BRPI0717763A2 - Processo para formar contatos elétricos para um aparelho emissor de luz de semicondutor, estrutura de semicondutor para uso em um aparelho emissor de luz de semicondutor, e, aparelho emissor de luz de semicondutor - Google Patents
Processo para formar contatos elétricos para um aparelho emissor de luz de semicondutor, estrutura de semicondutor para uso em um aparelho emissor de luz de semicondutor, e, aparelho emissor de luz de semicondutorInfo
- Publication number
- BRPI0717763A2 BRPI0717763A2 BRPI0717763-1A2A BRPI0717763A BRPI0717763A2 BR PI0717763 A2 BRPI0717763 A2 BR PI0717763A2 BR PI0717763 A BRPI0717763 A BR PI0717763A BR PI0717763 A2 BRPI0717763 A2 BR PI0717763A2
- Authority
- BR
- Brazil
- Prior art keywords
- semiconductor light
- semiconductor
- electrical contacts
- forming electrical
- light
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 4
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
- H10H20/8312—Electrodes characterised by their shape extending at least partially through the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/550,488 US7842963B2 (en) | 2006-10-18 | 2006-10-18 | Electrical contacts for a semiconductor light emitting apparatus |
| PCT/IB2007/054250 WO2008047325A2 (en) | 2006-10-18 | 2007-10-18 | Electrical contacts for a semiconductor light emitting apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0717763A2 true BRPI0717763A2 (pt) | 2013-10-22 |
Family
ID=39203811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0717763-1A2A BRPI0717763A2 (pt) | 2006-10-18 | 2007-10-18 | Processo para formar contatos elétricos para um aparelho emissor de luz de semicondutor, estrutura de semicondutor para uso em um aparelho emissor de luz de semicondutor, e, aparelho emissor de luz de semicondutor |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7842963B2 (pt) |
| EP (1) | EP2082438B1 (pt) |
| JP (1) | JP5457189B2 (pt) |
| CN (1) | CN101595570B (pt) |
| BR (1) | BRPI0717763A2 (pt) |
| TW (1) | TWI459582B (pt) |
| WO (1) | WO2008047325A2 (pt) |
Families Citing this family (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7804022B2 (en) * | 2007-03-16 | 2010-09-28 | Sunpower Corporation | Solar cell contact fingers and solder pad arrangement for enhanced efficiency |
| DE102007022947B4 (de) | 2007-04-26 | 2022-05-05 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen |
| US7939836B2 (en) | 2007-07-18 | 2011-05-10 | Nichia Corporation | Semiconductor light emitting element |
| US8278679B2 (en) * | 2008-04-29 | 2012-10-02 | Tsmc Solid State Lighting Ltd. | LED device with embedded top electrode |
| TWI508321B (zh) * | 2008-07-21 | 2015-11-11 | 相豐科技股份有限公司 | 發光二極體及其形成方法 |
| US8008683B2 (en) * | 2008-10-22 | 2011-08-30 | Samsung Led Co., Ltd. | Semiconductor light emitting device |
| US8202741B2 (en) * | 2009-03-04 | 2012-06-19 | Koninklijke Philips Electronics N.V. | Method of bonding a semiconductor device using a compliant bonding structure |
| DE102009023849B4 (de) * | 2009-06-04 | 2022-10-20 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterkörper und optoelektronischer Halbleiterchip |
| JP2011071339A (ja) * | 2009-09-25 | 2011-04-07 | Toyoda Gosei Co Ltd | 発光素子 |
| TWI470832B (zh) | 2010-03-08 | 2015-01-21 | Lg伊諾特股份有限公司 | 發光裝置 |
| KR101761385B1 (ko) | 2010-07-12 | 2017-08-04 | 엘지이노텍 주식회사 | 발광 소자 |
| JP5333382B2 (ja) * | 2010-08-27 | 2013-11-06 | 豊田合成株式会社 | 発光素子 |
| JP5633477B2 (ja) | 2010-08-27 | 2014-12-03 | 豊田合成株式会社 | 発光素子 |
| US8410515B2 (en) * | 2010-08-31 | 2013-04-02 | Micron Technology, Inc. | Solid state lighting devices with point contacts and associated methods of manufacturing |
| KR101730152B1 (ko) * | 2010-10-06 | 2017-04-25 | 엘지이노텍 주식회사 | 발광 소자 |
| KR20120045919A (ko) | 2010-11-01 | 2012-05-09 | 삼성엘이디 주식회사 | 반도체 발광소자 |
| JP5777879B2 (ja) | 2010-12-27 | 2015-09-09 | ローム株式会社 | 発光素子、発光素子ユニットおよび発光素子パッケージ |
| KR101762324B1 (ko) * | 2011-01-27 | 2017-07-27 | 엘지이노텍 주식회사 | 발광 소자 |
| US8536594B2 (en) * | 2011-01-28 | 2013-09-17 | Micron Technology, Inc. | Solid state lighting devices with reduced dimensions and methods of manufacturing |
| US20140339566A1 (en) * | 2011-12-14 | 2014-11-20 | Seoul Viosys Co., Ltd. | Semiconductor device and method of fabricating the same |
| KR101883842B1 (ko) * | 2011-12-26 | 2018-08-01 | 엘지이노텍 주식회사 | 발광소자 및 이를 포함하는 조명시스템 |
| US9419182B2 (en) * | 2012-01-05 | 2016-08-16 | Micron Technology, Inc. | Solid-state radiation transducer devices having at least partially transparent buried-contact elements, and associated systems and methods |
| TW201336116A (zh) * | 2012-02-24 | 2013-09-01 | Genesis Photonics Inc | 發光二極體元件及覆晶式發光二極體封裝元件 |
| KR101926361B1 (ko) * | 2012-06-13 | 2018-12-07 | 삼성전자주식회사 | 반도체 발광소자, 발광장치 및 반도체 발광소자 제조방법 |
| JP5989420B2 (ja) * | 2012-06-28 | 2016-09-07 | 株式会社東芝 | 半導体発光装置 |
| US9306085B2 (en) | 2012-08-22 | 2016-04-05 | Sunpower Corporation | Radially arranged metal contact fingers for solar cells |
| JP5514274B2 (ja) * | 2012-09-03 | 2014-06-04 | Dowaエレクトロニクス株式会社 | Iii族窒化物半導体発光素子およびその製造方法 |
| DE102013103079A1 (de) * | 2013-03-26 | 2014-10-02 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
| DE102013104192A1 (de) * | 2013-04-25 | 2014-10-30 | Osram Opto Semiconductors Gmbh | Halbleiterbauelement mit einer Zwischenschicht |
| US11329195B2 (en) | 2013-08-27 | 2022-05-10 | Epistar Corporation | Semiconductor light-emitting device |
| US9461209B2 (en) | 2013-11-27 | 2016-10-04 | Epistar Corporation | Semiconductor light-emitting device |
| TWI616004B (zh) * | 2013-11-27 | 2018-02-21 | 晶元光電股份有限公司 | 半導體發光元件 |
| JP6182050B2 (ja) * | 2013-10-28 | 2017-08-16 | 株式会社東芝 | 半導体発光装置 |
| CN104681686A (zh) * | 2013-12-02 | 2015-06-03 | 晶元光电股份有限公司 | 半导体发光元件 |
| TWI552386B (zh) | 2013-12-20 | 2016-10-01 | 新世紀光電股份有限公司 | 半導體發光結構及半導體封裝結構 |
| KR20160037060A (ko) | 2014-09-26 | 2016-04-05 | 서울바이오시스 주식회사 | 발광소자 및 그 제조 방법 |
| JP2017005191A (ja) * | 2015-06-15 | 2017-01-05 | 株式会社東芝 | 半導体発光装置 |
| US10998478B2 (en) * | 2015-08-18 | 2021-05-04 | Lg Innotek Co., Ltd. | Light-emitting element, light-emitting element package comprising light-emitting element, and light-emitting device comprising light-emitting element package |
| USD783548S1 (en) * | 2015-11-05 | 2017-04-11 | Epistar Corporation | Portions of light-emitting device |
| TWI640075B (zh) * | 2017-10-31 | 2018-11-01 | Au Optronics Corporation | 像素發光裝置 |
| KR102656815B1 (ko) * | 2017-12-27 | 2024-04-15 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 반도체 소자 |
| JP6912731B2 (ja) | 2018-07-31 | 2021-08-04 | 日亜化学工業株式会社 | 半導体発光素子 |
| US12166139B2 (en) | 2018-09-28 | 2024-12-10 | Maxeon Solar Pte. Ltd. | Solar cell with wraparound finger |
| JP6844606B2 (ja) * | 2018-12-28 | 2021-03-17 | 日亜化学工業株式会社 | 発光素子及びその製造方法ならびに発光装置 |
| JP7271858B2 (ja) | 2021-03-12 | 2023-05-12 | 日亜化学工業株式会社 | 発光素子 |
| JP7707605B2 (ja) * | 2021-03-29 | 2025-07-15 | セイコーエプソン株式会社 | 発光装置、プロジェクター、およびディスプレイ |
| US20230215984A1 (en) * | 2021-12-01 | 2023-07-06 | Lumileds Llc | Non-segmented u-shaped ubm for shifted luminance |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6307218B1 (en) | 1998-11-20 | 2001-10-23 | Lumileds Lighting, U.S., Llc | Electrode structures for light emitting devices |
| US6828596B2 (en) * | 2002-06-13 | 2004-12-07 | Lumileds Lighting U.S., Llc | Contacting scheme for large and small area semiconductor light emitting flip chip devices |
| TWI220578B (en) * | 2003-09-16 | 2004-08-21 | Opto Tech Corp | Light-emitting device capable of increasing light-emitting active region |
| TWI223457B (en) * | 2004-01-20 | 2004-11-01 | Opto Tech Corp | Light-emitting device to increase the area of active region |
| JP2006066518A (ja) * | 2004-08-25 | 2006-03-09 | Sharp Corp | 半導体発光素子および半導体発光素子の製造方法 |
| KR100631967B1 (ko) * | 2005-02-25 | 2006-10-11 | 삼성전기주식회사 | 플립칩용 질화물 반도체 발광소자 |
| KR100631969B1 (ko) * | 2005-02-28 | 2006-10-11 | 삼성전기주식회사 | 질화물 반도체 발광소자 |
-
2006
- 2006-10-18 US US11/550,488 patent/US7842963B2/en active Active
-
2007
- 2007-10-04 TW TW096137329A patent/TWI459582B/zh active
- 2007-10-18 CN CN2007800389075A patent/CN101595570B/zh active Active
- 2007-10-18 EP EP07826789.5A patent/EP2082438B1/en active Active
- 2007-10-18 BR BRPI0717763-1A2A patent/BRPI0717763A2/pt not_active Application Discontinuation
- 2007-10-18 JP JP2009532948A patent/JP5457189B2/ja active Active
- 2007-10-18 WO PCT/IB2007/054250 patent/WO2008047325A2/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JP5457189B2 (ja) | 2014-04-02 |
| TW200834982A (en) | 2008-08-16 |
| EP2082438B1 (en) | 2015-07-22 |
| WO2008047325A2 (en) | 2008-04-24 |
| CN101595570B (zh) | 2011-09-07 |
| TWI459582B (zh) | 2014-11-01 |
| EP2082438A2 (en) | 2009-07-29 |
| US20080096297A1 (en) | 2008-04-24 |
| WO2008047325A3 (en) | 2008-06-19 |
| US7842963B2 (en) | 2010-11-30 |
| JP2010507246A (ja) | 2010-03-04 |
| CN101595570A (zh) | 2009-12-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B25D | Requested change of name of applicant approved |
Owner name: PHILIPS LUMILEDS LIGHTING COMPANY, LLC (US) , KONI |
|
| B25G | Requested change of headquarter approved |
Owner name: PHILIPS LUMILEDS LIGHTING COMPANY, LLC (US) , KONI |
|
| B07A | Application suspended after technical examination (opinion) [chapter 7.1 patent gazette] | ||
| B09B | Patent application refused [chapter 9.2 patent gazette] | ||
| B09B | Patent application refused [chapter 9.2 patent gazette] |
Free format text: MANTIDO O INDEFERIMENTO UMA VEZ QUE NAO FOI APRESENTADO RECURSO DENTRO DO PRAZO LEGAL |