BRPI0816741A2 - Plasma à pressão atmosférica - Google Patents

Plasma à pressão atmosférica

Info

Publication number
BRPI0816741A2
BRPI0816741A2 BRPI0816741A BRPI0816741A2 BR PI0816741 A2 BRPI0816741 A2 BR PI0816741A2 BR PI0816741 A BRPI0816741 A BR PI0816741A BR PI0816741 A2 BRPI0816741 A2 BR PI0816741A2
Authority
BR
Brazil
Prior art keywords
plasma
atmospheric pressure
atmospheric
pressure
Prior art date
Application number
Other languages
English (en)
Inventor
Peter Dobbyn
Liam O'neill
Original Assignee
Dow Corning Ireland Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Ireland Ltd filed Critical Dow Corning Ireland Ltd
Publication of BRPI0816741A2 publication Critical patent/BRPI0816741A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/62—Plasma-deposition of organic layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
    • C23C4/134—Plasma spraying
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2202/00—Metallic substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2202/00—Metallic substrate
    • B05D2202/10—Metallic substrate based on Fe
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/08—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/08—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
    • B05D5/083—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface involving the use of fluoropolymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • H05H1/2443—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the plasma fluid flowing through a dielectric tube
    • H05H1/245—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the plasma fluid flowing through a dielectric tube the plasma being activated using internal electrodes

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electromagnetism (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Fluid Mechanics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Plasma Technology (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Chemical Vapour Deposition (AREA)
  • Formation Of Insulating Films (AREA)
  • Coating By Spraying Or Casting (AREA)
BRPI0816741 2007-09-10 2008-09-04 Plasma à pressão atmosférica BRPI0816741A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0717430.3A GB0717430D0 (en) 2007-09-10 2007-09-10 Atmospheric pressure plasma
PCT/EP2008/061716 WO2009034012A2 (en) 2007-09-10 2008-09-04 Atmospheric pressure plasma

Publications (1)

Publication Number Publication Date
BRPI0816741A2 true BRPI0816741A2 (pt) 2015-03-17

Family

ID=38658755

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0816741 BRPI0816741A2 (pt) 2007-09-10 2008-09-04 Plasma à pressão atmosférica

Country Status (10)

Country Link
US (1) US20090068375A1 (pt)
EP (1) EP2185743A2 (pt)
JP (1) JP2010539694A (pt)
KR (1) KR20100108322A (pt)
CN (1) CN101802244B (pt)
BR (1) BRPI0816741A2 (pt)
EA (1) EA201070353A1 (pt)
GB (1) GB0717430D0 (pt)
MX (1) MX2010002634A (pt)
WO (1) WO2009034012A2 (pt)

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EP2702840A1 (en) * 2011-04-27 2014-03-05 Dow Corning France Plasma treatment of substrates
US20130116682A1 (en) * 2011-11-09 2013-05-09 Colorado State University Research Foundation Non-Stick Conductive Coating for Biomedical Applications
WO2013068085A1 (en) 2011-11-09 2013-05-16 Dow Corning France Plasma treatment of substrates
GB2510213A (en) * 2012-08-13 2014-07-30 Europlasma Nv Forming a protective polymer coating on a component
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JP6160498B2 (ja) * 2013-03-08 2017-07-12 住友金属鉱山株式会社 被覆はんだ材料およびその製造方法
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TWI480416B (zh) * 2013-11-20 2015-04-11 Ind Tech Res Inst 大氣電漿前趨物供料裝置
TWI486996B (zh) 2013-12-04 2015-06-01 Ind Tech Res Inst 電漿裝置及電漿裝置的操作方法
TWI488549B (zh) * 2014-03-07 2015-06-11 Azotek Co Ltd 金屬基板及其製作方法
WO2015159371A1 (ja) * 2014-04-15 2015-10-22 住友金属鉱山株式会社 被覆膜、被覆膜の形成方法ならびに発光ダイオードデバイス
TWI548310B (zh) 2014-11-21 2016-09-01 財團法人工業技術研究院 電漿處理之模組化電極裝置
DE102015204753A1 (de) * 2015-03-17 2016-10-20 Tesa Se Niedertemperatur-Plasma-Behandlung
US9685306B2 (en) 2015-06-24 2017-06-20 The Boeing Company Ventilation systems for use with a plasma treatment system
EP3377668B1 (en) * 2015-11-22 2025-05-21 Atmospheric Plasma Solutions, Inc. Method and device for promoting adhesion of metallic surfaces
DE102016102585A1 (de) * 2016-02-15 2017-08-17 Epcos Ag Vorrichtung zur Erzeugung eines Atmosphärendruck-Plasmas
KR101805740B1 (ko) * 2016-05-27 2017-12-07 주식회사 에이피피 가시성 있는 대기압 플라즈마 발생장치
US10478893B1 (en) 2017-01-13 2019-11-19 General Electric Company Additive manufacturing using a selective recoater
TWI598465B (zh) * 2017-01-25 2017-09-11 馗鼎奈米科技股份有限公司 常壓電漿鍍膜裝置
US12198935B2 (en) 2017-03-24 2025-01-14 Axus Technology, Llc Atmospheric plasma in wafer processing system optimization
JP2018204054A (ja) * 2017-05-31 2018-12-27 住友金属鉱山株式会社 金属部材の製造方法、プリント基板の製造方法、金属部材及びプリント基板
CA3014970C (en) * 2017-08-18 2025-12-30 Aureon Energy Ltd. Electrode assembly for plasma generation
JP7009979B2 (ja) * 2017-08-24 2022-01-26 住友金属鉱山株式会社 熱伝導性グリース用表面処理粉末の製造方法および熱伝導性グリース用表面処理粉末
CN108080228B (zh) * 2017-10-26 2021-06-01 中国船舶重工集团公司第七二五研究所 一种线路板防水防腐涂层及其制备方法
US11629860B2 (en) 2018-07-17 2023-04-18 Transient Plasma Systems, Inc. Method and system for treating emissions using a transient pulsed plasma
US11696388B2 (en) * 2019-05-07 2023-07-04 Transient Plasma Systems, Inc. Pulsed non-thermal atmospheric pressure plasma processing system
US12286559B2 (en) * 2019-05-14 2025-04-29 UniversitéLaval Method for plasma deposition of anti-fog coatings
JP7189086B2 (ja) * 2019-06-04 2022-12-13 京セラ株式会社 プラズマ発生装置用部品
EP3848426A1 (en) * 2020-01-07 2021-07-14 Molecular Plasma Group SA Method for altering adhesion properties of a surface by plasma coating
EP3881941A1 (en) * 2020-03-17 2021-09-22 Molecular Plasma Group SA Plasma coating method and apparatus for biological surface modification
PE20230331A1 (es) * 2020-04-13 2023-03-01 Brasilata S/A Embalagens Metalicas Metodo de tratamiento de superficies de laminas metalicas con barniz protector de curado uv
KR102625384B1 (ko) * 2020-09-28 2024-01-16 (주) 플라즈닉스 플라즈마 토치 및 이를 이용하여 대상기체를 처리하는 방법
EP4392214A1 (en) * 2021-08-24 2024-07-03 Edgewell Personal Care Brands, LLC System and method for coating a blade
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Also Published As

Publication number Publication date
EA201070353A1 (ru) 2010-12-30
CN101802244A (zh) 2010-08-11
WO2009034012A2 (en) 2009-03-19
WO2009034012A3 (en) 2010-04-01
CN101802244B (zh) 2012-07-04
US20090068375A1 (en) 2009-03-12
GB0717430D0 (en) 2007-10-24
JP2010539694A (ja) 2010-12-16
KR20100108322A (ko) 2010-10-06
EP2185743A2 (en) 2010-05-19
MX2010002634A (es) 2010-06-02

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 6A E 7A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2343 DE 01-12-2015 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.