BRPI0705679A - composição de resina absorvente de luz, moldagem de resina absorvente de luz, e, método para fabricar uma moldagem de resina absorvente de luz - Google Patents
composição de resina absorvente de luz, moldagem de resina absorvente de luz, e, método para fabricar uma moldagem de resina absorvente de luzInfo
- Publication number
- BRPI0705679A BRPI0705679A BRPI0705679-6A BRPI0705679A BRPI0705679A BR PI0705679 A BRPI0705679 A BR PI0705679A BR PI0705679 A BRPI0705679 A BR PI0705679A BR PI0705679 A BRPI0705679 A BR PI0705679A
- Authority
- BR
- Brazil
- Prior art keywords
- light absorbing
- absorbing resin
- resin molding
- resin composition
- light
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
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- B29C65/1677—Laser beams making use of an absorber or impact modifier
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
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- B29C66/73117—Tg, i.e. glass transition temperature
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
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Abstract
COMPOSIçãO DE RESINA ABSORVENTE DE LUZ, MOLDAGEM DE RESINA ABSORVENTE DE LUZ, E, MéTODO PARA FABRICAR UMA MOLDAGEM DE RESINA ABSORVENTE DE LUZ A presente invenção diz respeito a uma composição de resina absorvente de luz para soldagem a laser por meio da qual transparência pode ser mantida e é possível uma soldagem a laser estável. A composição de resina absorvente de luz para soldagem a laser inclui uma resina e nanopartículas absorventes de luz laser, em que as nanopartículas absorventes de luz laser são nanopartículas de óxido de tungstênio indicadas pela fórmula geral W~ y~O~ z~, e/ou nanopartículas de óxido de tungstênio compósito indicadas pela fórmula geral M~ x~W~ y~O~ z~.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006316351A JP4853710B2 (ja) | 2006-11-22 | 2006-11-22 | レーザー溶着用光吸収樹脂組成物及び光吸収樹脂成形体、並びに光吸収樹脂成形体の製造方法 |
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| BRPI0705679A true BRPI0705679A (pt) | 2008-07-15 |
| BRPI0705679B1 BRPI0705679B1 (pt) | 2018-05-08 |
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| US (1) | US8318051B2 (pt) |
| EP (1) | EP1925427B1 (pt) |
| JP (1) | JP4853710B2 (pt) |
| KR (1) | KR100932809B1 (pt) |
| CN (1) | CN101186739B (pt) |
| AU (1) | AU2007234533B2 (pt) |
| BR (1) | BRPI0705679B1 (pt) |
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| KR20080046575A (ko) | 2008-05-27 |
| JP4853710B2 (ja) | 2012-01-11 |
| BRPI0705679B1 (pt) | 2018-05-08 |
| AU2007234533B2 (en) | 2009-12-24 |
| CN101186739B (zh) | 2012-05-30 |
| EP1925427B1 (en) | 2020-01-22 |
| AU2007234533A1 (en) | 2008-06-05 |
| EP1925427A1 (en) | 2008-05-28 |
| JP2008127511A (ja) | 2008-06-05 |
| US20080116426A1 (en) | 2008-05-22 |
| US8318051B2 (en) | 2012-11-27 |
| CN101186739A (zh) | 2008-05-28 |
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| B03A | Publication of a patent application or of a certificate of addition of invention [chapter 3.1 patent gazette] | ||
| B07A | Application suspended after technical examination (opinion) [chapter 7.1 patent gazette] | ||
| B06A | Patent application procedure suspended [chapter 6.1 patent gazette] | ||
| B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
| B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |