BRPI0517384A - solda sem chumbo, e, métodos de preparar a mesma, e de soldar - Google Patents

solda sem chumbo, e, métodos de preparar a mesma, e de soldar

Info

Publication number
BRPI0517384A
BRPI0517384A BRPI0517384-1A BRPI0517384A BRPI0517384A BR PI0517384 A BRPI0517384 A BR PI0517384A BR PI0517384 A BRPI0517384 A BR PI0517384A BR PI0517384 A BRPI0517384 A BR PI0517384A
Authority
BR
Brazil
Prior art keywords
welding
preparing
methods
unleaded
tin
Prior art date
Application number
BRPI0517384-1A
Other languages
English (en)
Inventor
Kaihwa Chew
Vincent Yue Sern Kho
Original Assignee
Quantum Chem Tech Singapore
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Quantum Chem Tech Singapore filed Critical Quantum Chem Tech Singapore
Publication of BRPI0517384A publication Critical patent/BRPI0517384A/pt
Publication of BRPI0517384B1 publication Critical patent/BRPI0517384B1/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Silicates, Zeolites, And Molecular Sieves (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Glass Compositions (AREA)
  • Silicon Compounds (AREA)
  • Powder Metallurgy (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Fats And Perfumes (AREA)
  • Detergent Compositions (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

SOLDA SEM CHUMBO, E, METODOS DE PREPARAR A MESMA, E DE SOLDAR. é descrita uma solda sem chumbo, compreendendo de cerca de 96,8 % a cerca de 99,3 % de estanho, de 0,2 % a 3,0 % de cobre, de 0,02 % a cerca de 0,12 % de silício e opcionalmente 0,005 % a 0,01 % de P e/ou 0,0005 %-0,01 de Ge.
BRPI0517384-1A 2004-10-27 2005-08-26 Without lead BRPI0517384B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0423860.6 2004-10-27
GB0423860A GB2406101C (en) 2004-10-27 2004-10-27 Improvements in ro relating to solders
PCT/GB2005/003338 WO2006045995A1 (en) 2004-10-27 2005-08-26 Improvements in or relating to solders

Publications (2)

Publication Number Publication Date
BRPI0517384A true BRPI0517384A (pt) 2008-10-07
BRPI0517384B1 BRPI0517384B1 (pt) 2017-06-27

Family

ID=33515637

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0517384-1A BRPI0517384B1 (pt) 2004-10-27 2005-08-26 Without lead

Country Status (17)

Country Link
US (2) US20060088439A1 (pt)
EP (1) EP1815034B1 (pt)
JP (1) JP4048288B2 (pt)
KR (1) KR100886768B1 (pt)
CN (1) CN100497693C (pt)
AT (1) ATE417941T1 (pt)
AU (1) AU2005298466B2 (pt)
BR (1) BRPI0517384B1 (pt)
DE (1) DE602005011848D1 (pt)
DK (1) DK1815034T3 (pt)
GB (1) GB2406101C (pt)
IL (1) IL180932A (pt)
MX (1) MX2007003369A (pt)
MY (1) MY136213A (pt)
NO (1) NO333370B1 (pt)
RU (1) RU2356975C2 (pt)
WO (1) WO2006045995A1 (pt)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8308053B2 (en) 2005-08-31 2012-11-13 Micron Technology, Inc. Microfeature workpieces having alloyed conductive structures, and associated methods
US7629249B2 (en) 2006-08-28 2009-12-08 Micron Technology, Inc. Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods
CN103008903A (zh) * 2007-08-14 2013-04-03 株式会社爱科草英 无铅焊料组合物及使用它的印刷电路板与电子器件
CN101848787B (zh) * 2007-08-14 2013-10-23 株式会社爱科草英 无铅焊料组合物及使用它的印刷电路板与电子器件
CN102123820A (zh) * 2007-08-24 2011-07-13 株式会社东芝 接合用组合物
CN101554684A (zh) * 2009-05-19 2009-10-14 广州瀚源电子科技有限公司 一种无铅焊料的减渣方法
RU2441736C1 (ru) * 2010-11-24 2012-02-10 Открытое акционерное общество "Всероссийский институт легких сплавов" (ОАО "ВИЛС") Припой для пайки алюминия и его сплавов
JP6008101B2 (ja) * 2012-08-11 2016-10-19 千住金属工業株式会社 電力用はんだ
AU2015254179B2 (en) 2014-04-30 2017-07-20 Nihon Superior Co., Ltd. Lead-free solder alloy
RU2584357C1 (ru) * 2014-11-26 2016-05-20 Открытое акционерное общество "Композит" (ОАО "Композит") Припой для пайки алюминия и его сплавов
BE1025771B1 (nl) * 2017-12-14 2019-07-08 Metallo Belgium Verbeterde koperproductiewerkwijze

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FR2612035B1 (fr) * 1987-03-03 1989-05-26 Loire Electronique Machine de soudage a l'etain avec pare-vague automatique, pour cartes a circuit imprime
TW251249B (pt) * 1993-04-30 1995-07-11 At & T Corp
JP3107483B2 (ja) * 1993-07-13 2000-11-06 日本アルミット株式会社 無ないし低含鉛半田合金
US5410184A (en) * 1993-10-04 1995-04-25 Motorola Microelectronic package comprising tin-copper solder bump interconnections, and method for forming same
US5520752A (en) * 1994-06-20 1996-05-28 The United States Of America As Represented By The Secretary Of The Army Composite solders
JPH0970687A (ja) * 1995-07-04 1997-03-18 Toyota Central Res & Dev Lab Inc 無鉛はんだ合金
WO1997009455A1 (en) 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
JP3874031B2 (ja) 1995-11-29 2007-01-31 内橋エステック株式会社 無鉛はんだ合金
KR980006783A (ko) 1996-05-13 1998-03-30 이. 힐러 윌리엄 저가의 위상 고정 모터 제어 방법 및 구조
JPH1071488A (ja) * 1996-08-29 1998-03-17 Mitsui Mining & Smelting Co Ltd 錫−銀系半田合金
KR19980068127A (ko) * 1997-02-15 1998-10-15 김광호 납땜용 무연 합금
JPH10314980A (ja) 1997-05-14 1998-12-02 Sony Corp はんだ材料
JP3719624B2 (ja) * 1997-06-07 2005-11-24 内橋エステック株式会社 電子部品実装用はんだ及び電子部品の実装方法
JPH11221694A (ja) 1998-02-06 1999-08-17 Hitachi Ltd 鉛フリーはんだを用いた実装構造体およびそれを用いた実装方法
CN1168571C (zh) * 1998-03-26 2004-09-29 斯比瑞尔社股份有限公司 无铅软钎焊料合金
JP2000141078A (ja) 1998-09-08 2000-05-23 Nippon Sheet Glass Co Ltd 無鉛ハンダ
JP2000153388A (ja) * 1998-09-14 2000-06-06 Murata Mfg Co Ltd はんだ付け物品
WO2000018536A1 (en) 1998-09-30 2000-04-06 Matsushita Electric Industrial Co., Ltd. Soldering material and electric/electronic device using the same
JP2000326088A (ja) * 1999-03-16 2000-11-28 Nippon Sheet Glass Co Ltd 無鉛ハンダ
JP3753168B2 (ja) 1999-08-20 2006-03-08 千住金属工業株式会社 微小チップ部品接合用ソルダペースト
JP2001071173A (ja) * 1999-09-06 2001-03-21 Ishikawa Kinzoku Kk 無鉛はんだ
JP2002248596A (ja) * 2001-02-27 2002-09-03 Toshiba Tungaloy Co Ltd 耐酸化性に優れる鉛レス半田ボール
JP2002373824A (ja) * 2001-04-11 2002-12-26 Miura Gokin Kogyosho:Kk 金属化プラスチックフィルムコンデンサの外部電極用無鉛合金
TW592872B (en) * 2001-06-28 2004-06-21 Senju Metal Industry Co Lead-free solder alloy
SG139507A1 (en) * 2001-07-09 2008-02-29 Quantum Chem Tech Singapore Improvements in or relating to solders
TW504427B (en) * 2001-09-25 2002-10-01 Honeywell Int Inc Composition, methods and devices for high temperature lead-free solder
KR100366131B1 (ko) * 2001-11-21 2002-12-31 이재옥 드로스 발생이 적은 저융점 무연땜납
RU2219030C1 (ru) * 2002-05-27 2003-12-20 Открытое акционерное общество "ГАЗ" Припой для низкотемпературной пайки
US7282175B2 (en) * 2003-04-17 2007-10-16 Senju Metal Industry Co., Ltd. Lead-free solder
GB2431412B (en) * 2005-10-24 2009-10-07 Alpha Fry Ltd Lead-free solder alloy

Also Published As

Publication number Publication date
US20060088439A1 (en) 2006-04-27
WO2006045995A1 (en) 2006-05-04
GB2406101A (en) 2005-03-23
IL180932A0 (en) 2007-07-04
KR20070049229A (ko) 2007-05-10
BRPI0517384B1 (pt) 2017-06-27
RU2356975C2 (ru) 2009-05-27
CN100497693C (zh) 2009-06-10
JP2006123001A (ja) 2006-05-18
AU2005298466A1 (en) 2006-05-04
GB2406101C (en) 2007-09-11
HK1105668A1 (en) 2008-02-22
GB2406101A8 (en) 2005-11-07
CN101080505A (zh) 2007-11-28
EP1815034A1 (en) 2007-08-08
US7472817B2 (en) 2009-01-06
MY136213A (en) 2008-08-29
RU2007116722A (ru) 2008-12-10
NO333370B1 (no) 2013-05-13
WO2006045995A8 (en) 2007-04-12
IL180932A (en) 2013-03-24
JP4048288B2 (ja) 2008-02-20
GB0423860D0 (en) 2004-12-01
EP1815034B1 (en) 2008-12-17
KR100886768B1 (ko) 2009-03-04
GB2406101B (en) 2006-08-02
DE602005011848D1 (de) 2009-01-29
ATE417941T1 (de) 2009-01-15
NO20072097L (no) 2007-06-06
DK1815034T3 (da) 2009-04-06
MX2007003369A (es) 2008-03-05
US20070125834A1 (en) 2007-06-07
AU2005298466B2 (en) 2008-11-20

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Legal Events

Date Code Title Description
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 9A ANUIDADE.

B08H Application fees: decision cancelled [chapter 8.8 patent gazette]

Free format text: REFERENTE AO DESPACHO PUBLICADO NA RPI 2268 DE 24/06/2014.

B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]