2010-05-27 Игорь Валерьевич Реутов Способ формирования проводящих дорожек в пористой полимерной пленке
KR101130697B1 (ko) * 2010-05-07 2012-04-02 삼성전자주식회사 복수 층의 신축성 배선
GB2482860A (en) * 2010-07-28 2012-02-22 In2Tec Ltd Flexible twisted-pair wiring system
CN102223752B (zh) * 2011-06-02 2013-07-24 宝利时(深圳)胶粘制品有限公司 一种多层柔性线路板及其制作方法
RU2536861C1 (ru) * 2013-09-10 2014-12-27 Открытое акционерное общество "Научно-производственное объединение "СПЛАВ" Гибкий печатный кабель и способ его изготовления
RU2606392C2 (ru) * 2015-05-13 2017-01-10 Открытое акционерное общество "Научно-производственное объединение "СПЛАВ" Печатный кабель
JP7098394B2 (ja) * 2018-04-13 2022-07-11 矢崎総業株式会社 アンテナユニット
CZ308701B6 (cs) * 2019-05-14 2021-03-03 Univerzita Pardubice Velkoplošný senzor pro indikaci obsazenosti skladovacích, výstavních nebo prodejních polic
KR102895043B1 (ko) * 2021-08-25 2025-12-02 주식회사 엘지에너지솔루션 연결 와이어 및 이를 포함하는 전지팩

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US3206541A (en) * 1963-04-29 1965-09-14 Gen Cable Corp Sheathed electrical cable
US3761842A (en) * 1972-06-01 1973-09-25 Bell Telephone Labor Inc Twisted pair flat conductor cable with means to equalize impedance and propagation velocity
JPS52126220A (en) * 1976-04-14 1977-10-22 Kimoto Kk Dry image forming material and method of forming image
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Also Published As

Publication number Publication date
US20070151748A1 (en) 2007-07-05
JP2007518222A (ja) 2007-07-05
RU2361377C2 (ru) 2009-07-10
TW200534759A (en) 2005-10-16
WO2006048041A1 (de) 2006-05-11
CA2552217A1 (en) 2006-05-11
EP1551037A1 (de) 2005-07-06
EP1704572A1 (de) 2006-09-27
RU2006128425A (ru) 2008-02-27

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Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]