BRPI0508204A - método de remoção de depósitos de uma superfìcie - Google Patents

método de remoção de depósitos de uma superfìcie

Info

Publication number
BRPI0508204A
BRPI0508204A BRPI0508204-8A BRPI0508204A BRPI0508204A BR PI0508204 A BRPI0508204 A BR PI0508204A BR PI0508204 A BRPI0508204 A BR PI0508204A BR PI0508204 A BRPI0508204 A BR PI0508204A
Authority
BR
Brazil
Prior art keywords
deposits
removing deposits
remote
fluorocarbon
manufacture
Prior art date
Application number
BRPI0508204-8A
Other languages
English (en)
Portuguese (pt)
Inventor
Herbert Harold Sawin
Bo Bai
Original Assignee
Massachusetts Inst Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Massachusetts Inst Technology filed Critical Massachusetts Inst Technology
Publication of BRPI0508204A publication Critical patent/BRPI0508204A/pt

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32798Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853Hygiene
    • H01J37/32862In situ cleaning of vessels and/or internal parts
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4405Cleaning of reactor or parts inside the reactor by using reactive gases
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F4/00Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02CCAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
    • Y02C20/00Capture or disposal of greenhouse gases
    • Y02C20/30Capture or disposal of greenhouse gases of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • ing And Chemical Polishing (AREA)
BRPI0508204-8A 2004-03-24 2005-03-24 método de remoção de depósitos de uma superfìcie BRPI0508204A (pt)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US55622704P 2004-03-24 2004-03-24
US64044404P 2004-12-30 2004-12-30
US64083304P 2004-12-30 2004-12-30
PCT/US2005/010691 WO2005095670A2 (fr) 2004-03-24 2005-03-24 Procedes d'elimination de depots de surface par enceinte a distance

Publications (1)

Publication Number Publication Date
BRPI0508204A true BRPI0508204A (pt) 2007-07-17

Family

ID=34965582

Family Applications (3)

Application Number Title Priority Date Filing Date
BRPI0508204-8A BRPI0508204A (pt) 2004-03-24 2005-03-24 método de remoção de depósitos de uma superfìcie
BRPI0508214-5A BRPI0508214A (pt) 2004-03-24 2005-03-24 métodos de remoção de depósitos de superfìcie
BRPI0508205-6A BRPI0508205A (pt) 2004-03-24 2005-03-24 métodos de remoção de depósitos de superfìcie

Family Applications After (2)

Application Number Title Priority Date Filing Date
BRPI0508214-5A BRPI0508214A (pt) 2004-03-24 2005-03-24 métodos de remoção de depósitos de superfìcie
BRPI0508205-6A BRPI0508205A (pt) 2004-03-24 2005-03-24 métodos de remoção de depósitos de superfìcie

Country Status (6)

Country Link
EP (3) EP1733071A2 (fr)
JP (3) JP2007531288A (fr)
KR (3) KR20070043697A (fr)
BR (3) BRPI0508204A (fr)
TW (3) TWI284929B (fr)
WO (3) WO2005095670A2 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0697467A1 (fr) * 1994-07-21 1996-02-21 Applied Materials, Inc. Procédé et dispositif de nettoyage d'une chambre de dépÔt
US7581549B2 (en) * 2004-07-23 2009-09-01 Air Products And Chemicals, Inc. Method for removing carbon-containing residues from a substrate
TW200718479A (en) * 2005-08-02 2007-05-16 Massachusetts Inst Technology Method of using sulfur fluoride for removing surface deposits
US9034199B2 (en) 2012-02-21 2015-05-19 Applied Materials, Inc. Ceramic article with reduced surface defect density and process for producing a ceramic article
US9212099B2 (en) 2012-02-22 2015-12-15 Applied Materials, Inc. Heat treated ceramic substrate having ceramic coating and heat treatment for coated ceramics
CN104853855B (zh) * 2012-12-18 2020-07-24 海星化学有限公司 用于薄膜沉积反应器和薄膜层的原位干式清洁的过程和方法
JP6202423B2 (ja) * 2013-03-05 2017-09-27 パナソニックIpマネジメント株式会社 プラズマクリーニング方法およびプラズマクリーニング装置
US9850568B2 (en) 2013-06-20 2017-12-26 Applied Materials, Inc. Plasma erosion resistant rare-earth oxide based thin film coatings
US10109496B2 (en) * 2013-12-30 2018-10-23 The Chemours Company Fc, Llc Chamber cleaning and semiconductor etching gases
SG11202106864TA (en) * 2018-12-25 2021-07-29 Showa Denko Kk Adhesion removal method and film-forming method
US11854773B2 (en) 2020-03-31 2023-12-26 Applied Materials, Inc. Remote plasma cleaning of chambers for electronics manufacturing systems
EP3954804A1 (fr) * 2020-08-14 2022-02-16 Siltronic AG Dispositif et procédé de dépôt d'une couche de matière semi-conductrice sur un substrat en tranche
CN116145106B (zh) * 2023-02-21 2024-12-24 苏州鼎芯光电科技有限公司 一种用于半导体镀膜工艺腔室的清洁方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5158644A (en) * 1986-12-19 1992-10-27 Applied Materials, Inc. Reactor chamber self-cleaning process
JP2002280376A (ja) * 2001-03-22 2002-09-27 Research Institute Of Innovative Technology For The Earth Cvd装置のクリーニング方法およびそのためのクリーニング装置

Also Published As

Publication number Publication date
KR20070040748A (ko) 2007-04-17
WO2005090638A9 (fr) 2006-01-26
JP2007531288A (ja) 2007-11-01
WO2005095670A2 (fr) 2005-10-13
WO2005098086A3 (fr) 2006-05-04
WO2005095670A3 (fr) 2006-05-04
TWI281715B (en) 2007-05-21
TW200623251A (en) 2006-07-01
EP1733072A2 (fr) 2006-12-20
JP2007530792A (ja) 2007-11-01
KR20070037434A (ko) 2007-04-04
KR20070043697A (ko) 2007-04-25
WO2005090638A8 (fr) 2006-11-16
BRPI0508214A (pt) 2007-07-17
WO2005098086A2 (fr) 2005-10-20
EP1733071A2 (fr) 2006-12-20
WO2005090638A3 (fr) 2006-04-13
TWI284929B (en) 2007-08-01
TWI281714B (en) 2007-05-21
TW200623281A (en) 2006-07-01
TW200623240A (en) 2006-07-01
JP2007531289A (ja) 2007-11-01
BRPI0508205A (pt) 2007-07-17
WO2005090638A2 (fr) 2005-09-29
EP1737998A2 (fr) 2007-01-03

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 5A E 6A ANUIDADE(S).

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE A 8.6 NA RPI 2099 DE 29/03/2011.