ATE482609T1 - Herstellungsverfahren für eine starr-flexible leiterplatte, brett das für ein solches verfahren benutzt wird, und damit verbundenen leiterplatte und elektrischer gegenstand - Google Patents

Herstellungsverfahren für eine starr-flexible leiterplatte, brett das für ein solches verfahren benutzt wird, und damit verbundenen leiterplatte und elektrischer gegenstand

Info

Publication number
ATE482609T1
ATE482609T1 AT08290744T AT08290744T ATE482609T1 AT E482609 T1 ATE482609 T1 AT E482609T1 AT 08290744 T AT08290744 T AT 08290744T AT 08290744 T AT08290744 T AT 08290744T AT E482609 T1 ATE482609 T1 AT E482609T1
Authority
AT
Austria
Prior art keywords
circuit board
substrate
rigid
flexible
board
Prior art date
Application number
AT08290744T
Other languages
English (en)
Inventor
Jean-Marc Degottex
Olivier Belnoue
Original Assignee
Beauce Realisations Et Etudes
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beauce Realisations Et Etudes filed Critical Beauce Realisations Et Etudes
Application granted granted Critical
Publication of ATE482609T1 publication Critical patent/ATE482609T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09127—PCB or component having an integral separable or breakable part
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
AT08290744T 2007-07-31 2008-07-31 Herstellungsverfahren für eine starr-flexible leiterplatte, brett das für ein solches verfahren benutzt wird, und damit verbundenen leiterplatte und elektrischer gegenstand ATE482609T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0705604A FR2919781A1 (fr) 2007-07-31 2007-07-31 Procede de fabrication d'un circuit imprime semi-flexible, plaque utilisee pour un tel procede, circuit imprime et dispositif electronique associes

Publications (1)

Publication Number Publication Date
ATE482609T1 true ATE482609T1 (de) 2010-10-15

Family

ID=39166402

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08290744T ATE482609T1 (de) 2007-07-31 2008-07-31 Herstellungsverfahren für eine starr-flexible leiterplatte, brett das für ein solches verfahren benutzt wird, und damit verbundenen leiterplatte und elektrischer gegenstand

Country Status (4)

Country Link
EP (1) EP2020833B1 (de)
AT (1) ATE482609T1 (de)
DE (1) DE602008002655D1 (de)
FR (1) FR2919781A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200053887A1 (en) 2018-08-09 2020-02-13 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Mechanically Robust Component Carrier With Rigid and Flexible Portions
JP7025376B2 (ja) * 2019-06-17 2022-02-24 矢崎総業株式会社 バスバモジュール
CN112654153B (zh) * 2020-11-12 2023-07-25 惠州市金百泽电路科技有限公司 一种测控设备高精度光波标尺pcb的加工方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2914336A1 (de) * 1979-04-09 1980-11-06 Telefonbau & Normalzeit Gmbh Verfahren zur herstellung starr- flexibler leiterplatten
DE2946726C2 (de) * 1979-11-20 1982-05-19 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Leiterplatte mit starren und flexiblen Bereichen und Verfahren zu deren Herstellung
DE3318717C1 (de) * 1983-05-21 1984-05-30 Grundig E.M.V. Elektro-Mechanische Versuchsanstalt Max Grundig & Co KG, 8510 Fürth Verfahren zum Herstellen von Leiterplatten mit starren und flexiblen Bereichen
DE3417223C2 (de) * 1984-05-10 1986-04-10 Hans 6052 Mühlheim Keller Verfahren und Vorrichtung zum paßgenauen Lochen von Filmen bei der Herstellung einer gedruckten Schaltung auf einer gebohrten Rohplatte
DE3434672C2 (de) * 1984-09-21 1986-09-11 Fa. Carl Freudenberg, 6940 Weinheim Verfahren zur Herstellung von flexiblen Leiterplatten für hohe Biegebeanspruchung
CH667359A5 (de) * 1985-03-27 1988-09-30 Ppc Electronic Ag Verfahren zur herstellung einer starre und flexible partien aufweisenden leiterplatte fuer gedruckte elektrische schaltungen.
DE4003344C1 (de) * 1990-02-05 1991-06-13 Fa. Carl Freudenberg, 6940 Weinheim, De
DE4206746C1 (en) * 1992-03-04 1993-06-24 Degussa Ag, 6000 Frankfurt, De Manufacture of circuit board with rigid and flexible sections - has flexible sections created by having non-bonding insert of insulation broken away
DE4208610C1 (en) * 1992-03-18 1993-05-19 Fa. Carl Freudenberg, 6940 Weinheim, De Rigid-flexible PCB with flexible circuit foil mfg. - having flexible PCB in flexible region with fracture lines in rigid outer layers along rigid-flexible transition allowing rigid part to be removed along fracture lines after processing
US5499444A (en) * 1994-08-02 1996-03-19 Coesen, Inc. Method of manufacturing a rigid flex printed circuit board
JP3427011B2 (ja) * 1999-07-19 2003-07-14 日本メクトロン株式会社 可撓性多層回路基板の製造法
US7371970B2 (en) * 2002-12-06 2008-05-13 Flammer Jeffrey D Rigid-flex circuit board system
FR2871336B1 (fr) 2004-06-02 2007-01-19 Bree Ind Soc Par Actions Simpl Circuit imprime flex-rigide par collage
FR2871334B1 (fr) 2004-06-03 2008-03-28 Bree Beauce Realisations Et Et Circuit imprime semi-flexible
KR20070112274A (ko) * 2005-03-15 2007-11-22 씨-코어 테크놀로지즈, 인코포레이티드 인쇄배선기판 내에 억제 코어 재료를 구성하는 방법
US7234230B1 (en) * 2005-12-27 2007-06-26 Gold Circuit Electronics Ltd. Composite circuit board and method for manufacturing the same

Also Published As

Publication number Publication date
EP2020833A1 (de) 2009-02-04
DE602008002655D1 (de) 2010-11-04
EP2020833B1 (de) 2010-09-22
FR2919781A1 (fr) 2009-02-06

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Legal Events

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