BRPI0606592A2 - composição de moldagem estabilizada termicamente - Google Patents

composição de moldagem estabilizada termicamente

Info

Publication number
BRPI0606592A2
BRPI0606592A2 BRPI0606592-9A BRPI0606592A BRPI0606592A2 BR PI0606592 A2 BRPI0606592 A2 BR PI0606592A2 BR PI0606592 A BRPI0606592 A BR PI0606592A BR PI0606592 A2 BRPI0606592 A2 BR PI0606592A2
Authority
BR
Brazil
Prior art keywords
polyamide
molding composition
thermoplastic
composition
thermally stabilized
Prior art date
Application number
BRPI0606592-9A
Other languages
English (en)
Inventor
Wilhelmus Josephus Maria Sour
Robert Hendrik Catharina Janssen
Rudy Rulkens
Pieter Gijsman
Original Assignee
Dsm Ip Assets Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34937991&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=BRPI0606592(A2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Dsm Ip Assets Bv filed Critical Dsm Ip Assets Bv
Publication of BRPI0606592A2 publication Critical patent/BRPI0606592A2/pt
Publication of BRPI0606592B1 publication Critical patent/BRPI0606592B1/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/014—Stabilisers against oxidation, heat, light or ozone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/005—Stabilisers against oxidation, heat, light, ozone

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

COMPOSIçãO DE MOLDAGEM ESTABILIZADA TERMICAMENTE. A presente invenção refere-se a uma composição de moldagem termoplástica termoestabilizada compreendendo (a) uma composição de poliamida termoplástica, consistindo de uma mistura de pelo menos duas poliamidas compreendendo: (a.1) pelo menos 50% em massa relativa à massa total de uma composição de poliamida termoplástica de uma primeira poliamida (PA-1), sendo uma poliamida semicristalina possuindo um ponto de fusão Tm-1, ou sendo uma poliamida amorfa que possui uma temperatura de transição vítrea Tg-1, em que a Tm-1 e a Tg-1 juntamente são denotadas como sendo T-1; e T-1 sendo pelo menos 2000°C (a.2) uma segunda poliamida (PA-2) com uma razão C/N de no máximo 7, sendo uma poliamida semicristalina que possui um ponto de fusão de Tm-2 ou uma poliamida amorfa que possui uma temperatura de transição vítrea Tg-2, em que Tm-2 e Tg-2 conjuntamente são denotadas como T-2; T-2 é pelo menos 200°C mais baixa que T-1, (b) um sistema de estabilização compreendendo um termoestabilizador selecionado a partir de um grupo que compreende termoestabilizador fenólico, fosfito orgânico, aminas aromáticas, sais metálicos de elementos do Grupo IB, IIB, III e IV da Tabela Periádica e haletos metálicos de metais alcalinos e alcalinos terrosos e combinações destes, and (c)um óxido metálico, ou um sal deste, de um elemento de metal de transição dos Grupos VB, VIB, VIIB e VIIIB da Tabela Periádica, ou uma mistura destes.
BRPI0606592A 2005-01-17 2006-01-12 composição de moldagem termoplástica termoestabilizada, uso de óxido metálico, ou sal deste, de elemento metálico de transição do grupo vb, vib, viib e viiib da tabela periódica, ou mistura destes, uso da referida composição, processo para preparação de parte moldada, parte moldada e uso de parte moldada BRPI0606592B1 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05075077A EP1681313A1 (en) 2005-01-17 2005-01-17 Heat stabilized moulding composition
PCT/EP2006/000235 WO2006074934A1 (en) 2005-01-17 2006-01-12 Heat stabilized moulding composition

Publications (2)

Publication Number Publication Date
BRPI0606592A2 true BRPI0606592A2 (pt) 2009-07-07
BRPI0606592B1 BRPI0606592B1 (pt) 2017-02-21

Family

ID=34937991

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0606592A BRPI0606592B1 (pt) 2005-01-17 2006-01-12 composição de moldagem termoplástica termoestabilizada, uso de óxido metálico, ou sal deste, de elemento metálico de transição do grupo vb, vib, viib e viiib da tabela periódica, ou mistura destes, uso da referida composição, processo para preparação de parte moldada, parte moldada e uso de parte moldada

Country Status (11)

Country Link
US (2) US8772394B2 (pt)
EP (2) EP1681313A1 (pt)
JP (2) JP5247152B2 (pt)
KR (2) KR101362572B1 (pt)
CN (2) CN102766327A (pt)
AT (1) ATE397643T1 (pt)
BR (1) BRPI0606592B1 (pt)
DE (1) DE602006001395D1 (pt)
EA (1) EA011324B1 (pt)
TW (1) TWI411635B (pt)
WO (1) WO2006074934A1 (pt)

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Also Published As

Publication number Publication date
CN102766327A (zh) 2012-11-07
JP5247152B2 (ja) 2013-07-24
ATE397643T1 (de) 2008-06-15
BRPI0606592B1 (pt) 2017-02-21
US20080146717A1 (en) 2008-06-19
EA200701526A1 (ru) 2008-02-28
US8969460B2 (en) 2015-03-03
KR101362572B1 (ko) 2014-02-13
EP1681313A1 (en) 2006-07-19
US8772394B2 (en) 2014-07-08
EP1846506B1 (en) 2008-06-04
EP1846506B2 (en) 2018-02-21
KR20130079616A (ko) 2013-07-10
CN101107320B (zh) 2012-08-15
WO2006074934A1 (en) 2006-07-20
JP2013079387A (ja) 2013-05-02
DE602006001395D1 (de) 2008-07-17
TW200632010A (en) 2006-09-16
EA011324B1 (ru) 2009-02-27
EP1846506A1 (en) 2007-10-24
JP2008527129A (ja) 2008-07-24
KR20070095951A (ko) 2007-10-01
TWI411635B (zh) 2013-10-11
US20140275385A1 (en) 2014-09-18
CN101107320A (zh) 2008-01-16
KR101385870B1 (ko) 2014-04-17

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