BRPI0515713A - estrutura de semicondutor, método para formar um dispositivo semicondutor e dispositivo de ejeção de fluido - Google Patents

estrutura de semicondutor, método para formar um dispositivo semicondutor e dispositivo de ejeção de fluido

Info

Publication number
BRPI0515713A
BRPI0515713A BRPI0515713-7A BRPI0515713A BRPI0515713A BR PI0515713 A BRPI0515713 A BR PI0515713A BR PI0515713 A BRPI0515713 A BR PI0515713A BR PI0515713 A BRPI0515713 A BR PI0515713A
Authority
BR
Brazil
Prior art keywords
semiconductor
forming
fluid ejection
semiconductor structure
ejection device
Prior art date
Application number
BRPI0515713-7A
Other languages
English (en)
Inventor
Simon Dodd
Jonathan S Wang
Dennis W Tom
Frank R Bryant
Terry E Mcmahon
Richard Todd Miller
Gregory T Hindman
Original Assignee
Hewlett Packard Development Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co filed Critical Hewlett Packard Development Co
Publication of BRPI0515713A publication Critical patent/BRPI0515713A/pt
Publication of BRPI0515713B1 publication Critical patent/BRPI0515713B1/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14088—Structure of heating means
    • B41J2/14112—Resistive element
    • B41J2/14129—Layer structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/13—Heads having an integrated circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Thin Film Transistor (AREA)

Abstract

"ESTRUTURA DE SEMICONDUTOR, MéTODO PARA FORMAR UM DISPOSITIVO SEMICONDUTOR E DISPOSITIVO DE EJEçãO DE FLUIDO". Uma estrutura de semicondutor (5), dispositivo de ejeção de fluido, e métodos para fabricar os mesmos são providos, tais que um contato com um substrato (10) seja formado a partir de uma camada condutiva (30).
BRPI0515713-7A 2004-09-28 2005-09-21 Estrutura de semicondutor, método para formar um dispositivo semicondutor e dispositivo de ejeção de fluido BRPI0515713B1 (pt)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US61387104P 2004-09-28 2004-09-28
US60/613,871 2004-09-28
US10/977,091 2004-10-29
US10/977,091 US7150516B2 (en) 2004-09-28 2004-10-29 Integrated circuit and method for manufacturing
PCT/US2005/034030 WO2006036751A2 (en) 2004-09-28 2005-09-21 Integrated circuit and method for manufacturing

Publications (2)

Publication Number Publication Date
BRPI0515713A true BRPI0515713A (pt) 2008-07-29
BRPI0515713B1 BRPI0515713B1 (pt) 2018-02-14

Family

ID=35962146

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0515713-7A BRPI0515713B1 (pt) 2004-09-28 2005-09-21 Estrutura de semicondutor, método para formar um dispositivo semicondutor e dispositivo de ejeção de fluido

Country Status (15)

Country Link
US (2) US7150516B2 (pt)
EP (1) EP1805022B1 (pt)
KR (1) KR101133791B1 (pt)
CN (1) CN101031426B (pt)
AU (1) AU2005289781B2 (pt)
BR (1) BRPI0515713B1 (pt)
CA (1) CA2581938C (pt)
ES (1) ES2723713T3 (pt)
HU (1) HUE044227T2 (pt)
IL (1) IL181708A (pt)
MX (1) MX2007003615A (pt)
PL (1) PL1805022T3 (pt)
RU (1) RU2378122C2 (pt)
TW (2) TWI328875B (pt)
WO (1) WO2006036751A2 (pt)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070296767A1 (en) * 2006-06-27 2007-12-27 Anderson Frank E Micro-Fluid Ejection Devices with a Polymeric Layer Having an Embedded Conductive Material
WO2009108201A1 (en) * 2008-02-28 2009-09-03 Hewlett-Packard Development Company, L.P. Semiconductor substrate contact via
MD353Z (ro) * 2010-02-24 2011-10-31 Институт Электронной Инженерии И Промышленных Технологий Ventil supraconductor de spin
US20140073106A1 (en) 2012-09-12 2014-03-13 International Business Machines Corporation Lateral bipolar transistor and cmos hybrid technology
US9704944B2 (en) * 2013-02-28 2017-07-11 Texas Instruments Deutschland Gmbh Three precision resistors of different sheet resistance at same level
WO2018072822A1 (en) * 2016-10-19 2018-04-26 Sicpa Holding Sa Method for forming thermal inkjet printhead, thermal inkjet printhead, and semiconductor wafer
JP7186540B2 (ja) * 2018-08-06 2022-12-09 キヤノン株式会社 液体吐出ヘッド用基板、液体吐出ヘッド、および、液体吐出装置
US11581399B2 (en) 2020-06-30 2023-02-14 Texas Instruments Incorporated Gate implant for reduced resistance temperature coefficient variability

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4719477A (en) * 1986-01-17 1988-01-12 Hewlett-Packard Company Integrated thermal ink jet printhead and method of manufacture
US4732801A (en) * 1986-04-30 1988-03-22 International Business Machines Corporation Graded oxide/nitride via structure and method of fabrication therefor
US5122812A (en) * 1991-01-03 1992-06-16 Hewlett-Packard Company Thermal inkjet printhead having driver circuitry thereon and method for making the same
US5314841A (en) * 1993-04-30 1994-05-24 International Business Machines Corporation Method of forming a frontside contact to the silicon substrate of a SOI wafer
US5635968A (en) 1994-04-29 1997-06-03 Hewlett-Packard Company Thermal inkjet printer printhead with offset heater resistors
US5587604A (en) 1994-09-22 1996-12-24 International Business Machines Corporation Contacted body silicon-on-insulator field effect transistor
US5710070A (en) 1996-11-08 1998-01-20 Chartered Semiconductor Manufacturing Pte Ltd. Application of titanium nitride and tungsten nitride thin film resistor for thermal ink jet technology
US5985766A (en) 1997-02-27 1999-11-16 Micron Technology, Inc. Semiconductor processing methods of forming a contact opening
US6286939B1 (en) * 1997-09-26 2001-09-11 Hewlett-Packard Company Method of treating a metal surface to increase polymer adhesion
CN1116985C (zh) * 1998-06-30 2003-08-06 财团法人工业技术研究院 喷墨印头晶片的制造方法
US6372639B1 (en) 1999-08-31 2002-04-16 Micron Technology, Inc. Method for constructing interconnects for sub-micron semiconductor devices and the resulting semiconductor devices
US6498381B2 (en) 2001-02-22 2002-12-24 Tru-Si Technologies, Inc. Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same
US6883894B2 (en) 2001-03-19 2005-04-26 Hewlett-Packard Development Company, L.P. Printhead with looped gate transistor structures
JP3503611B2 (ja) * 2001-04-13 2004-03-08 ソニー株式会社 プリンタヘッド、プリンタ及びプリンタヘッドの製造方法
US7067416B2 (en) 2001-08-29 2006-06-27 Micron Technology, Inc. Method of forming a conductive contact
US6555915B1 (en) 2001-10-22 2003-04-29 Motorola, Inc. Integrated circuit having interconnect to a substrate and method therefor
US6740536B2 (en) * 2001-10-26 2004-05-25 Hewlett-Packard Develpment Corporation, L.P. Devices and methods for integrated circuit manufacturing
KR100438709B1 (ko) 2001-12-18 2004-07-05 삼성전자주식회사 잉크 젯 프린트 헤드
US20030136999A1 (en) 2002-01-18 2003-07-24 Hodges Robert L. Semiconductor device with deposited oxide
US6559047B1 (en) 2002-01-24 2003-05-06 National Semiconductor Corporation Method of forming a metal interconnect that substantially reduces the formation of intermetallic residue regions
US6982474B2 (en) 2002-06-25 2006-01-03 Amberwave Systems Corporation Reacted conductive gate electrodes
US20040012449A1 (en) 2002-07-16 2004-01-22 Illegems Paul F. Ring oscillator with frequency stabilization
US6885083B2 (en) 2002-10-31 2005-04-26 Hewlett-Packard Development Company, L.P. Drop generator die processing
TW571441B (en) * 2002-12-31 2004-01-11 Ind Tech Res Inst Metal oxide semiconductor field effect transistor used in high-density device and manufacturing method of the same

Also Published As

Publication number Publication date
PL1805022T3 (pl) 2019-09-30
AU2005289781A1 (en) 2006-04-06
CN101031426A (zh) 2007-09-05
US20070026548A1 (en) 2007-02-01
KR101133791B1 (ko) 2012-04-05
EP1805022B1 (en) 2019-03-20
RU2007116108A (ru) 2008-11-10
CA2581938C (en) 2014-02-11
MX2007003615A (es) 2007-06-13
CA2581938A1 (en) 2006-04-06
WO2006036751A2 (en) 2006-04-06
US7543917B2 (en) 2009-06-09
US7150516B2 (en) 2006-12-19
IL181708A0 (en) 2007-07-04
HUE044227T2 (hu) 2019-10-28
IL181708A (en) 2011-02-28
US20060071281A1 (en) 2006-04-06
AU2005289781B2 (en) 2010-09-16
BRPI0515713B1 (pt) 2018-02-14
RU2378122C2 (ru) 2010-01-10
ES2723713T3 (es) 2019-08-30
WO2006036751A3 (en) 2006-06-22
TW200618289A (en) 2006-06-01
TW200729499A (en) 2007-08-01
KR20070059184A (ko) 2007-06-11
EP1805022A2 (en) 2007-07-11
TWI328875B (en) 2010-08-11
TWI283924B (en) 2007-07-11
CN101031426B (zh) 2011-07-06

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Legal Events

Date Code Title Description
B15K Others concerning applications: alteration of classification

Ipc: H01L 23/31 (2006.01), H01L 21/00 (2006.01), B41J 2

B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]
B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 20A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2846 DE 22-07-2025 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.