BRPI0811561A2 - Dispositivo de iluminação e método de iluminação - Google Patents

Dispositivo de iluminação e método de iluminação

Info

Publication number
BRPI0811561A2
BRPI0811561A2 BRPI0811561-3A BRPI0811561A BRPI0811561A2 BR PI0811561 A2 BRPI0811561 A2 BR PI0811561A2 BR PI0811561 A BRPI0811561 A BR PI0811561A BR PI0811561 A2 BRPI0811561 A2 BR PI0811561A2
Authority
BR
Brazil
Prior art keywords
lighting
lighting device
lighting method
Prior art date
Application number
BRPI0811561-3A
Other languages
English (en)
Inventor
Antony Paul Van De Ven
Gerald H Negley
Original Assignee
Cree Led Lighting Solutions
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Led Lighting Solutions filed Critical Cree Led Lighting Solutions
Publication of BRPI0811561A2 publication Critical patent/BRPI0811561A2/pt

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/62—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using mixing chambers, e.g. housings with reflective walls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
BRPI0811561-3A 2007-05-08 2008-05-08 Dispositivo de iluminação e método de iluminação BRPI0811561A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US91659707P 2007-05-08 2007-05-08
US94484807P 2007-06-19 2007-06-19
PCT/US2008/063042 WO2008137983A1 (en) 2007-05-08 2008-05-08 Lighting device and lighting method

Publications (1)

Publication Number Publication Date
BRPI0811561A2 true BRPI0811561A2 (pt) 2015-06-16

Family

ID=39577659

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0811561-3A BRPI0811561A2 (pt) 2007-05-08 2008-05-08 Dispositivo de iluminação e método de iluminação

Country Status (8)

Country Link
US (1) US7744243B2 (pt)
EP (2) EP2458262B1 (pt)
JP (1) JP2010527157A (pt)
KR (1) KR20100020464A (pt)
CN (1) CN101720402B (pt)
BR (1) BRPI0811561A2 (pt)
TW (1) TWI421447B (pt)
WO (1) WO2008137983A1 (pt)

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