BRPI0510332A - processo para a produção de contatos transversais em estruturas de placas de circuitos impressos - Google Patents
processo para a produção de contatos transversais em estruturas de placas de circuitos impressosInfo
- Publication number
- BRPI0510332A BRPI0510332A BRPI0510332-0A BRPI0510332A BRPI0510332A BR PI0510332 A BRPI0510332 A BR PI0510332A BR PI0510332 A BRPI0510332 A BR PI0510332A BR PI0510332 A BRPI0510332 A BR PI0510332A
- Authority
- BR
- Brazil
- Prior art keywords
- circuit board
- printed circuit
- support element
- holes
- board structures
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 3
- 229910052802 copper Inorganic materials 0.000 abstract 3
- 239000010949 copper Substances 0.000 abstract 3
- 150000002500 ions Chemical class 0.000 abstract 2
- 239000004642 Polyimide Substances 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 229920001721 polyimide Polymers 0.000 abstract 1
- 238000005507 spraying Methods 0.000 abstract 1
- 239000007858 starting material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Electric Cable Installation (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
Abstract
PROCESSO PARA A PRODUçãO DE CONTATOS TRANSVERSAIS EM ESTRUTURAS DE PLACAS DE CIRCUITOS IMPRESSOS. A presente invenção refere-se a um processo para a produção de estruturas de placas de circuitos impressos, que, entre outras, também podem ser concretizadas sem adesivo, flexíveis e com contatos transversais muito pequenos com diâmetros na ordem de grandeza de 1 a 3 <109>m. O processo refere-se a um meio de suporte para a estrutura de placa de circuitos impressos, que ainda se encontra sem revestimento de cobre. No material assim preparado são produzidos os furos com ajuda de íons pesados especialmente para os contatos transversais muito pequenos. Em seguida, ocorre o revestimento de cobre do meio de suporte. Nesse caso, ao mesmo tempo, são produzidos os contatos transversais elétricos. Se o meio de suporte for poliimida flexível, por exemplo, e ainda não tiver sido tratado previamente para o revestimento com cobre, então especialmente o método de íons pesados também poderá ser empregado, além de produzir os furos para tomar ásperas as superfícies. Em seguida, completa-se a desejada estrutura de placa de circuitos impressos conforme os métodos convencionais.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102004021063 | 2004-04-29 | ||
| PCT/EP2005/050918 WO2005107348A1 (de) | 2004-04-29 | 2005-03-02 | Verfahren zur herstellung von durchkontaktierungen bei leiterplattengebilden |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0510332A true BRPI0510332A (pt) | 2007-10-23 |
Family
ID=34962647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0510332-0A BRPI0510332A (pt) | 2004-04-29 | 2005-03-02 | processo para a produção de contatos transversais em estruturas de placas de circuitos impressos |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20070220745A1 (pt) |
| EP (1) | EP1754399B1 (pt) |
| JP (1) | JP2007535154A (pt) |
| KR (1) | KR20070004929A (pt) |
| CN (1) | CN1961621A (pt) |
| AT (1) | ATE385399T1 (pt) |
| BR (1) | BRPI0510332A (pt) |
| DE (1) | DE502005002731D1 (pt) |
| WO (1) | WO2005107348A1 (pt) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7918018B2 (en) * | 2007-06-12 | 2011-04-05 | Texas Instruments Incorporated | Method of fabricating a semiconductor device |
| FR2927218B1 (fr) | 2008-02-06 | 2010-03-05 | Hydromecanique & Frottement | Procede de fabrication d'un element chauffant par depot de couches minces sur un substrat isolant et l'element obtenu |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3562009A (en) * | 1967-02-14 | 1971-02-09 | Western Electric Co | Method of providing electrically conductive substrate through-holes |
| US6153060A (en) * | 1999-08-04 | 2000-11-28 | Honeywell International Inc. | Sputtering process |
| US20020000370A1 (en) * | 1999-08-04 | 2002-01-03 | Richard J. Pommer | Ion processing of a substrate |
| JP3879816B2 (ja) * | 2000-06-02 | 2007-02-14 | セイコーエプソン株式会社 | 半導体装置及びその製造方法、積層型半導体装置、回路基板並びに電子機器 |
| US6629348B2 (en) * | 2001-05-01 | 2003-10-07 | Oak-Mitsui, Inc. | Substrate adhesion enhancement to film |
| DE10234614B3 (de) * | 2002-07-24 | 2004-03-04 | Fractal Ag | Verfahren zur Bearbeitung von Trägermaterial durch Schwerionenbestrahlung und nachfolgenden Ätzprozess |
-
2005
- 2005-03-02 BR BRPI0510332-0A patent/BRPI0510332A/pt not_active IP Right Cessation
- 2005-03-02 AT AT05729754T patent/ATE385399T1/de not_active IP Right Cessation
- 2005-03-02 KR KR1020067022684A patent/KR20070004929A/ko not_active Withdrawn
- 2005-03-02 US US11/568,495 patent/US20070220745A1/en not_active Abandoned
- 2005-03-02 DE DE502005002731T patent/DE502005002731D1/de not_active Expired - Lifetime
- 2005-03-02 JP JP2007510003A patent/JP2007535154A/ja active Pending
- 2005-03-02 CN CNA2005800135671A patent/CN1961621A/zh active Pending
- 2005-03-02 WO PCT/EP2005/050918 patent/WO2005107348A1/de not_active Ceased
- 2005-03-02 EP EP05729754A patent/EP1754399B1/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CN1961621A (zh) | 2007-05-09 |
| EP1754399A1 (de) | 2007-02-21 |
| KR20070004929A (ko) | 2007-01-09 |
| DE502005002731D1 (de) | 2008-03-20 |
| JP2007535154A (ja) | 2007-11-29 |
| US20070220745A1 (en) | 2007-09-27 |
| ATE385399T1 (de) | 2008-02-15 |
| EP1754399B1 (de) | 2008-01-30 |
| WO2005107348A1 (de) | 2005-11-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE AS 5A, 6A E 7A ANUIDADES. |
|
| B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2158 DE 15/05/2012. |