BRPI0513646A - dispositivo eletrÈnico e método de formar contato - Google Patents

dispositivo eletrÈnico e método de formar contato

Info

Publication number
BRPI0513646A
BRPI0513646A BRPI0513646-6A BRPI0513646A BRPI0513646A BR PI0513646 A BRPI0513646 A BR PI0513646A BR PI0513646 A BRPI0513646 A BR PI0513646A BR PI0513646 A BRPI0513646 A BR PI0513646A
Authority
BR
Brazil
Prior art keywords
electronic device
contact
electrical contact
forming contact
electrically coupled
Prior art date
Application number
BRPI0513646-6A
Other languages
English (en)
Inventor
Brad Benson
Frank J Bretl
Ellen L Chappell
Jeffery M Igelman
Steve H Zhang
Original Assignee
Hewlett Packard Development Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co filed Critical Hewlett Packard Development Co
Publication of BRPI0513646A publication Critical patent/BRPI0513646A/pt
Publication of BRPI0513646B1 publication Critical patent/BRPI0513646B1/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14491—Electrical connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Resistors (AREA)
  • Adjustable Resistors (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

DISPOSITIVO ELETRÈNICO E MéTODO DE FORMAR CONTATO Dispositivo eletrónico (500) compreende um substrato (510) e um contato elétrico (520) em contato com a camada dielétrica (544) e eletricamente acoplado a pelo menos um resistor (518), um suporte de substrato (540) incluindo trilha elétrica (542) eletricamente acoplada com contato elétrico (520), um polímero (524) envolvendo o contato elétrico (520), e um filme substancialmente plano (528) disposto sobre o contato elétrico (520).
BRPI0513646-6A 2004-08-06 2005-07-22 "Dispositivo de ejeção de fluido, método de fabricação do mesmo e cartucho de jato de tinta" BRPI0513646B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/913,101 US7475964B2 (en) 2004-08-06 2004-08-06 Electrical contact encapsulation
US10/913,101 2004-08-06
PCT/US2005/025991 WO2006020345A2 (en) 2004-08-06 2005-07-22 Electrical contact encapsulation

Publications (2)

Publication Number Publication Date
BRPI0513646A true BRPI0513646A (pt) 2008-05-13
BRPI0513646B1 BRPI0513646B1 (pt) 2018-05-15

Family

ID=35405415

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0513646-6A BRPI0513646B1 (pt) 2004-08-06 2005-07-22 "Dispositivo de ejeção de fluido, método de fabricação do mesmo e cartucho de jato de tinta"

Country Status (7)

Country Link
US (1) US7475964B2 (pt)
EP (1) EP1786627B1 (pt)
JP (1) JP2008511130A (pt)
CN (1) CN101001754B (pt)
BR (1) BRPI0513646B1 (pt)
MX (1) MX2007001370A (pt)
WO (1) WO2006020345A2 (pt)

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US9724920B2 (en) 2013-03-20 2017-08-08 Hewlett-Packard Development Company, L.P. Molded die slivers with exposed front and back surfaces
JP6238617B2 (ja) * 2013-07-24 2017-11-29 キヤノン株式会社 液体吐出ヘッドおよび液体吐出装置
US10421274B2 (en) 2014-01-28 2019-09-24 Hewlett-Packard Devleopment Company. L.P. Printbars and methods of forming printbars
US10008739B2 (en) 2015-02-23 2018-06-26 Front Edge Technology, Inc. Solid-state lithium battery with electrolyte
JP6806457B2 (ja) 2016-04-05 2021-01-06 キヤノン株式会社 液体吐出ヘッドおよび液体吐出ヘッドの製造方法
US10957886B2 (en) 2018-03-14 2021-03-23 Front Edge Technology, Inc. Battery having multilayer protective casing
JP7207942B2 (ja) * 2018-10-23 2023-01-18 キヤノン株式会社 液体吐出ヘッド
JP2020116792A (ja) * 2019-01-22 2020-08-06 東芝テック株式会社 液体吐出ヘッド、及び液体吐出装置
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Also Published As

Publication number Publication date
WO2006020345A3 (en) 2006-10-26
WO2006020345A2 (en) 2006-02-23
EP1786627A2 (en) 2007-05-23
JP2008511130A (ja) 2008-04-10
CN101001754B (zh) 2010-09-01
MX2007001370A (es) 2007-04-10
BRPI0513646B1 (pt) 2018-05-15
US7475964B2 (en) 2009-01-13
EP1786627B1 (en) 2011-06-01
US20060027937A1 (en) 2006-02-09
CN101001754A (zh) 2007-07-18

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Legal Events

Date Code Title Description
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]
B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 17A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2680 DE 17-05-2022 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.