BRPI0513669A - método para formação de fissura intermediária em substrato e equipamento para formação de fissura intermediária em substrato - Google Patents

método para formação de fissura intermediária em substrato e equipamento para formação de fissura intermediária em substrato

Info

Publication number
BRPI0513669A
BRPI0513669A BRPI0513669-5A BRPI0513669A BRPI0513669A BR PI0513669 A BRPI0513669 A BR PI0513669A BR PI0513669 A BRPI0513669 A BR PI0513669A BR PI0513669 A BRPI0513669 A BR PI0513669A
Authority
BR
Brazil
Prior art keywords
substrate
intermediate crack
crack formation
crack
forming
Prior art date
Application number
BRPI0513669-5A
Other languages
English (en)
Inventor
Koji Yamamoto
Noboru Hasaka
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of BRPI0513669A publication Critical patent/BRPI0513669A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Plasma & Fusion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
  • Liquid Crystal (AREA)

Abstract

MéTODO PARA FORMAçãO DE FISSURA INTERMEDIáRIA EM SUBSTRATO E EQUIPAMENTO PARA FORMAçãO DE FISSURA INTERMEDIáRIA EM SUBSTRATO São providos, um método para formação de uma fissura intermediária e um equipamento para formação de uma fissura intermediária, onde é possível a formação de uma fissura intermediária profunda e reta, e uma excelente superfície rompida de um substrato frágil pode ser obtida como resultado da ruptura. No método para formação de uma fissura intermediária em um substrato frágil, o substrato frágil é irradiado com um feixe de laser ao longo de uma linha de inscrição a laser a ser formada com fissuras intermediárias no substrato frágil de modo a ser aquecido até uma temperatura não superior á sua temperatura de fusão e, dessa forma, a fissura intermediária é criada ao longo da linha de inscrição a laser a ser formada com fissuras intermediárias e expandida a partir de uma incisão que foi formada no substrato frágil; este método para formação de uma fissura intermediária em um substrato frágil é caracterizado pelo fato de que porções de alta temperatura que recebem intensa radiação de um feixe de laser e porções de baixa temperatura que recebem fraca radiação de um feixe de laser são alternadamente formadas ao longo da linha de inscrição a laser a ser formada com fissuras intermediárias.
BRPI0513669-5A 2004-07-30 2005-07-29 método para formação de fissura intermediária em substrato e equipamento para formação de fissura intermediária em substrato BRPI0513669A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004247570 2004-07-30
PCT/JP2005/013980 WO2006011608A1 (ja) 2004-07-30 2005-07-29 基板の垂直クラック形成方法および垂直クラック形成装置

Publications (1)

Publication Number Publication Date
BRPI0513669A true BRPI0513669A (pt) 2008-05-13

Family

ID=35786352

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0513669-5A BRPI0513669A (pt) 2004-07-30 2005-07-29 método para formação de fissura intermediária em substrato e equipamento para formação de fissura intermediária em substrato

Country Status (12)

Country Link
US (1) US7723212B2 (pt)
EP (1) EP1772245B1 (pt)
JP (1) JP4916312B2 (pt)
KR (1) KR101193874B1 (pt)
CN (1) CN101001729B (pt)
BR (1) BRPI0513669A (pt)
MX (1) MX2007001159A (pt)
RU (1) RU2007107398A (pt)
SG (1) SG156607A1 (pt)
TW (1) TW200607772A (pt)
WO (1) WO2006011608A1 (pt)
ZA (1) ZA200700824B (pt)

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KR101479707B1 (ko) 2012-04-18 2015-01-07 이화여자대학교 산학협력단 크랙 제어에 의한 박막 패터닝 방법 및 그 박막 패터닝 구조물
US9455229B2 (en) * 2012-04-27 2016-09-27 Namiki Seimitsu Houseki Kabushiki Kaisha Composite substrate manufacturing method, semiconductor element manufacturing method, composite substrate, and semiconductor element
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Also Published As

Publication number Publication date
CN101001729A (zh) 2007-07-18
TWI378904B (pt) 2012-12-11
JP4916312B2 (ja) 2012-04-11
TW200607772A (en) 2006-03-01
SG156607A1 (en) 2009-11-26
EP1772245A4 (en) 2011-02-02
CN101001729B (zh) 2011-03-23
KR101193874B1 (ko) 2012-10-26
JPWO2006011608A1 (ja) 2008-05-01
WO2006011608A1 (ja) 2006-02-02
US7723212B2 (en) 2010-05-25
RU2007107398A (ru) 2008-09-10
US20080194079A1 (en) 2008-08-14
MX2007001159A (es) 2007-09-25
ZA200700824B (en) 2009-05-27
EP1772245A1 (en) 2007-04-11
EP1772245B1 (en) 2014-05-07
KR20070043866A (ko) 2007-04-25

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Legal Events

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B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 4A, 5A E 6A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2158 DE 15/05/2012.